Patents Represented by Attorney Wolff Law Offices, PL

Find this attorney in the Justia Lawyer Directory

  • Multilayer circuit board and method for manufacturing the same
    Patent number: 8188375
    Abstract: A multilayer circuit board comprises core layers 101 and 102 made of a core material impregnated with resin, resin layers 111 and 112 interposed between the core layers 101 and 102, a wiring pattern 140 embedded in the resin layers 111 and 112. The core layers 101 and 102 have a thickness of 100 ?m or smaller, whereby the entire board can significantly be thinned. Furthermore, the less strong resin layers 111 and 112 are interposed between the hard core layers 101 and 102, whereby the entire board has increased strength.
    Type: Grant
    Filed: November 22, 2006
    Date of Patent: May 29, 2012
    Assignee: TOK Corporation
    Inventors: Kenichi Kawabata, Takaaki Morita