Abstract: A method of multi-site testing a batch of semiconductor units using a multi-site automated tester (100). The tester (300) includes a handler (320) coupled to a contactor (330) including a first plurality of contact sites. The method includes the step of loading the first plurality of units into the first plurality of contact sites (201). The first plurality of units are simultaneously tested (202) using a test program to determine bin information for each of the first plurality of units, wherein the bin information defines each of the first plurality units as being a passed unit or a reject unit. The passed units are offloaded from respective contact sites of the first plurality of contact sites to create vacant contact sites (203), while keeping the reject unit(s) at respective contact sites of the first plurality of contact sites. Untested units from the batch are then loaded to fill the vacant contact sites (204).

Abstract: A method (300) for fabricating a lead frame (100), comprising forming a plurality of external leads (122) in a lead frame material (108), plating a metal (222) on all surfaces of the lead frame material (108), and subsequently forming a plurality of internal leads (124) in the lead frame material (108). The lead frame material (108) may comprise of a portion of a contiguous metal sheeting (204) rolled upon a first coil (202), wherein the contiguous metal sheeting (204) is fed into an external lead stamping apparatus (206), thus forming the external leads (122), and rolled onto a second coil (215). The portion is fed into a plating apparatus and plated with the metal (222), and rolled onto a third coil (218) prior to forming the plurality of internal leads (124). The third coil (218) can be unrolled into an internal lead stamping apparatus (226), thus forming the internal leads (124) of a lead frame (100).