Abstract: A magnetic current sensor including a Wheatstone bridge circuit formed of four magnetoresistance devices; bias magnetic field application that applies a bias magnetic field to the magnetoresistance devices; and air-core coils provided on both sides of the Wheatstone bridge circuit. The Wheatstone bridge circuit generates a voltage corresponding to an induction magnetic field generated by a current to be measured flowing through the air-core coils. According to the magnetic current sensor and current measurement method, the linearity between a current and an output voltage is near 0 mA as a result of magnetic hysteresis being suppressed, and an increase in current and a reduction in size and cost are realized as a result of insulation between the current circuit side and the MR device side being excellent.

Abstract: A method of recognizing motion of an object may include periodically obtaining depth data of a first resolution and two-dimensional data of a second resolution with respect to a scene using an image capturing device, wherein the second resolution is higher than the first resolution; determining a motion tracking region by recognizing a target object in the scene based on the depth data, such that the motion tracking region corresponds to a portion of a frame and the portion includes the target object; periodically obtaining tracking region data of the second resolution corresponding to the motion tracking region; and/or analyzing the motion of the target object based on the tracking region data.

Abstract: Provided is a POS peripherals controlling device including: a wireless communication unit; an interface part including at least one interface unit; and a controller determining whether data received from a mobile POS host device through the wireless communication unit includes control data for controlling at least one POS peripheral connected through the interface part, when the received data includes control data, checking a target POS peripheral where the control data is to be delivered among the at least one peripheral, and transmitting control data included in the received data to the checked POS peripheral through a first interface unit connected to the checked target peripheral among the at least one interface unit, wherein the control data is generated by the mobile POS host device and is generated in a format corresponding to the target peripheral that is to receive the control data.

Abstract: A circuit board film-plated against corrosion of conductive traces comprises a substrate, at least one conductive circuit layer attached to the substrate, at least one plating film attached to a surface of the conductive circuit layer away from the substrate, and a covering film. Each of the at least one plating film comprises a surface away from the conductive circuit layer, and at least one side surface. The circuit board defines at least one through hole. Each of the at least one through hole passes through substrate, conductive circuit layer, and the plating film. The covering film covers the conductive circuit layer, the side surface of the plating film, and the through hole. The film-covered conductive circuit layer and the film-covered side surface of the plating film cannot be corroded. A method for making the circuit board is also provided.

Abstract: Closed circuit lines (33, 43, 53, 63) for connecting hydraulic cylinders (17, 18, 19) and closed circuit pumps (31, 41, 51, 61) are provided with a charge pressure adjustment apparatus (75) via a charge line (72) to variably adjust the pressure in the charge line (72). An operating device (12) for operating the hydraulic cylinders (17, 18, 19) and the charge pressure adjustment apparatus (75) are connected to a control device (81). In the case of extending the hydraulic cylinders (17, 18, 19), the control device (81) increases a set pressure of the charge pressure adjustment apparatus (75) to be high to increase the pressure in the bottom side of the hydraulic cylinders (17, 18, 19) in accordance with an operating amount of the operating device (12).

Abstract: A wiring substrate includes a first wiring layer on a surface of a first insulating layer; a via interconnect including a first portion connected to the first wiring layer and a second portion formed monolithically with the first portion and extending from an end of the first portion in a direction away from the first wiring layer; a second insulating layer on the first insulating layer; and a second wiring layer on the second insulating layer, contacting a first surface of the second portion. The area of a cross section of the first portion, parallel to the surface of the first insulating layer, increases as the position of the cross section approaches the first wiring layer from the second portion. The second portion includes a second surface that is opposite from its first surface and extends horizontally from the end of the first portion to overhang the first portion.

Abstract: An on-chip optical interconnection structure and network, where the on-chip optical interconnection structure includes M levels of optical switches, and mth-level optical switches in the M levels of optical switching devices include 2m-1 optical switches. Each optical switch in (i-1)th-level optical switches in the M levels of optical switches is coupled to two optical switches in ith-level optical switches. Two optical switches in the ith-level optical switches coupled to a same optical switch in the (i-1)th-level optical switches are coupled. The on-chip optical interconnection network is divided into levels, and switches coupled in a grid manner are formed such that hierarchical switching may be performed, and conflicts and delays in communication are reduced.

Abstract: A display device includes a display panel including a first and a second non-display area, a main active area, and a sub active area, wherein the active areas each include a matrix of sub-pixels; a data driver in the first non-display area to provide image data to the matrices of sub-pixels; a main gate driver in the second non-display area to provide a corresponding gate signal to each sub-pixel in the main active area; a sub gate driver in the second non-display area to provide a corresponding gate signal to each sub-pixel in the sub active area; an auto-probe test pad in the non-display area for transmitting a first start signal received from an auto-probe signal generating device to one of the main gate driver and the sub gate driver while testing the display panel; and a signal transmission circuit connecting the main gate driver and the sub gate driver.

Abstract: Provided is a method of manufacturing a coil unit in a thin film type for a compact actuator, and more particularly, a method of manufacturing a coil unit in a thin film type for a compact actuator in which a buffer layer is formed on a coil layer to prevent cracks in the coil layer and a substrate. According to the method of manufacturing the coil unit in a thin film type for a compact actuator of the present invention, the buffer layer is formed on the coil layer so that an impact to the coil layer during a back-grinding process for thinning a substrate is absorbed, thereby preventing the substrate and the coil layer from breaking due to the back-grinding process and compensating for a difference of deformation between the coil unit and the substrate according to a difference of coefficients of thermal expansion.

Abstract: A multilayer substrate includes a substrate body defined by a laminate of flexible insulating base materials, a short component, and tall components. The substrate body includes a first region and a second region. The first region is surrounded by the second region in plan view, and is shorter than the second region. The short component is mounted on a bottom surface of a recess defined by the first region and the second region. The tall components are embedded in the second region of the substrate body and are disposed at positions including the position of a mounting surface for the short component in the height direction of the substrate body and on both sides of the first region when the substrate body is viewed in plan.

Abstract: In a manufacturing method for a thermistor element (3) including: a thermistor portion (49) which is a sintered body formed from a thermistor material; and a pair of electrode wires (25) which are embedded in the thermistor portion (49) and at least one end portion of each of the electrode wires projects at an outer side of the thermistor portion (49), the resistance value of the thermistor element (3) is adjusted by performing a removal processing of removing a part of the thermistor portion (49).

Abstract: A display device is disclosed. In one aspect, the display device includes a data driver configured to generate an output signal corresponding to input image data, a signal divider configured to divide the output signal into a plurality of data signals, and provide the data signals to a plurality of pixels and a display unit including a matrix of pixels configured to receive the data signals. The signal divider includes a first via hole formed over a first source/drain wire configured to receive a driving voltage of each pixel, a second via hole formed over a second source/drain wire of the pixel and a pixel wire electrically connecting the first and second source/drain wires to each other respectively through the first via hole and the second via hole.

Abstract: A semiconductor device is provided with a semiconductor element having a plurality of electrodes, a plurality of terminals electrically connected to the plurality of electrodes, and a sealing resin covering the semiconductor element. The sealing resin covers the plurality of terminals such that a bottom surface of the semiconductor element in a thickness direction is exposed. A first terminal, which is one of the plurality of terminals, is disposed in a position that overlaps a first electrode, which is one of the plurality of electrodes, when viewed in the thickness direction. The semiconductor device is provided with a conductive connection member that contacts both the first terminal and the first electrode.

Abstract: A tablet for a plasma coating system having a first part that includes a first material having a first sublimation point at a first pressure and a second part that is disposed on the first part and comprises a second material having a second melting point at the first pressure, wherein the second melting point is lower than the first sublimation point.

Abstract: The present invention relates to a multi-band radiating element comprising: a first high frequency radiating element formed on the upper surface of a substrate; one or more first low frequency parasitic elements formed on the upper surface of the substrate and formed at a predetermined distance from the first high frequency radiating element in the direction of the outer edge of the substrate; one or more second low frequency parasitic elements formed on the upper surface of the substrate and formed at a predetermined distance from the first high frequency radiating element in the direction of the outer edge of the substrate; a second high frequency radiating element formed on the bottom surface of the substrate; and a reflector formed at a predetermined distance from the bottom surface of the substrate.

Abstract: A column driver includes: an output stage including: a first transistor and a second transistor coupled in series between an output high voltage source and an output low voltage source; and an output node between the first transistor and the second transistor, the first transistor and the second transistor being configured to control an output voltage of the output node in an output voltage range; a first operational amplifier having a first operating voltage range, an output of the first operational amplifier being connected to a gate electrode of the first transistor, the first operating voltage range being smaller than the output voltage range; a second operational amplifier having a second operating voltage range, an output of the second operational amplifier being connected to a gate electrode of the second transistor; and a feedback network coupled between the output node and non-inverting inputs of the first and second operational amplifiers.

Abstract: A near field communications (NFC) device includes a receiving module and a transmitting module. The receiving module includes a receiver receiving an analog signal that includes a carrier signal and data, an analog-to-digital converter converting the analog signal to a digital signal, and a filter filtering the digital signal. The transmitting module includes a direct current-direct current (DC-DC) converter having an operating frequency belonging to a stop band of the filter, and a transmitter receiving power from the DC-DC converter and receiving a system clock signal.

Abstract: Provided is a touch member includes a folding region folded around a folding axis and a non-folding region adjacent to the folding region. The touch member includes a first conductive pattern disposed in the folding region and a second conductive pattern disposed in the non-folding region. The touch member also includes an air gap defined inside the first conductive pattern. The touch member is configured to detect an external signal.

Abstract: A pseudo resistance circuit is disclosed that is capable of suppressing fluctuation in resistance value with fluctuation in process or temperature and facilitating adjustment. The pseudo resistance circuit includes a first MOSFET, a second MOSFET, a first current source which generates a first current substantially proportional to absolute temperature, and voltage source which generates a first voltage, which is a substantially linear function of absolute temperature. The gate of the first MOSFET and the gate of the second MOSFET are connected together, the second MOSFET is diode-connected, the first current is supplied to the drain of the second MOSFET, the first voltage is applied to the source of the second MOSFET, and a resistor having a resistance value according to the gate voltage of the first MOSFET is formed between the drain and the source of the first MOSFET.

Abstract: The invention relates to an electrically operated food processor (1) for preparing a cooked product, which exhibits a basic unit (14), a vessel (2) with an agitator (18) that can be inserted into the basic unit (14), a heating device (9) allocated to the vessel (2), a temperature sensor (5), a transceiver device (12) for communicating with the temperature sensor (5), and an evaluator (13) for evaluating the measurement data received from the temperature sensor (5). In order to provide an electric food processor (1) with an alternative connection between the temperature sensor (5) and evaluator (13), it is proposed that the temperature sensor (5) be a surface acoustic wave sensor (SAW sensor).