Patents Assigned to 3 Sigma Corporation
  • Package reclosure system and method
    Patent number: 6436500
    Abstract: This invention relates to a system and method for reclosing a package. A package reclosure is provided with a top layer having a perforation and a carrier substrate. A folded substrate or folded member is provided between the carrier substrate and top layer. The folded member is only secured to the top layer such that, when the perforation is torn, a portion of the folded member may be unfolded to reveal a repositionable adhesive which is used to retain an end of the package in a closed position.
    Type: Grant
    Filed: October 27, 2000
    Date of Patent: August 20, 2002
    Assignee: 3 Sigma Corporation
    Inventors: Kenneth Ralph Yingst, Paul Reid Benson