Abstract: Hot-melt adhesives containing at least one aromatic modified polyethylene and/or polypropylene (co)polymer, a further ethylene or propylene/C4 to C20 alpha-olefin copolymer, and at least one tackifying resin are useful for the adhesive bonding of package and paperboard products.
Type:
Grant
Filed:
June 18, 2007
Date of Patent:
October 21, 2008
Assignee:
Henkel Kommanditgesellschaft Auf Aktien
Inventors:
Gunter Hoffmann, Ralf Grauel, Richard Scholta, Thomas Moeller, Ralf Eberhardt