Abstract: A method of manufacturing microstructures is disclosed, the method comprising a applying a mask to substrate; forming a pattern in the mask; processing the substrate according to the pattern; and mechanically removing the mask from the substrate. A polymer mask is disclosed for manufacturing micro scale structure, the polymer mask comprising a thin, preferably ultra thin flexible film. A method of manufacturing an integrated circuit is disclosed, the method comprising forming a plurality of isolated semiconductor devices on a common substrate; and connecting some of the devices. Apparatus for manufacturing microstructures is disclosed comprising: a mechanism for coating a mass substrate to create a structure; a mechanism for removing a mask from the substrate; and processing apparatus.

Abstract: A method of manufacturing microstructures is disclosed, the method comprising a applying a mask to substrate; forming a pattern in the mask; processing the substrate according to the pattern; and mechanically removing the mask from the substrate. A polymer mask is disclosed for manufacturing micro scale structure, the polymer mask comprising a thin, preferably ultra thin flexible film. A method of manufacturing an integrated circuit is disclosed, the method comprising forming a plurality of isolated semiconductor devices on a common substrate; and connecting some of the devices. Apparatus for manufacturing microstructures is disclosed comprising: a mechanism for coating a mass substrate to create a structure; a mechanism for removing a mask from the substrate; and processing apparatus.