Abstract: A laser processing system includes a laser beam source that produces a raw laser beam; a beam expansion system that receives the raw laser beam and produces an expanded laser beam; a homogenization system that receives the expanded laser beam and produces a laser beam that is homogenized and has a line-shaped beam cross section in the processing plane, wherein the homogenization system includes a first homogenization arrangement that homogenizes along the short axis and a second homogenization arrangement for homogenization along the long axis, each of the homogenization arrangements includes optical elements that split the laser beam into a multiplicity of partial beams and a condenser system that superposes the partial beams in a superposition plane, and the first homogenization arrangement includes a first condenser system with at least one first mirror and the second homogenization arrangement includes a second condenser system with at least one second mirror.

Abstract: A laser processing system includes a laser beam source that produces a raw laser beam; a beam expansion system that receives the raw laser beam and produces an expanded laser beam; a homogenization system that receives the expanded laser beam and produces a laser beam that is homogenized and has a line-shaped beam cross section in the processing plane, wherein the homogenization system includes a first homogenization arrangement that homogenizes along the short axis and a second homogenization arrangement for homogenization along the long axis, each of the homogenization arrangements includes optical elements that split the laser beam into a multiplicity of partial beams and a condenser system that superposes the partial beams in a superposition plane, and the first homogenization arrangement includes a first condenser system with at least one first mirror and the second homogenization arrangement includes a second condenser system with at least one second mirror.

Abstract: A method of producing microelectronic components includes forming a functional layer system; applying a laminar carrier to the functional layer system; attaching a workpiece to a workpiece carrier; utilizing incident radiation of a laser beam is focused in a boundary region between a growth substrate and the functional layer system, and a bond between the growth substrate and the functional layer system in the boundary region is weakened or destroyed; separating a functional layer stack from the growth substrate, wherein a vacuum gripper having a sealing zone that circumferentially encloses an inner region is applied to the reverse side of the growth substrate, a negative pressure is generated in the inner region such that separation of the functional layer stack from the growth substrate is initiated in the inner region; and the growth substrate held on the vacuum gripper is removed from the functional layer stack.

Abstract: A method of producing microelectronic components includes forming a functional layer system; applying a laminar carrier to the functional layer system; attaching a workpiece to a workpiece carrier; utilizing incident radiation of a laser beam is focused in a boundary region between a growth substrate and the functional layer system, and a bond between the growth substrate and the functional layer system in the boundary region is weakened or destroyed; separating a functional layer stack from the growth substrate, wherein a vacuum gripper having a sealing zone that circumferentially encloses an inner region is applied to the reverse side of the growth substrate, a negative pressure is generated in the inner region such that separation of the functional layer stack from the growth substrate is initiated in the inner region; and the growth substrate held on the vacuum gripper is removed from the functional layer stack.

Abstract: A method produces a structured element by machining a workpiece with pulsed laser radiation, the workpiece including a workpiece material transparent to the laser radiation, the laser radiation being radiated into the workpiece from an entry side and, in an area of a rear side of the workpiece located opposite the entry side, being focused within the workpiece in a focus area such that workpiece material is removed in the focus area by multi-photon absorption, and includes bringing the rear side of the workpiece, at least in a machining area currently being machined around the focus area, into contact with a free-flowing liquid transparent to the laser radiation, wherein at least some of the liquid flows in a direction towards the machining area such that the liquid flows into the machining area at an angle of 60° or less to the rear side.

Abstract: A method of separating a workpiece into a plurality of sections includes generating one or a plurality of lines of modified material along one or a plurality of predefined separating lines in the workpiece in a first step by local material processing using a laser beam through a surface of the workpiece, which results in a reduction of breaking stress of the workpiece along the separating lines, and dividing, in a second step, the workpiece into the sections along the separating lines by thermal laser beam separation, wherein the one or the plurality of lines are generated completely or at least in portions at a distance from the surface in the workpiece.

Abstract: A method produces a multilayer element with a substrate and at least one conductor structure connected in an areal manner to the substrate, which has first regions of electrically conductive material, which is present in accordance with a prescribed pattern, while electrically non-conductive second regions lie between the first regions.

Abstract: A method of producing a multilayer element with a substrate and at least one conductor structure connected in an areal manner to the substrate, which has first regions of electrically conductive material present in accordance with a prescribed pattern, electrically non-conductive second regions lying between the first regions to produce RFID antennas or flexible printed circuit boards in a roller-to-roller process, the method including connecting a conductor foil to the substrate by a laterally structured layer of adhesive lying in between such that in first regions a partial bonding contact between the substrate and the conductor foil is created at a multiplicity of bonding zones, and in laterally extended second regions the conductor foil is not connected or is connected less firmly by adhesive to the substrate; structuring the conductor foil by cutting the conductor foil along boundaries of the first regions; and removing contiguous pieces of foil of the conductor foil from laterally extended second region

Abstract: A method produces a multilayer element with a substrate and at least one conductor structure connected in an areal manner to the substrate, which has first regions of electrically conductive material, which is present in accordance with a prescribed pattern, while electrically non-conductive second regions lie between the first regions.

Abstract: A device and a method for applying powder onto an application surface has a powder container (35) and a voltage source (32) for applying a voltage between the powder container and the application surface, wherein the powder container (35) at least partially consists of a conductive material and the powder container (35) has an opening (35a) or is completely open at its side facing the application surface when the voltage is applied.

Abstract: In a method for producing a permanent mark in an optical element which consists essentially of a material that is transparent in the visible spectral region, a marking region of the optical element is irradiated with laser radiation in order to generate local, near-surface material changes in such a way that a mark of prescribed shape and size is generated. The laser radiation has an operating wavelength ? from the wavelength region between 1.1 ?m and 9.2 ?m. A thulium-doped fiber laser is preferably used as laser radiation source. The operating wavelength is selected in dependence from the material of the optical element such that the material exhibits a partial absorption with a transmittance between 60% and 98%. The method can be used, in particular, to provide spectacle lenses, contact lenses or intraocular lenses with marks.

Abstract: In the case of a method for producing samples for transmission electron microscopy, a sample is prepared from a substrate of a sample material. To this end, the sample material is irradiated by means of a laser beam along an irradiation trajectory in order to produce a weak path in the sample material. The irradiation is controlled such that the weak path crosses a further weak path, which is likewise preferably produced by laser irradiation, running in the sample material, at an acute angle in a crossing region. The substrate is broken along the weak paths. A sample is thereby produced which has a wedge-shaped sample section bounded by fracture surfaces and has in the region of a wedge tip at least one electron-transparent region.

Abstract: In a method for producing a permanent mark in an optical element which consists essentially of a material that is transparent in the visible spectral region, a marking region of the optical element is irradiated with laser radiation in order to generate local, near-surface material changes in such a way that a mark of prescribed shape and size is generated. The laser radiation has an operating wavelength ? from the wavelength region between 1.1 ?m and 9.2 ?m. A thulium-doped fibre laser is preferably used as laser radiation source. The operating wavelength is selected in dependence from the material of the optical element such that the material exhibits a partial absorption with a transmittance between 60% and 98%. The method can be used, in particular, to provide spectacle lenses, contact lenses or intraocular lenses with marks.

Abstract: In the case of a method for producing samples for transmission electron microscopy, a sample is prepared from a substrate of a sample material. To this end, the sample material is irradiated by means of a laser beam along an irradiation trajectory in order to produce a weak path in the sample material. The irradiation is controlled such that the weak path crosses a further weak path, which is likewise preferably produced by laser irradiation, running in the sample material, at an acute angle in a crossing region. The substrate is broken along the weak paths. A sample is thereby produced which has a wedge-shaped sample section bounded by fracture surfaces and has in the region of a wedge tip at least one electron-transparent region.