Patents Assigned to "A" Co.
  • Patent number: 10964547
    Abstract: A method of fabricating a semiconductor structure including the following steps is provided. A mask layer is formed on a semiconductor substrate. The semiconductor substrate revealed by the mask layer is anisotropically etched until a cavity is formed in the semiconductor substrate, wherein anisotropically etching the semiconductor substrate revealed by the mask layer comprises performing a plurality of first cycles and performing a plurality of second cycles after performing the first cycles, each cycle among the first and second cycles respectively includes performing a passivating step and performing an etching step after performing the passivating step. During the first cycles, a first duration ratio of the etching step to the passivating step is variable and ramps up step by step. During the second cycles, a second duration ratio of the etching step to the passivating step is constant, and the first duration ratio is less than the second duration ratio.
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: March 30, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chin-Han Meng, Chih-Hsien Hsu, Jr-Sheng Chen, An-Chi Li, Lin-Ching Huang, Yu-Pei Chiang
  • Patent number: 10965904
    Abstract: Disclosed is a display method, including: decoding an input signal comprising an audio signal and a video signal, and identifying a resolution of the decoded video signal; in response that the video signal has an 8K resolution, outputting the video signal to an back end for processing through a first interface, and outputting an on-screen display adjustment signal to the back end for processing through a second interface; in response that the video signal has a 4K or 2K resolution, preprocessing outputting the video signal to the back end for processing through the second interface, and outputting the OSD signal generated by the SoC to the back end for processing through the first interface; and mixing and coding the video signal and the OSD signal, and outputting the mixed and coded signals to a screen for display.
    Type: Grant
    Filed: August 22, 2018
    Date of Patent: March 30, 2021
    Assignee: SHENZHEN SKYWORTH-RGB ELECTRONIC CO., LTD.
    Inventors: Xin Li, Tiejun Lu, Jian Huang, Wensheng Hong
  • Patent number: 10961514
    Abstract: The present invention relates to a protein having glucose dehydrogenase activity selected from: (a) an amino acid sequence represented by SEQ ID NO: 3; (b) an amino acid sequence in which 1 to 3 amino acids are deleted from, replaced in or added to the amino acid sequence represented by SEQ ID NO: 3; (c) an amino acid sequence which has at least 80% identity with the amino acid sequence represented by SEQ ID NO: 3 and whose N-terminus is SS; or (d) an amino acid sequence which has at least 80% identity with the amino acid sequence represented by SEQ ID NO: 3, and does not contain a sequence represented by SEQ ID NO: 8 at its N-terminus. The invention also includes a polynucleotide encoding the enzyme, a method for manufacturing the enzyme, a method for measuring glucose using the enzyme, a measuring reagent composition and a biosensor.
    Type: Grant
    Filed: January 11, 2017
    Date of Patent: March 30, 2021
    Assignee: IKEDA FOOD RESEARCH CO., LTD.
    Inventors: Ryo Takenaka, Takafumi Takumi
  • Patent number: 10964871
    Abstract: The present invention relates to a micro LED structure and a method of manufacturing the same. More particularly, the present invention relates to a micro LED structure and a method of manufacturing the same, the micro LED structure including: a micro LED; a circuit board driving the micro LED; and an anisotropic conductive anodic oxide film provided between the micro LED and the circuit board to electrically connect the circuit board and the micro LED. According to the present invention, without applying an external force (thermocompression bonding) to the anisotropic conductive anodic oxide film, it is possible to electrically connect the circuit board and the micro LED. In addition, it is possible to obtain characteristics such as uniform conductivity in a vertical direction and heat dissipation.
    Type: Grant
    Filed: June 17, 2020
    Date of Patent: March 30, 2021
    Assignee: POINT ENGINEERING CO., LTD.
    Inventors: Bum Mo Ahn, Seung Ho Park, Tae Hwan Song
  • Patent number: 10964774
    Abstract: The present disclosure discloses a backplane for an organic light emitting display device, a method for fabricating the same, and an organic light emitting display apparatus. The backplane includes a substrate on which a wiring structure and a thin film transistor are provided, wherein the wiring structure includes an initializing voltage input line which is provided in the same layer and made of the same material as electrodes of the thin film transistor.
    Type: Grant
    Filed: May 4, 2018
    Date of Patent: March 30, 2021
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., ORDOS YUANSHENG OPTOELECTRONICS TECHNOLOGY, CO., LTD.
    Inventors: Liman Peng, Qi Liu, Jin Yang, Zihua Li, Yan Wu, Guoping Zhang, Haifeng Xu, Wenxiu Li, Lei Wang, Jianqiang Wang, Fan Yang
  • Patent number: 10961222
    Abstract: Provided are a chemical compound of an isocitrate dehydrogenase inhibitor, and an application thereof, belonging to the field of medicinal chemistry; specifically provided is the chemical compound represented by formula I, or its isomer, pharmaceutically acceptable salt, crystal, solvate, or prodrug, as well as their preparation methods and pharmaceutical compositions containing said chemical compound, and an application of said chemical compound or composition. The chemical compound has very good ability to inhibit mutant IDH2 enzyme activity and to inhibit mutant IDH2 neoplastic cells, and may be used for preventing and/or treating a tumor characterized by the presence of mutant IDH2.
    Type: Grant
    Filed: July 20, 2017
    Date of Patent: March 30, 2021
    Assignee: NANJING SANHOME PHARMACEUTICAL CO., LTD.
    Inventors: Yong Wang, Liwen Zhao, Xiaorong Liu, Yan Zhang, Dandan Huang, Chunhuan Jiang, Xinsheng Shi, Hongfeng Gu, Silin Pang, Wei Hai, Bingyang Ge
  • Patent number: 10962736
    Abstract: A camera module includes: a housing configured to accommodate a lens module; and an actuator configured to move the lens module in an optical axis direction, and including a magnet disposed in the lens module and a coil facing the magnet, wherein a convex portion and a first step difference portion stepped from the convex portion are disposed on one surface of the lens module, wherein the first step difference portion is offset to one side of the lens module, with respect to the one surface of the lens module, and wherein the magnet is disposed in the first step difference portion.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: March 30, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Kyung Kim, Dae Hyun Jeong
  • Patent number: 10964657
    Abstract: A radio-frequency module includes: a transmission power amplifier that includes first and second amplification transistors that are cascade connected to each other; and a mounting substrate that has first and second main surface that face each other, the transmission power amplifier being mounted on the first main surface. The first amplification transistor is arranged in a final stage and has a first emitter terminal. The second amplification transistor is arranged in a stage preceding the first amplification transistor and has a second emitter terminal. The mounting substrate has first to fourth ground electrode layers in order of proximity to the first main surface. The first emitter terminal and the second emitter terminal are not electrically connected to each other via an electrode on the first main surface and are not electrically connected to each other via the first ground electrode layer.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: March 30, 2021
    Assignee: MURATA MANUFACTURING CO.. LTD.
    Inventors: Katsunari Nakazawa, Takanori Uejima, Motoji Tsuda, Yuji Takematsu, Dai Nakagawa, Tetsuro Harada, Masahide Takebe, Naoya Matsumoto, Yoshiaki Sukemori, Mitsunori Samata, Yutaka Sasaki, Yuki Fukuda
  • Patent number: 10965223
    Abstract: An ultrasonic motor includes an actuator with a piezo-electric plate, at least one friction element, an element to be driven in active contact with the friction element, a tensioning device for pressing the friction element against the element to be driven, and a thermo-compensation platform having abutting sections by which displacement of the actuator is only possible along abutting side surfaces of the piezo-electric plate. The tensioning device includes two rotation angle levers of which two tension lever arms are connected to one another via a tensioned tension spring, to exert torque on the rotation angle lever such that pressure lever arms will act on the actuator to be linearly guided by the abutting sections in the direction of the element to be driven.
    Type: Grant
    Filed: June 9, 2017
    Date of Patent: March 30, 2021
    Assignee: PHYSIK INSTRUMENTE (PI) GMBH & CO. KG
    Inventors: Wladimir Wischnewskiy, Alexej Wischnewski
  • Patent number: 10962813
    Abstract: The present invention provides an optical isolator module, including: a plurality of optical devices, each comprising a Faraday rotator and being configured to have an optical isolator function upon application of a magnetic field, a magnet to apply the magnetic field to the Faraday rotator in each of the plurality of optical devices, wherein at least two optical devices of the plurality of optical devices are configured to have the optical isolator functions in different directions from each other, and each magnetic field applied with the magnet is in the same direction. This provides an optical isolator module that can be prevented from degradation of the performance such as increase of insertion loss and degradation of isolation due to magnetic field interference even when a plurality of optical isolators are close to each other.
    Type: Grant
    Filed: May 7, 2018
    Date of Patent: March 30, 2021
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventor: Toshiaki Watanabe
  • Patent number: 10960445
    Abstract: A wood chip fermentation device includes: a chip fermenter 11 that is charged with wood chips serving as a heat source and that ferments the wood chips; a temperature sensor 11a that is provided inside the chip fermenter 11 and measures the temperature inside the chip fermenter; a thermal energy extracting pipe 12 that is disposed inside the chip fermenter and extracts fermentation heat from inside the chip fermenter; a pump section 13 that supplies a medium to or takes out a medium from the thermal energy extracting pipe 12; a stirring blade 14a that stirs wood chips 10a put in the chip fermenter 11; and a discharge conveyor 15 that is disposed at a lower portion of the chip fermenter 11 and discharges fermented material. The stirring blade 14a is disposed between the thermal energy extracting pipes 12 and a rotating surface thereof is in a state of being parallel to the thermal energy extracting pipes 12.
    Type: Grant
    Filed: July 15, 2016
    Date of Patent: March 30, 2021
    Assignee: TAKEMURA ENGEI CO., LTD.
    Inventor: Junichi Takemura
  • Patent number: 10964734
    Abstract: Disclosed is an image sensor including a first device isolation layer in a semiconductor layer and defining a plurality of pixel regions, a first photoelectric conversion device and a second photoelectric conversion device that are in each of the pixel regions, and a second device isolation layer in the semiconductor layer vertically overlapping the first photoelectric conversion device and the second photoelectric conversion device.
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: March 30, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Eun Sub Shim
  • Patent number: 10960901
    Abstract: Disclosed are an electromagnetic transverse active damping system, and a control method and apparatus therefor. The electromagnetic transverse active damping system comprises an electromagnet controller, wherein the electromagnet controller can determine a value of a damper target gap for an electromagnet active damper according to acquired train transverse acceleration, train position information and train speed, and control the action of the electromagnet active damper according to the determined value of the damper target gap; and electrical control is employed during the control of the electromagnet active damper by the electromagnet controller.
    Type: Grant
    Filed: March 6, 2019
    Date of Patent: March 30, 2021
    Assignee: CRRC QINGDAO SIFANG CO., LTD.
    Inventors: Jianying Liang, Donghua Wu, Shi Xiao, Fujie Jiang, Yanmin Li
  • Patent number: 10964911
    Abstract: A thin-film encapsulation structure of an active-matrix organic light-emitting, diode (AMOLED) is provided, and a touch electrode layer is disposed thereon. The thin-film encapsulation structure includes a first ceramic layer, an organic layer, and a second ceramic layer. The second ceramic layer has a first film layer and a second film layer; a side end of the second film layer is contracted inward so that a recessed first step portion is defined at the side end of the second film layer and a side end of the first film layer. The second ceramic layer is changed into a design of a multi-layer stacked structure, and a recessed step portion is formed at the side ends of the upper and lower layers. Therefore, the traces can be placed in a larger space and resistant to line breakage, thereby ensuring the yield and product performance.
    Type: Grant
    Filed: August 23, 2018
    Date of Patent: March 30, 2021
    Assignee: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
    Inventor: Xuwen Cao
  • Patent number: 10965194
    Abstract: A rotor includes: a rotor core; a magnet that is arranged along an axial direction of a central axis of the rotor core; and a heat pipe that is arranged around the central axis of the rotor core, wherein the heat pipe includes: an operation liquid that is provided in an internal space of the heat pipe and that allows heat to move via evaporation and condensation; a heated part that extends so as to be parallel with the central axis, that receives heat from the magnet, and that is heated; and a cooled part that is arranged on one side in a longitudinal direction of the heated part and that is cooled, wherein the cooled part is slanted away from the central axis of the rotor core in a direction from the one side in the longitudinal direction of the heated part toward another side in the longitudinal direction of the heated part.
    Type: Grant
    Filed: March 5, 2019
    Date of Patent: March 30, 2021
    Assignee: HONDA MOTOR CO., LTD.
    Inventor: Takashi Kitahara
  • Patent number: 10966328
    Abstract: A display apparatus includes: a flexible display panel including a first display area, a second display area which is spaced apart from the first display area, and a folding area between the first display area and the second display area; a first supporting part under the flexible display panel corresponding to the first display area; a second supporting part under the flexible display panel corresponding to the second display area; and a first adhesive layer between the flexible display panel and the first and second supporting parts in the first display area, the second display area, and the folding area, and attached to the first and second supporting parts.
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: March 30, 2021
    Assignee: Samsung Display Co., Ltd.
    Inventors: Sung Chui Choi, Han Sun Ryou, Mansik Myeong, Dongwoo Seo
  • Patent number: 10965010
    Abstract: A terminal device includes a housing, including a first, second and third conductive side frames, two ends of the first side frame being connected with the second and third side frames respectively and the second and third conductive side frames being arranged opposite; a gap formed in the first conductive side frame; a feed point positioned between the second and third conductive side frames, arranged on a bearing plate and configured to input or output an electric signal; a first signal connection line connected with the feed point and first conductive side frame respectively; and a first grounding point positioned on the second or third conductive side frame, wherein the first signal connection line, the first conductive side frame between the feed point and first grounding point and the conductive side frame where the first grounding point is located transmit and receive a first wireless signal together.
    Type: Grant
    Filed: November 20, 2019
    Date of Patent: March 30, 2021
    Assignee: BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
    Inventor: Tao Jiao
  • Patent number: D914467
    Type: Grant
    Filed: November 27, 2020
    Date of Patent: March 30, 2021
    Assignee: Shenzhen Baozhixia Technology Co., Ltd.
    Inventor: Zhixia Xie
  • Patent number: D914630
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: March 30, 2021
    Assignee: BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
    Inventors: Kaiwen Li, Yanlin Xiao
  • Patent number: D914668
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: March 30, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jusuek Lee, Hyuntaik Lim