Abstract: A method of fabricating a printed wiring board, including the steps of (a) applying a photoresist film to a surface of a printed wiring board and inner surfaces of holes formed with the printed wiring board throughout a thickness thereof, (b) exposing the photoresist film to a light through a mask film and further through a light scattering layer composed of glass beads, and (c) developing and etching the photoresist film to form through-holes throughout the printed wiring board. For instance, the light scattering layer is constituted of two transparent light-transmissive films and a glass bead layer sandwiched between the transparent light-transmissive films. The method enables the inner surfaces of the holes to be sufficiently exposed to a light such as ultraviolet ray, to thereby provide a printed wiring board having fine through-holes.