Patents Assigned to A & A Company
  • Patent number: 12051673
    Abstract: A package includes a first package structure and a second package structure stacked on the first package structure. The first package structure includes a redistribution structure, an integrated circuit, an encapsulant, and conductive structures. The integrated circuit is disposed on the redistribution structure and includes a first chip, a second chip, a third chip, and a fourth chip. The first chip includes a semiconductor substrate that extends continuously throughout the first chip. The second and the third chips are disposed side by side on the first chip. The fourth chip is disposed over the first chip and includes a semiconductor substrate that extends continuously throughout the fourth chip. Sidewalls of the first chip are aligned with sidewalls of the fourth chip. The encapsulant laterally encapsulates the integrated circuit. The conductive structures penetrate through the encapsulant.
    Type: Grant
    Filed: July 25, 2022
    Date of Patent: July 30, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ming-Fa Chen, Sung-Feng Yeh, Tzuan-Horng Liu, Chao-Wen Shih
  • Patent number: 12050153
    Abstract: A method for monitoring a transport vehicle is provided. The method includes the operations as follows. A transport vehicle is scanned by a monitor during the transport vehicle is operated on a rail to acquire a vehicle pattern of the transport vehicle. The vehicle pattern of the transport vehicle is analyzed. An abnormal transport vehicle is determined based on the vehicle pattern. The monitor is placed nearby the rail. A method for transport vehicle maintenance is also provided.
    Type: Grant
    Filed: November 13, 2020
    Date of Patent: July 30, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chun-Jung Huang, Kuang Huan Hsu, Jen-Ti Wang, Po-Feng Tsai, An-Sheng Chung
  • Patent number: 12048990
    Abstract: An example system includes: an apparatus comprising: a temporary fastener having a stem configured to be inserted through as assembly and be retained to the assembly, and a spring mounted about the stem. The system also includes a linear actuator configured to apply a force on the spring, thereby causing the spring to be compressed against the assembly and apply a predetermined clamping force to the assembly.
    Type: Grant
    Filed: April 25, 2022
    Date of Patent: July 30, 2024
    Assignee: The Boeing Company
    Inventors: Evan M. King, Ike C. Schevers, David L. Fritsche
  • Patent number: 12048542
    Abstract: A shieldable needle device (12) with a needle cannula (28), a hub (44) supporting the needle cannula, and a tip guard (24) axially movable along the needle cannula where, upon transition, the tip guard protectively surrounds the distal end (42) of the needle cannula. The needle device includes a pair of wings (60) extending laterally from opposing sides of the tip guard and connected to the hub. The pair of wings are transitionable between a first position and a second position, wherein transition of the pair of wings advances the tip guard from a proximal position to a shielding distal position. The wings include protrusions (66) which cause the longitudinal axis of the needle cannula to become offset from the opening (52) of the tip guard during advancement of the tip guard preventing the needle cannula from being reinserted through the tip guard after the tip guard has been transitioned to the distal position.
    Type: Grant
    Filed: April 30, 2019
    Date of Patent: July 30, 2024
    Assignee: Becton, Dickinson and Company
    Inventors: Bradley M. Wilkinson, C. Mark Newby
  • Patent number: 12049769
    Abstract: The present disclosure is directed to a combination lock including a housing configured to lockingly receive a locking link. The lock includes a plurality of outer dials and a plurality of inner dials, each selectively coupled to a corresponding outer dial. A spindle is positioned radially internal to the inner dials. A multiplier link is pivotably connected between the spindle and a locking bolt. Some forms of the combination lock include a tactile feedback mechanism and/or a combination reset mechanism.
    Type: Grant
    Filed: March 29, 2022
    Date of Patent: July 30, 2024
    Assignee: Schlage Lock Company LLC
    Inventors: Manjunatha Ramakrishna, Robert Townsend, Kavya M
  • Patent number: 12051824
    Abstract: Manufacturing methods for making a substantially rectangular and flat glass preform for manufacturing a Li ion conducting glass separator can involve drawing the preform to a thin sheet and may involve one or more of slumping, rolling or casting the glass within a frame that defines a space filling region and therewith the shape and size of the preform. The thickness of the rectangular flat preform so formed may be about 2 mm or less. The frame may be slotted having a back surface and widthwise wall portion that define the height and width of the space filling region. The flat backing surface and surfaces of the widthwise wall portions are defined may be coated by a material that is inert in direct contact with the heated glass material, such as gold.
    Type: Grant
    Filed: May 4, 2021
    Date of Patent: July 30, 2024
    Assignee: PolyPlus Battery Company
    Inventors: Steven J. Visco, Yevgeniy S. Nimon, Bruce D. Katz
  • Patent number: 12051290
    Abstract: A method of generating a tire slip sound is capable of producing a virtual tire slip sound in a driving situation in which tire slip may occur during vehicle driving. The method includes collecting vehicle driving information while a vehicle is traveling; determining a characteristic of a virtual tire slip sound based on the collected vehicle driving information; generating and outputting a tire slip signal for generating and outputting the virtual tire slip sound according to the determined characteristic; and operating sound equipment of the vehicle according to the tire slip signal output from the controller to generate and output the virtual tire slip sound according to a vehicle driving state.
    Type: Grant
    Filed: August 25, 2021
    Date of Patent: July 30, 2024
    Assignees: Hyundai Motor Company, Kia Corporation
    Inventors: Ki Chang Kim, Jin Sung Lee, Dong Chul Park, Tae Kun Yun, Sang Jin Hong
  • Patent number: 12050056
    Abstract: A method for liquefying a feed gas stream. A refrigerant stream is cooled and expanded to produce an expanded, cooled refrigerant stream. Part or all of the expanded, cooled refrigerant stream is mixed with a make-up refrigerant stream in a separator, thereby condensing heavy hydrocarbon components from the make-up refrigerant stream and forming a gaseous expanded, cooled refrigerant stream. The gaseous expanded, cooled refrigerant stream passes through a heat exchanger zone to form a warm refrigerant stream. The feed gas stream is passed through the heat exchanger zone to cool at least part of the feed gas stream by indirect heat exchange with the expanded, cooled refrigerant stream, thereby forming a liquefied gas stream. The warm refrigerant stream is compressed to produce the compressed refrigerant stream.
    Type: Grant
    Filed: December 15, 2022
    Date of Patent: July 30, 2024
    Assignee: ExxonMobil Technology and Engineering Company
    Inventors: Yijun Liu, Fritz Pierre, Jr.
  • Patent number: 12051639
    Abstract: A package structure includes a first package, a second package, a conductive spacer, and a flux portion. The first package includes a semiconductor die. The second package is stacked to the first package. The conductive spacer is disposed between and electrically couples the first package and the second package. The flux portion is disposed between and electrically couples the first package and the conductive spacer, where the flux portion includes a first portion and a second portion separating from the first portion by a gap, and the first portion and the second portion are symmetric about an extending direction of the gap. The gap is overlapped with the conductive spacer.
    Type: Grant
    Filed: March 2, 2022
    Date of Patent: July 30, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Chiang Tsao, Chao-Wei Chiu, Jen-Jui Yu, Hsiu-Jen Lin, Ching-Hua Hsieh
  • Patent number: 12050092
    Abstract: A mechanism for attachment and detachment of a fixed or controllable airfoil to an airframe includes a base adapted for attachment to a root of the airfoil and a slot beam adapted for attachment along the airframe (e.g., parallel to the longitudinal X-axis of the airframe). The base includes a plurality of pins spaced along and held between parallel rails. The slot beam includes a plurality of slots arranged along the beam. Each slot has a lead-in portion to receive one of the plurality of pins and a longitudinally-oriented tapered portion (e.g., parallel to the longitudinal X-axis with a taper between 1 and 5 degrees) to engage the pin so that the base is seated in the slot beam to position the airfoil against the airframe in an XY plane. A pre-load mechanism is configured to apply a force along the X-axis to press the plurality of pins into the respective tapered portions to fix the base relative to the slot beam in six degrees of freedom (6 DOF).
    Type: Grant
    Filed: September 22, 2022
    Date of Patent: July 30, 2024
    Assignee: Raytheon Company
    Inventors: Dan L. Reller, Paul T. Hudak, Andrew P. Frits, Jr., Scott Andrew Holbrook
  • Patent number: 12051603
    Abstract: Systems for annealing a wafer are provided. A system includes a wafer stage, a laser beam generator, and a controller. The laser beam generator is configured to generate a laser beam. The controller is configured to control the laser beam generator according to information regarding layout of a first semiconductor die of the wafer, so as to project the laser beam with a first laser parameter onto the first semiconductor die of the wafer on the wafer stage along at least one annealing orbit. The controller is configured to arrange the annealing orbit to partially cover the first semiconductor die of the wafer and to uncover a plurality of second semiconductor dies of the wafer.
    Type: Grant
    Filed: May 6, 2021
    Date of Patent: July 30, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventor: Hsin-Hao Yeh
  • Patent number: 12051577
    Abstract: A sputtering target comprising: a backing plate; and a target material bonded via a bonding material to a bonding region of the backing plate, wherein a bonding area of a bonding portion between the target material and the backing plate accounts for 97% or more of the area of the bonding region, and wherein a maximum defect area of portions without the bonding material present between the target material and the backing plate accounts for 0.6% or less of the area of the bonding region. The sputtering target enables manufacturing of the sputtering target in which the target material is hardly peeled off during sputtering.
    Type: Grant
    Filed: May 3, 2023
    Date of Patent: July 30, 2024
    Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Masahiro Fujita, Koji Nishioka
  • Patent number: 12049000
    Abstract: Provided is a joint structure for a robot including: a body part; a link structure connected to an upper portion of the body part and including multiple links; a sensor unit provided on one end of the link structure; a first wire having one end connected to the sensor unit; and an actuator fixed to one side of the body part and connected to the other end of the first wire to move the other end of the first wire in a vertical direction, wherein the sensor unit measures tension applied to the first wire.
    Type: Grant
    Filed: November 8, 2021
    Date of Patent: July 30, 2024
    Assignees: Hyundai Motor Company, Kia Corporation
    Inventors: Muhammad Zahak Jamal, Dong Hyun Lee, Hyo Seung Han, Suk Hyung Jang
  • Patent number: 12048321
    Abstract: A smokeless tobacco pastille configured for insertion into the mouth of a user is provided. The smokeless tobacco pastille can include (i) a tobacco material present in an amount of less than about 40 dry weight percent, based on the total dry weight of the pastille; (ii) at least one natural gum binder present in an amount of at least about 25 dry weight percent; and (iii) a plurality of sugar alcohols present in a total amount of at least about 40 dry weight percent, the predominant component of the plurality of sugar alcohols being isomalt or erythritol, wherein the shape of the smokeless tobacco pastille is moldable in the oral cavity.
    Type: Grant
    Filed: December 7, 2022
    Date of Patent: July 30, 2024
    Assignee: R.J. Reynolds Tobacco Company
    Inventors: Jerry Wayne Marshall, Daniel Verdin Cantrell, Serban C. Moldoveanu
  • Patent number: 12050414
    Abstract: A developing device includes a developing case, a filter, and a filter holder. The developing case stores developer inside to develop a latent image formed on a surface of an image bearer and has an opening portion that communicates between an inside and an outside of the developing device. The filter has a lower weight density per unit volume at a first side of the filter facing the inside of the developing device than a weight density per unit volume at a second side of the filter facing the outside of the developing device. The filter holder is detachably attached to the opening portion of the developing case with the filter held by the filter holder.
    Type: Grant
    Filed: November 23, 2022
    Date of Patent: July 30, 2024
    Assignee: RICOH COMPANY, LTD.
    Inventors: Yusuke Chiba, Takuya Suganuma, Kazuki Yogosawa, Taku Kumiya, Hotaru Hashikawa
  • Patent number: 12052667
    Abstract: The present disclosure provides a method and a device in a user equipment and a base station used for power adjustment. The UE first receives K downlink signaling(s) and transmits a first radio signal. Any of the K downlink signaling(s) comprises a first field and a second field, the second field of any of the K downlink signaling(s) is used to determine a power offset. A transmitting power of the first radio signal is a first power. A value of each first field of K1 downlink signaling(s) among the K downlink signaling(s) is equal to a first index. The first power is linearly correlated with a sum of K1 power offset(s), which is(are) indicated by each second field of the K1 downlink signaling(s) respectively. The present disclosure can support multiple closed-loop power control processes for one UE so as to improve both efficiency and performance of uplink power control.
    Type: Grant
    Filed: August 15, 2022
    Date of Patent: July 30, 2024
    Assignee: SHANGHAI LANGBO COMMUNICATION TECHNOLOGY COMPANY LIMITED
    Inventor: Xiaobo Zhang
  • Patent number: 12052344
    Abstract: A method for electing a representative node device for a blockchain system includes: receiving IP address information of a first node device, the first node device being in a candidate state for a representative node device; receiving, from the first node device, an IP address obtaining request for requesting IP address information of a representative node device; when the first node device is determined to be a representative node device of the blockchain system elected in a current election process, transmitting, to the first node device, an IP address list comprising IP address information of representative node devices elected in the current election process; and when the first node device is determined not to be a representative node device of the blockchain system elected in the current election process, skipping the IP address obtaining request.
    Type: Grant
    Filed: October 1, 2020
    Date of Patent: July 30, 2024
    Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Rui Guo, Maocai Li, Zongyou Wang, Haitao Tu, Li Kong, Kaiban Zhou, Changqing Yang, Nan Wang, Yong Ding, Yifang Shi
  • Patent number: D1037023
    Type: Grant
    Filed: August 23, 2022
    Date of Patent: July 30, 2024
    Assignee: COLE-PARMER INSTRUMENT COMPANY LLC
    Inventors: Thorben Neu, Cameron K. Vreeland, Boris Bass, Nathaniel D. Kraft
  • Patent number: D1037136
    Type: Grant
    Filed: October 11, 2022
    Date of Patent: July 30, 2024
    Assignee: The Goodyear Tire & Rubber Company
    Inventors: Lac An Nguyen, Nicholas Thomas Schoeppner
  • Patent number: D1037270
    Type: Grant
    Filed: December 21, 2021
    Date of Patent: July 30, 2024
    Assignee: The Boeing Company
    Inventors: Seppo Pietarinen, Kathryn Thomas