Patents Assigned to A & A Corporation
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Publication number: 20240379058Abstract: An electronic device including a plurality of sensing pixel circuits is provided. At least one of the sensing pixel circuits includes a photoelectric sensing element, a first transistor device, a second transistor device, a third transistor device and a fourth transistor device. The fourth transistor device includes a first end, a second end and a control end. The first end of the fourth transistor device is coupled to a first end of the first transistor device. The second end of the fourth transistor device is coupled to a bias voltage. The control end of the fourth transistor device is coupled to a scan line. The fourth transistor device serves as a current sink in a pre-trap period.Type: ApplicationFiled: July 23, 2024Publication date: November 14, 2024Applicant: Innolux CorporationInventors: Yuko Furui, Akihiro Iwatsu, Shuji Hagino
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Publication number: 20240378549Abstract: A delivery control apparatus (101) includes a delivery request acquisition unit (109) that acquires, from an addressee terminal, a delivery request including first identification information for identifying a package, a responsibility request unit (110) that transmits a responsibility request for delivery of the package to a delivery person terminal, a first authentication unit (111) that performs biometric authentication of a delivery person, based on biometric information acquired from the delivery person terminal of the delivery person who responds to the responsibility request, and a responsibility notification unit (113) that transmits, to the delivery person terminal, second identification information for proving that the delivery person is a person in charge of delivery of the package, when the biometric authentication of the delivery person has succeeded.Type: ApplicationFiled: September 16, 2021Publication date: November 14, 2024Applicant: NEC CorporationInventors: Kohei SUGA, Daisuke KAWASAKI, Kaori YAMANE
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Publication number: 20240381578Abstract: A power-supply box for a vehicle includes a circuit board on which a part is mounted, and a heatsink that is thermally contacted with the part on the circuit board to radiate the heat of the part. The part produces heat when a power supply output is supplied to the part. The heatsink is made of resin and a metal plating layer is formed on a surface of the heatsink.Type: ApplicationFiled: May 6, 2024Publication date: November 14, 2024Applicant: Yazaki CorporationInventors: Kazuomi Kiyosue, Akinori Nakashima, Dai Arani
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Publication number: 20240375705Abstract: A first motor control measure sends a first command to a second motor control measure in order to conduct drive control of a motor when conducting steering assist control, and assists drive of the motor by conducting drive control of the motor based on a second command sent from the second motor control measure to conduct drive control of the motor when conducting the steering assist control, and the second motor control measure sends the second command to the first motor control measure when conducting autonomous drive assist control, and assists drive of the motor by conducting drive control of the motor based on the first command to conduct the steering assist control.Type: ApplicationFiled: December 14, 2021Publication date: November 14, 2024Applicant: Mitsubishi Electric CorporationInventor: Chiaki FUJIMOTO
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Publication number: 20240380132Abstract: An Insulation Displacement Contact Compliant connector system (IDCC) which includes a housing, header pins, and a Printed Circuit Board (PCB). Each header pin has at least a single barb to be retained into the housing. Each pin has a blade for contacting a wire. A compliant feature on the pin retains itself into holes in the PCB. The housing has a negative space similarly shaped to the pin. The housing includes a strain relief which provides a lead-in for a wire. When the system is fully assembled, the pins reside in the housing, and exit through the housing and into and through respective holes in the PCB. A wire can be inserted into the housing once the pins reside in the housing. There are several options for the assembly process including a) a pin-to-housing insertion process; b) a housing assembly-to-PCB process or a connector-to-PCB process; and c) a wired housing assembly-to-PCB assembly process or a wire harness-to-PCB assembly process.Type: ApplicationFiled: July 19, 2024Publication date: November 14, 2024Applicant: J.S.T. CORPORATIONInventors: Joseph TXAROLA, Gwendolyn UPSON, Ping CHEN
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Publication number: 20240374846Abstract: An inhaler includes a housing having one surface, the other surface opposite to the one surface, and a plurality of side surfaces connecting the one surface and the other surface, a mouthpiece which is disposed on the one side of the housing, a reservoir which is disposed inside the housing and stores an inhalable composition, a nozzle which extends from the mouthpiece to the reservoir, and a needle valve which is movably disposed inside the nozzle, when a suction force is not applied to the mouthpiece, the needle valve is maintained in a first state in which the nozzle is closed, and when a suction force is applied through the mouthpiece, the needle valve is switched into a second state in which the nozzle is opened.Type: ApplicationFiled: March 20, 2023Publication date: November 14, 2024Applicant: KT&G CORPORATIONInventors: Tae Heon KIM, Jae Hyun KIM, Mi Jeong LEE, Yongmi JUNG, Eun Mi JEOUNG, Seung Kyu HAN, Minseok JEONG, Tae Young CHUNG
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Publication number: 20240377308Abstract: In order to identify areas where countermeasures against dust emissions are needed, this area identification system comprises: an acquisition means for acquiring, on the basis of the reflected light of the laser beam that irradiates each position in a target space containing a dust-generating object, positional information corresponding to each position and intensity information corresponding to the intensity of the reflected light reflected at the position corresponding to the positional information; and an identification means for identifying, on the basis of the positional information and the intensity information, an area to be sprayed with a suppressant for suppressing the generation of dust within the target space.Type: ApplicationFiled: September 24, 2021Publication date: November 14, 2024Applicant: NEC CorporationInventor: Takahiro ONO
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Publication number: 20240381759Abstract: Provided are organometallic compounds comprising either a Pt or a Pd as the central metal atom which is coordinated by a tetradentate ligand. Also provided are formulations comprising these organometallic compounds. Further provided are organic light emitting devices (OLEDs) as well as related consumer products that utilize these organometallic compounds.Type: ApplicationFiled: April 11, 2024Publication date: November 14, 2024Applicant: UNIVERSAL DISPLAY CORPORATIONInventors: Hsiao-Fan Chen, Matthew Asay
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Publication number: 20240377628Abstract: An image sensor includes: (1) a first pixel and a second pixel each including: a photoelectric conversion unit that photoelectrically converts light and generates an electric charge; and a transfer unit that transfers the electric charge generated by the photoelectric conversion unit to an accumulation unit that accumulates the electric charge, the first pixel and the second pixel being arranged in a row direction; (2) a first supply unit that supplies a signal which controls the transfer unit of the first pixel; and (3) a second supply unit that supplies a signal which controls the transfer unit of the second pixel.Type: ApplicationFiled: July 24, 2024Publication date: November 14, 2024Applicant: NIKON CORPORATIONInventor: Osamu SARUWATARI
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Publication number: 20240381650Abstract: According to one embodiment, a semiconductor memory device includes: a stacked structure including a plurality of first layers stacked with a second layer therebetween above a substrate having a memory region in which a plurality of memory cells are arranged and an outer edge portion surrounding the memory region, the stacked structure having a stepped portion at which ends of the first layers form a stepped shape at an end of the stacked structure in a first direction within the memory region, wherein at least some of the first layers among the plurality of first layers extend, along a second direction perpendicular to the first direction, from above the outer edge portion at a first end side of the substrate through above the memory region over the substrate to above the outer edge portion at a second end side of the substrate.Type: ApplicationFiled: July 22, 2024Publication date: November 14, 2024Applicant: Kioxia CorporationInventor: Keisuke UCHIDA
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Publication number: 20240379630Abstract: An electronic device is provided by the present disclosure. The electronic device includes a substrate, a plurality of light emitting elements disposed on the substrate, a cover layer disposed on the substrate and covering the plurality of light emitting elements, and a dam wall unit disposed between adjacent two of the plurality of light emitting elements. The dam wall unit includes a bottom surface adjacent to a top surface of the substrate, and a spacing is included between the bottom surface of the dam wall unit and the top surface of the substrate.Type: ApplicationFiled: April 12, 2024Publication date: November 14, 2024Applicant: InnoLux CorporationInventor: Shun-Yuan HU
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Publication number: 20240379709Abstract: A light detection device capable of suppressing the worsening of noise characteristics is provided. The light detection device includes a semiconductor layer having photoelectric conversion regions, one surface of the semiconductor layer forming a light incident surface, the other surface of the semiconductor layer forming an element forming surface, a trench positioned to partition the photoelectric conversion regions and penetrating the semiconductor layer in a direction of thickness thereof, and a separation part formed in the trench and including a first separation part and a second separation part, the first separation part being positioned on the side of the light incident surface, the second separation part being positioned on the side of the element forming surface. A first surface of the second separation part on the side of the first separation part faces a first material.Type: ApplicationFiled: March 25, 2022Publication date: November 14, 2024Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Takaaki FURUSHO, Kentaro EDA, Masayuki TAZAKI, Mutsuo UEHARA, Suguru SAITO
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Publication number: 20240381540Abstract: A manufacturing method of an electronic device is provided. The manufacturing method of the electronic device includes following steps: providing a substrate; bonding an electronic component to the substrate, wherein the electronic component is mainly driven by a reverse bias in an operating mode, and the electronic component is electrically connected in series with another electronic component; applying a forward bias to the electronic component, and determining whether the electronic component is normal or failed based on a light emitted by the another electronic component or thermal characteristics of the electronic component; and transporting the substrate configured with the electronic component determined to be normal to a next production site or repairing the electronic component determined to be failed.Type: ApplicationFiled: July 22, 2024Publication date: November 14, 2024Applicant: Innolux CorporationInventors: Yi-Hung Lin, Hsiu-Yi Tsai, Chin-Lung Ting, Chung-Kuang Wei
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Publication number: 20240381575Abstract: An electronic apparatus includes at least one heat generating component and an immersion cooling system. The immersion cooling system includes a main tank and a liquid amount adjusting module. The main tank is adapted to contain a heat dissipation medium, and the heat generating component is disposed in the main tank to be immersed in the heat dissipation medium. The liquid adjusting module includes an auxiliary tank and a pump. The auxiliary tank is adjacent to the main tank, and the heat dissipation medium in the main tank is adapted to be overflowed into the auxiliary tank. The pump is disposed in the auxiliary tank and adapted to drive the heat dissipation medium in the auxiliary tank to flow into the main tank.Type: ApplicationFiled: July 22, 2024Publication date: November 14, 2024Applicant: Wiwynn CorporationInventors: Chun-Wei Lin, Ting-Yu Pai, Pai-Chieh Huang, Chin-Han Chan, Hsien-Chieh Hsieh
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Publication number: 20240374444Abstract: A mobility vehicle may comprise a frame, a first pivot arm, a second pivot arm, and a suspension assembly. The first pivot arm may be coupled to the frame and coupled to a drive wheel. The second pivot arm may be coupled to the frame and coupled to a ground engaging caster wheel. The suspension assembly may be coupled to the frame. The suspension assembly may include a first spring assembly and a second spring assembly. The first spring assembly may be disposed about a first spring axis and coupled to the first pivot arm. The second spring assembly may be disposed about a second spring axis and coupled to the second pivot arm. The first spring axis and the second spring axis may be disposed relative to each other at an angle of no greater than about 150° when the mobility vehicle is operating on horizontal ground.Type: ApplicationFiled: July 23, 2024Publication date: November 14, 2024Applicant: Pride Mobility Products CorporationInventor: Jonathan Davis
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Publication number: 20240376545Abstract: A marker that can set a particularly clear cutoff value for distinguishing between follicular thyroid cancer (FTC) and follicular adenoma (FA), which is difficult in conventional pathological diagnosis is provided.Type: ApplicationFiled: March 29, 2022Publication date: November 14, 2024Applicants: NIPPON MEDICAL SCHOOL FOUNDATION, UNIVERSITY PUBLIC CORPORATION OSAKAInventors: Tomoo JIKUZONO, Osamu ISHIBASHI
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Publication number: 20240379405Abstract: A cleaning and transfer equipment includes cleaning modules disposed in series, a wafer transport mechanism transporting a wafer between the cleaning modules, and a control device controlling an operation of the wafer transport mechanism. The wafer transport mechanism includes a wafer gripping mechanism gripping the wafer, a vertical moving mechanism vertically moving the wafer gripping mechanism, and an arrangement direction moving mechanism moving the wafer gripping mechanism in an arrangement direction of the cleaning modules. The wafer gripping mechanism includes a pair of hands openable and closeable, a rotation mechanism rotating the hands about a rotation shaft parallel to an opening/closing direction, and a sensor measuring a value corresponding to a weight applied to the hands when the hands are in a closed state. The control device compares measurement data of the sensor with a predetermined threshold value to determine whether the wafer is held on the hands.Type: ApplicationFiled: April 29, 2024Publication date: November 14, 2024Applicant: EBARA CORPORATIONInventors: KOTARO TOYOSAWA, DAI YOSHINARI
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Publication number: 20240379512Abstract: A semiconductor device includes: a first circuit pattern, a second circuit pattern, a third circuit pattern, and a fourth circuit pattern; a semiconductor chip and a first electrode arranged on the first circuit pattern; a second electrode disposed on the second circuit pattern; a third electrode disposed on the third circuit pattern; and a fourth electrode disposed on the fourth circuit pattern, a pad disposed on the semiconductor chip and the second circuit pattern are connected via first wiring, a surface of the semiconductor chip and the third circuit pattern are connected via second wiring, the surface of the semiconductor chip and the fourth circuit pattern are connected via third wiring, the second wiring and the third wiring are arranged on the same side of the surface of the semiconductor chip and in parallel with each other, and the first wiring is disposed on an opposite side from the third wiring.Type: ApplicationFiled: April 2, 2024Publication date: November 14, 2024Applicant: Mitsubishi Electric CorporationInventors: Tomokazu KANNA, Akiyoshi MASUDA
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Publication number: 20240375739Abstract: Locking assembly for a bicycle rack assembly which comprises a rack-side unit and a base which is mountable to the rack-side unit, the locking assembly comprising a movable member configured to be retained by the base, the movable member comprising a base-side lock structure which is engageable with a rack-side lock structure of the rack-side unit for locking the base to the rack-side unit, wherein the movable member comprises an insertion recess configured for at least partly receiving a corresponding key device therein in an insertion direction for disengagement of the base-side lock structure from the rack-side lock structure, wherein the locking assembly, in particular the movable member, is provided with a security mechanism configured to inhibit disengagement of the base-side lock structure from the rack-side lock structure otherwise than by use of the corresponding key device.Type: ApplicationFiled: July 12, 2022Publication date: November 14, 2024Applicant: NIPPON STEEL CORPORATIONInventors: Roel Johannes Oda VAN HEUR, Marthijn Marinus Gerardus Henrikus VAN BALVEREN
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Publication number: 20240375715Abstract: According to a front vehicle body for providing strength against a frontal collision of an electric vehicle, locational characteristics and mounting characteristics of a high-voltage battery on a vehicle body platform for an electric vehicle are considered by connection structures of a dash upper side member, a dash tunnel reinforcement member, a dash cross member, and a dash cross side member.Type: ApplicationFiled: October 18, 2023Publication date: November 14, 2024Applicants: Hyundai Motor Company, Kia CorporationInventors: Dong-Il KUM, Jang-Won Hong, Kyung-Bum Kang