Patents Represented by Law Firm Wyatt, Gerber, Schoup, Scobey & Badie
  • Patent number: 4712085
    Abstract: A thermistor element for temperature measurement has a thermistor chip in wafer form and thin film electrodes formed on respective principal surfaces of the thermistor chip. The thin film electrodes are formed by evaporation. Lead wires are adhered to the thin film electrodes with heat-resisting conductive material. The assembled members are sealed with glass. The electrodes may be made of two-layer films.
    Type: Grant
    Filed: October 29, 1985
    Date of Patent: December 8, 1987
    Assignee: TDK Corporation
    Inventors: Nobuyuki Miki, Hiroshi Yamaoka, Yoichi Tanaka