Patents Represented by Attorney Zea Barlocci & Markvardsen

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  • Method for fabricating package substrate and die spacer layers having a ceramic backbone
    Patent number: 8186051
    Abstract: Methods for fabricating a layer or layers for use in package substrates and die spacers are described. In one implementation the layer or layers are fabricated to include a plurality of ceramic wells lying within a plane and separated by metallic via with recesses within the ceramic wells being occupied by a dielectric filler material.
    Type: Grant
    Filed: March 28, 2008
    Date of Patent: May 29, 2012
    Assignee: Intel Corporation
    Inventors: Aleksandar Aleksov, Vladimir Noveski, Sujit Sharan, Shankar Ganapathysubramanian
  • Cooling solutions for die-down integrated circuit packages
    Patent number: 7755186
    Abstract: Systems for cooling the backside of a semiconductor die located in a die-down integrated circuit (IC) package are described. The IC package is attached to the topside of a printed circuit board (PCB) with the backside of the die residing below the topside surface of the PCB. A cooling plate is attached to the backside of the die and thermally connected to a heat sink located above the topside surface of the PCB via conduits that pass through openings in the PCB.
    Type: Grant
    Filed: December 31, 2007
    Date of Patent: July 13, 2010
    Assignee: Intel Corporation
    Inventors: Chia-Pin Chiu, Ioan Sauciuc