Patents Assigned to 2PAI SEMICONDUCTOR CO., LTD.
  • Patent number: 11431302
    Abstract: An isolation circuit and a method for providing isolation between two dies are provided. The isolation circuit includes: an isolation module, configured to generate an isolation signal based on an input signal from a first die and to provide isolation between the first die and a second die, where the isolation signal is smaller than the input signal in amplitude, and the first die is coupled with the second die; a latch module, configured to latch the isolation signal at a certain level and output a latched signal; an amplifier module, configured to amplify the latched signal. In the isolation circuit, a modulation module and a demodulation module can be saved.
    Type: Grant
    Filed: September 18, 2020
    Date of Patent: August 30, 2022
    Assignee: 2PAI SEMICONDUCTOR CO., LTD.
    Inventor: Zhiwei Dong