Patents Represented by Attorney, Agent or Law Firm www.perkinscoie.com
  • Patent number: 7150721
    Abstract: Braces for applying dynamic forces and methods for applying dynamic forces on limbs are disclosed herein. In one embodiment, a brace has an upper frame, a lower frame, a hinge coupling the upper frame to the lower frame, a hydraulic pump, and a bladder. The upper frame is moveable relative to the lower frame. The hydraulic pump is coupled to the hinge, the upper frame or the lower frame. The hydraulic pump generates a fluid flow that flows into and expands the bladder. The bladder is positioned to apply a force to the limb as it expands.
    Type: Grant
    Filed: June 29, 2004
    Date of Patent: December 19, 2006
    Assignee: Thuasne
    Inventor: Guy M. Houser
  • Patent number: 6643281
    Abstract: A highly bandwidth-efficient communications method is disclosed that enables remote stations to synchronize in time and frequency to their serving base station. The invention enables a base station and its remote stations in a cell to synchronize in a noisy environment where signals interfere from other base stations and remote stations in other cells. The base station forms a forward synchronization burst that includes a plurality of tone frequencies arranged in a distinctive orthogonal frequency division multiplexed pattern unique to the base station. The unique pattern enables a remote station to distinguish the base station's bursts from other signals present in a crowded area. The distinctive orthogonal frequency division multiplexed pattern can be a Hadamard code pattern, for example.
    Type: Grant
    Filed: March 5, 1998
    Date of Patent: November 4, 2003
    Assignee: AT&T Wireless Services, Inc.
    Inventor: David James Ryan
  • Patent number: 6480522
    Abstract: A discrete multitone stacked-carrier spread spectrum communication method is based on frequency domain spreading including multiplication of a baseband signal by a set of superimposed, or stacked, complex sinusoid carrier waves. In a preferred embodiment, the spreading involves energizing the bins of a large Fast Fourier transform (FFT). This provides a considerable savings in computational complexity for moderate output FFT sizes. Point-to-multipoint and multipoint-to-multipoint (nodeless) network topologies are possible. A code-nulling method is included for interference cancellation and enhanced signal separation by exploiting the spectral diversity of the various sources. The basic method may be extended to include multielement antenna array nulling methods for interference cancellation and enhanced signal separation using spatial separation. Such methods permit directive and retrodirective transmission systems that adapt or can be adapted to the radio environment.
    Type: Grant
    Filed: November 28, 2000
    Date of Patent: November 12, 2002
    Assignee: AT&T Wireless Services, Inc.
    Inventors: Elliott Hoole, Mary Jesse, Robert G. Mechaley, Jr., David James Ryan, David Stephenson
  • Patent number: 6303010
    Abstract: A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the reactor bowl in contact with the electroplating solution. A contact assembly is spaced from the anode within the reactor bowl. The contact assembly includes a plurality of contacts disposed to contact a peripheral edge of the surface of the workpiece to provide electroplating power to the surface of the workpiece. The contacts execute a wiping action against the surface of the workpiece as the workpiece is brought into engagement therewith The contact assembly also including a barrier disposed interior of the plurality of contacts. The barrier includes a member disposed to engage the surface of the workpiece to assist in isolating the plurality of contacts from the electroplating solution.
    Type: Grant
    Filed: August 31, 1999
    Date of Patent: October 16, 2001
    Assignee: Semitool, Inc.
    Inventors: Daniel J. Woodruff, Kyle M. Hanson, Thomas H. Oberlitner, LinLin Chen, John M. Pedersen, Vladimir Zila
  • Patent number: 6271593
    Abstract: A method and substrate structure for fabricating highly conductive components on microelectronic devices. In one embodiment in accordance with the principles of the present invention, a first dielectric layer is formed over a base layer of a substrate, a second dielectric layer is deposited onto the first dielectric layer, and a third dielectric layer is deposited onto the second dielectric layer. The first, second and third dielectric layers define a dielectric stratum in which the first and second dielectric layers may be selectively etchable from one another so that the second dielectric layer etches at a faster rate than the first layer in the presence of a selective etchant. After the dielectric layers are deposited onto the substrate, a void is etched through the second and third dielectric layers.
    Type: Grant
    Filed: August 27, 1999
    Date of Patent: August 7, 2001
    Assignee: Micron Technology, Inc.
    Inventors: John H. Givens, Richard H. Lane