Patents Assigned to 21TH CENTURY CO., LTD
  • Patent number: 11938568
    Abstract: Proposed is a method of processing a superfine blade edge using a femtosecond laser, the method including primarily grinding a blade edge portion by using a grinding wheel, the blade edge being primarily ground in a direction vertical to a rotational direction of the grinding wheel; and secondarily grinding at least a part of the blade edge portion by emitting a femtosecond laser to the ground blade edge portion in a lengthwise direction, wherein the secondarily grinding includes: oscillating the femtosecond laser; modifying the energy distribution of the femtosecond laser; aligning a central portion of the energy distribution of the femtosecond laser to an end portion of the blade edge portion; changing an advancing direction of the femtosecond laser; and emitting the femtosecond laser to the blade edge portion while moving, in the lengthwise direction of the blade, a stage on which the blade is placed.
    Type: Grant
    Filed: May 22, 2019
    Date of Patent: March 26, 2024
    Assignee: 21 TH CENTURY CO., LTD
    Inventor: Sung Hwan Kim
  • Patent number: 10964489
    Abstract: An upper mold for MLCC lamination comprising: a vacuum head comprising a first area formed by a plurality of base holes, which communicate with an air channel formed on the upper surface, and by through-holes that connect the lower surface and respective base holes so as to communicate with each other such that air flows between the base holes and the lower surface, the first area having a predetermined area, and the vacuum head comprising a second area configured, thereby suctioning air; a mesh plate fixed to the lower surface of the vacuum head to have a size corresponding to that of the first area, the mesh plate having a porous structure such that, when air flows through the through-holes of the first area, suction and discharge can occur evenly; and a contact plate fixed to the lower surface of the vacuum head by adhesion of the second area.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: March 30, 2021
    Assignee: 21TH CENTURY CO., LTD
    Inventor: Sung Hwan Kim