Patents Assigned to A & A Company
  • Publication number: 20240072816
    Abstract: A digital-to-analog converter and an operation method thereof are provided. The digital-to-analog converter includes a current source module, a decoder, a change indicator, and a random number generator. The decoder is coupled to the current source module and receives a digital input signal. The change indicator is coupled to the decoder and provides an indication signal to the decoder. The random number generator is coupled to the change indicator and provides a random number signal to the change indicator. The change indicator generates an indication signal according to the random number signal, and the decoder generates a control signal to the current source module according to the digital input signal and the indication signal, so that the current source module generates an analog output signal corresponding to the digital input signal according to the control signal.
    Type: Application
    Filed: November 21, 2022
    Publication date: February 29, 2024
    Applicants: Global Unichip Corporation, Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ting-Hao Wang, Hui-Wen Tsai, Shih-Chun Lo
  • Publication number: 20240071999
    Abstract: A first polymer layer is formed across a package region and a test region. A first metal pattern is formed in the package region and a first test pattern is simultaneously formed in the test region. The first metal pattern has an upper portion located on the first polymer layer and a lower portion penetrating through the first polymer layer, and the first test pattern is located on the first polymer layer and has a first opening exposing the first polymer layer. A second polymer layer is formed on the first metal pattern in the package region and a second test pattern is simultaneously formed on the first test pattern in the test region. The second polymer layer has a second opening exposing the upper portion of the first metal pattern, and the second test pattern has a third opening greater than the first opening of the first test pattern.
    Type: Application
    Filed: August 24, 2022
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tseng Hsing Lin, Chien-Hsun Lee, Tsung-Ding Wang, Jung-Wei Cheng, Hao-Cheng Hou, Sheng-Chi Lin, Jeng-An Wang, Yao-Cheng Wu
  • Publication number: 20240071820
    Abstract: An interconnect structure, which may be used for example in a semiconductor device, is disclosed. The interconnect structure includes a contact layer made of a metal; one or more dielectric layers on the contact layer, and a deposited layer made of an insulating material. The interconnect structure further includes a trench through the one or more dielectric layers so that a sidewall surface of the trench is formed by the one or more dielectric layers and a bottom surface of the trench is formed by a portion of the contact layer. The deposited layer is in the trench and a thickness of the insulating material on the sidewall surface of the trench is at least 2.1 times greater than a thickness of the insulating material on the bottom surface of the trench.
    Type: Application
    Filed: August 24, 2022
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company Ltd.
    Inventors: Yu-Shan Yeh, Neng-Jye Yang, Kuo-Bin Huang
  • Publication number: 20240067085
    Abstract: An apparatus for controlling a vehicle convenience equipment includes a communicator configured to communicate with an obstacle detector and an external device, and a processor communicatively connected to the communicator and configured to obtain distance information with the external device during communication with the external device, determine whether a side obstacle exists based on obstacle information detected by the obstacle detector, obtain distance information with the side obstacle upon concluding that the side obstacle exists, control a side mirror in a folded state to an unfolded state thereof or to maintain the folded state thereof based on the distance information with the external device and the distance information with the side obstacle.
    Type: Application
    Filed: June 21, 2023
    Publication date: February 29, 2024
    Applicants: Hyundai Motor Company, Kia Corporation
    Inventor: Heegun Yang
  • Publication number: 20240068132
    Abstract: Nucleation enhancement and/or growth rate improvement of mesophase in pitch compositions derived from hydrocarbon feedstocks can be achieved by: reacting in a reaction zone a blend comprising an isotropic feed and a seeding agent, to produce a reacted pitch having a mesophase content of about 10 vol % to 100 vol %, based on the total volume of the reacted pitch, and a softening point (Tsp) below 400° C.; wherein the seeding agent is about 50 wt % or less, based on the total weight of the blend; wherein the seeding agent has a mesophase content of about 0.01 vol % to 100 vol %, based on the total volume of the seeding agent.
    Type: Application
    Filed: November 10, 2021
    Publication date: February 29, 2024
    Applicant: ExxonMobil Technology and Engineering Company
    Inventors: Manesh Gopinadhan, Stuart E. Smith, Nicole M. Callen, Clarence E. Chase, Kazem V. Edmond, Srinivasan Rajagopalan, Eric B. Sirota, Daniel J. Ryan
  • Publication number: 20240072136
    Abstract: A semiconductor structure includes a first transistor, a second transistor, a metal rail, and a first source/drain contact and a second source/drain contact. The first transistor has a gate structure, a first source/drain feature, and a second source/drain feature. The first source/drain feature and the second source/drain feature are on opposite sides of the gate structure. The second transistor has the gate structure, a third source/drain feature directly over the first source/drain feature, and a fourth source/drain feature directly over the second source/drain feature. The metal rail extends in an X-direction and adjacent to the gate structure in a Y-direction. The first source/drain contact and the second source/drain contact each has an L-shape in a Y-Z cross-sectional view. The first source/drain contact electrically connects the first source/drain feature to the metal rail. The second source/drain contact electrically connects the fourth source/drain feature to the metal rail.
    Type: Application
    Filed: August 26, 2022
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Meng-Yu LIN, Chun-Fu CHENG, Hsiang-Hung HUANG
  • Publication number: 20240070273
    Abstract: A method may include receiving a smart contract, which includes a binary file, from a contributor on a blockchain network, validating the smart contract, analyzing the binary file for malicious features, and generating a cybersecurity threat intelligence report using a contractual transaction incentivizing malware submission by the contributor. In some instances, analyzing the binary file comprises receiving the binary file by a feature extractor operable to extract one or more features based on one or more of analyzing the binary file using one or more of a header of the binary file, an image visualization of the binary file, natural language processing of application programming interface (API) calls, encoded strings, assembly instructions of the binary file, and sentiment analysis, and wherein the method further comprises delivering an extracted feature to a threat evaluator.
    Type: Application
    Filed: August 26, 2022
    Publication date: February 29, 2024
    Applicant: SAUDI ARABIAN OIL COMPANY
    Inventors: Fahad Abdulaziz ALMOGBIL, Rakan Hussain YAMANI
  • Publication number: 20240067170
    Abstract: A vehicle collision avoidance device and a method therefor are provided. The vehicle collision avoidance device includes: a camera that captures a rear side image of a vehicle; a radar that recognizes an object present at a rear side of the vehicle; and at least one processor electrically connected to the camera and the radar. The at least one processor: determines whether there is a static object at the rear side of the vehicle; determines a position of the static object present at the rear side of the vehicle; determines an empty space present in the direction of travel of the vehicle, based on the rear side image obtained by the camera and the position of the static object; and determines whether to warn of a collision, based on a moving object and the static object, when the moving object is detected.
    Type: Application
    Filed: February 15, 2023
    Publication date: February 29, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventor: Ho Choul Jung
  • Publication number: 20240071442
    Abstract: A method is provided, including following operations: activating a first word line to couple a first bit line with a second bit line to form a first conductive loop through a first transistor having a first terminal coupled to the first bit line and a second transistor having a first terminal coupled to the second bit line, wherein second terminals of the first and second transistors are coupled together; activating a second word line to couple a third bit line with a fourth bit line to form a second conductive loop, wherein the first and second word lines are disposed below the first to fourth bit lines; and identifying that the first conductive loop, the second conductive loop, or the combinations thereof is short-circuited or open-circuited.
    Type: Application
    Filed: August 26, 2022
    Publication date: February 29, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Min-Chiao YEH, Chieh LEE, Chia-En HUANG, Ji Kuan LEE, Yao-Jen YANG
  • Publication number: 20240071858
    Abstract: A vehicle power module includes an upper substrate and a lower substrate spaced from each other in a vertical direction, a semiconductor chip connected to one of the upper substrate and the lower substrate, and a spacer formed of a metal material containing copper and connecting the semiconductor chip to the other of the upper substrate and the lower substrate or to connect the upper substrate to the lower substrate, the spacer including a plurality of penetration portions formed to penetrate an inside thereof.
    Type: Application
    Filed: November 11, 2022
    Publication date: February 29, 2024
    Applicants: Hyundai Motor Company, Kia Corporation
    Inventors: Tae Hwa KIM, Suk Hyun LIM, Nam Sik KONG
  • Publication number: 20240073737
    Abstract: In a data packet transmission method, a target data detection rule and a target processing rule for a target service flow are obtained, and a to-be-forwarded data packet is received. Based on the to-be-forwarded packet, a target data packet is determined. The target data packet belongs to a target group of the target service flow based on target data packet distinguishing information and a target group identifier that are included in the target data detection rule. Data packet loss information of the target data packet in the target group is determined. The target group is determined to be a target to-be-discarded group based on the data packet loss information in the target group and a target-group data packet loss threshold included in the target processing rule.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Applicant: Tencent Technology (Shenzhen) Company Limited
    Inventor: Zhuoyun ZHANG
  • Publication number: 20240071953
    Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
  • Publication number: 20240068357
    Abstract: A system for validating a flow rate of a water injection well is provided. The system includes a first data source providing operating data associated with the well, a data repository, a digital model of the well, a second data source, and a processor. The processor is configured to obtain operating data, including a measured flow rate, historical data, and the digital model, determine a modelled flow rate using the digital model based on the historical injection data and the operating data, compare the measured flow rate with the modelled flow rate to determine a delta, receive a second measured flow rate from the second data source, compare the second measured flow rate to the modelled flow rate to determine a second delta, and in response to determining that the second delta does not exceed the threshold value, automatically generate a request for remediation of the first data source.
    Type: Application
    Filed: August 31, 2022
    Publication date: February 29, 2024
    Applicant: Saudi Arabian Oil Company
    Inventors: Abiola S. Onikoyi, Mohammed J. Shakhs, Said Rifat, Saud A. Al-Shuwaier, Fahad M. Al-Meshal
  • Publication number: 20240068362
    Abstract: A drift robot for performing a drifting operation of a wellbore in a subterranean formation is disclosed. The drift robot includes an elongated body to be deployed into a well conduit in the wellbore, a propulsion system for propelling the elongated body to traverse the well conduit, retractable landings attached to the elongated body for selectively anchoring the elongated body to an internal surface of the well conduit, sensors attached to the elongated body to generate sensor measurements of the well conduit, a smart camera disposed at one end of the elongated body to capture camera images of interior features of the well conduit, and a controller configured to navigate the elongated body based at least on the sensor measurements and the camera images.
    Type: Application
    Filed: August 31, 2022
    Publication date: February 29, 2024
    Applicant: SAUDI ARABIAN OIL COMPANY
    Inventors: Fiddoson Sweiyi Fiddo, Torty Chinenye Kalu-Ulu, Meshal A. Al-Amri
  • Publication number: 20240067413
    Abstract: A utility box be provided. The utility box may comprise a base and a lid. The base may comprise a keeper that may comprise a keeper opening. The lid may be hingedly attached to the base. The lid may comprise a tang comprising a tang opening wherein the lid may be operative to hingedly close on the base. When the lid is closed on the base, the keeper may be operative to retain the tang and the keeper opening and the tang opening may align.
    Type: Application
    Filed: August 24, 2023
    Publication date: February 29, 2024
    Applicant: Southwire Company, LLC
    Inventors: AGUS SURYANA THE, JASON PETER THOMAS
  • Publication number: 20240072021
    Abstract: A package structure and the manufacturing method thereof are provided. The package structure includes a first package including at least one first semiconductor die encapsulated in an insulating encapsulation and through insulator vias electrically connected to the at least one first semiconductor die, a second package including at least one second semiconductor die and conductive pads electrically connected to the at least one second semiconductor die, and solder joints located between the first package and the second package. The through insulator vias are encapsulated in the insulating encapsulation. The first package and the second package are electrically connected through the solder joints. A maximum size of the solder joints is greater than a maximum size of the through insulator vias measuring along a horizontal direction, and is greater than or substantially equal to a maximum size of the conductive pads measuring along the horizontal direction.
    Type: Application
    Filed: October 26, 2023
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Yu Chen, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Li-Hsien Huang, Po-Hao Tsai, Ming-Shih Yeh, Ta-Wei Liu
  • Publication number: 20240073970
    Abstract: In a sensing data reporting method, sensing data request information is received from a control network element. The sensing data request information includes sensing data reporting information of target sensing data to be reported. The target sensing data is generated according to the sensing data reporting information included in the sensing data request information. A communication session is established according to a user equipment route selection policy when the communication session between the terminal device and a target network element is not established. The target sensing data is reported to the target network element via the communication session.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Applicant: Tencent Technology (Shenzhen) Company Limited
    Inventor: Zhuoyun ZHANG
  • Publication number: 20240066368
    Abstract: A golf club head with an improved adjustable weighting system for an iron and/or wedge type golf club head is disclosed herein. In accordance with the presently disclosed technology, the golf club head may include a body portion. The body portion may include a face, a sole, and a back portion, and a rear cavity formed near the sole. The golf club head may also include a weight assembly. The weight assembly may include a cover and an adjustable weight installable underneath the cover.
    Type: Application
    Filed: May 12, 2023
    Publication date: February 29, 2024
    Applicant: Acushnet Company
    Inventors: Marni D. Ines, Kevin Tassistro
  • Publication number: 20240070203
    Abstract: An information processing apparatus outputs answer information corresponding to inquiry information that is input. The information processing apparatus includes a memory and circuitry. The memory is configured to store a plurality of databases each having at least a first field and a second field. The circuitry is configured to: perform morphological analysis on the inquiry information, to divide the inquiry information into morphemes; perform a first matching process based on the morphemes and the first field of each of the plurality of databases, to determine whether to adopt the database as an extraction source from which the answer information is to be extracted; and perform a second matching process based on the morphemes and the first field of the database, which is determined to be adopted as the extraction source, to output, as the answer information, data in the second field corresponding to data in the first field.
    Type: Application
    Filed: November 7, 2023
    Publication date: February 29, 2024
    Applicant: Ricoh Company, Ltd.
    Inventor: Takanori MOHRI
  • Publication number: 20240071981
    Abstract: A method of fabricating a semiconductor structure includes the following steps. A semiconductor wafer is provided. A plurality of first surface mount components and a plurality of second surface mount components are bonded onto the semiconductor wafer, wherein a first portion of each of the second surface mount components is overhanging a periphery of the semiconductor wafer. A first barrier structure is formed in between the second surface mount components and the semiconductor wafer. An underfill structure is formed under a second portion of each of the second surface mount components, wherein the first barrier structure blocks the spreading of the underfill structure from the second portion to the first portion.
    Type: Application
    Filed: November 1, 2023
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Mao-Yen Chang, Chih-Wei Lin, Hao-Yi Tsai, Kuo-Lung Pan, Chun-Cheng Lin, Tin-Hao Kuo, Yu-Chia Lai, Chih-Hsuan Tai