Patents Assigned to "A" Co.
  • Patent number: 12250873
    Abstract: A light emitting device includes a first electrode, a second electrode disposed on the first electrode, and an emission layer disposed between the first electrode and the second electrode, wherein the emission layer includes a first host represented by Formula 1, a second host different from the first host, and a dopant containing an organometallic complex, and thereby an improved service life characteristic may be exhibited:
    Type: Grant
    Filed: August 19, 2021
    Date of Patent: March 11, 2025
    Assignee: Samsung Display Co., Ltd.
    Inventors: Yoonkyoo Lee, Jin-Won Sun
  • Patent number: 12250874
    Abstract: An organic electroluminescence device is provided and including a first electrode, a hole transport region disposed on the first electrode, an emission layer disposed on the hole transport region, an electron transport region disposed on the emission layer, and a second electrode disposed on the electron transport region, wherein the emission layer may include an organometallic compound, thereby exhibiting high luminous efficiency and long service life characteristics.
    Type: Grant
    Filed: September 9, 2021
    Date of Patent: March 11, 2025
    Assignee: Samsung Display Co., Ltd.
    Inventors: Eunsoo Ahn, Soo-Byung Ko, Haejin Kim, Sujin Shin, Hyunjung Lee, Junghoon Han
  • Patent number: 12250877
    Abstract: An organic light-emitting device includes: a first electrode; a second electrode; m emission units; and m?1 charge generation layer(s), each including an n-type charge generation layer and a p-type charge generation layer and being located between two emission units. The m emission units each include a hole transport region, an electron transport region, and an emission layer between the hole transport region and the electron transport region. An mth electron region included in an mth emission layer that is closest among the m emission units to the second electrode includes an mth electron transport layer. The mth electron transport layer is a single layer consisting of a first compound, the mth emission layer included in the mth emission unit includes a second compound, and the mth electron transport layer and the mth emission layer may be different from each other.
    Type: Grant
    Filed: April 23, 2021
    Date of Patent: March 11, 2025
    Assignee: Samsung Display Co., Ltd.
    Inventors: Namsu Kang, Jin Kim, Jongwon Lee, Hyunshik Lee, Jaehoon Hwang
  • Patent number: 12250883
    Abstract: A compound may include a partial structures of formula (3-1A), (32h), and (3-11B) in one molecule, R300 to R306 being independently H or a substituent, or adjacent pair(s) form a ring, at least one of R301 to R306 is a single bond to another atom/structure in the molecule, and one of R301 to R306 is a single bond to the partial structure of formula (32h), X30 is N bonded to the partial structure of formula (3-1A), Y41 to Y48 are independently CR32, or C bonded to another atom/structure in the molecule, at least one of Y41 to Y48 is C bonded to the partial structure of formula (3-11B), R32 are independently H or a substituent, or pair(s) of adjacent R32 are bonded to form a ring, and at least one R32 is independently a single bond to another atom/structure in the molecule.
    Type: Grant
    Filed: May 20, 2024
    Date of Patent: March 11, 2025
    Assignee: IDEMITSU KOSAN CO., LTD.
    Inventors: Takushi Shiomi, Toshinari Ogiwara, Hiromi Nakano
  • Patent number: 12250884
    Abstract: A light-emitting element which has low driving voltage and high emission efficiency is provided. The light-emitting element includes, between a pair of electrodes, a hole-transport layer and a light-emitting layer over the hole-transport layer. The light-emitting layer contains a first organic compound having an electron-transport property, a second organic compound having a hole-transport property, and a light-emitting third organic compound converting triplet excitation energy into light emission. A combination of the first organic compound and the second organic compound forms an exciplex. The hole-transport layer contains at least a fourth organic compound whose HOMO level is lower than or equal to that of the second organic compound and a fifth organic compound whose HOMO level is higher than that of the second organic compound.
    Type: Grant
    Filed: May 18, 2023
    Date of Patent: March 11, 2025
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Hiromi Seo, Satoshi Seo, Satoko Shitagaki
  • Patent number: 12250886
    Abstract: A vibration device includes a light-transmissive cover, a piezoelectric element to vibrate the light-transmissive cover, at least one vibration body connected to the piezoelectric element, at least one power feed conductor in contact with the piezoelectric element and feeding power to the piezoelectric element, and at least one elastic portion to press the at least one power feed conductor against the piezoelectric element.
    Type: Grant
    Filed: June 24, 2021
    Date of Patent: March 11, 2025
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Nobumasa Kitamori
  • Patent number: 12250772
    Abstract: An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at multilayer body end surfaces and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surfaces and the board side surfaces. One of the board main surfaces is in a vicinity of the electronic element and is joined with one of the multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. A maximum length of the interposer board is smaller than a length of the electronic element. A width of the interposer board is smaller than a width of the electronic element.
    Type: Grant
    Filed: April 23, 2024
    Date of Patent: March 11, 2025
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Satoshi Yokomizo, Shinobu Chikuma, Yohei Mukobata
  • Patent number: 12250798
    Abstract: An electronic device includes a first electrical element, a heat dissipation sheet having a heat diffusion member for diffusing the heat generated from the first electrical element, and an anti-shock member arranged to be stacked with at least a part of the heat diffusion member; and a bracket which provides a space for accommodating the heat dissipation sheet. The heat dissipation sheet includes a first area, a second area, and a third area arranged between the first area and the second area.
    Type: Grant
    Filed: October 27, 2022
    Date of Patent: March 11, 2025
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Haein Chung, Kyungha Koo, Kangsik Kim, Wonmin Kim
  • Patent number: 12250799
    Abstract: An imaging device according to the present disclosure includes a front case, a rear case, and a shield member. The front case supports an imaging optical unit. The rear case includes an electrically conductive output mechanism configured to output a signal output from the imaging optical unit. The shield member electrically connects the front case and the output mechanism.
    Type: Grant
    Filed: December 1, 2023
    Date of Patent: March 11, 2025
    Assignee: Panasonic Automotive Systems Co., Ltd.
    Inventors: Yasutaka Matsumoto, Makoto Saito, Yoshihisa Shimazu, Keiichi Ujita
  • Patent number: 12250807
    Abstract: A semiconductor device includes a semiconductor structure including a semiconductor substrate having an active zone with a channel; a through silicon via (TSV) structure including a power TSV configured to transmit power and a signal TSV configured to transmit a signal; and a keep-out zone located a predetermined distance away from the TSV structure and bounded by the active zone. The TSV structure penetrates the semiconductor substrate. The keep-out zone includes a first element area a first distance away from the power TSV, and a second element area a second distance away from the signal TSV.
    Type: Grant
    Filed: October 7, 2021
    Date of Patent: March 11, 2025
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jaesan Kim, Seunghan Woo, Haesuk Lee, Youngcheon Kwon, Reum Oh
  • Patent number: D1065833
    Type: Grant
    Filed: April 20, 2023
    Date of Patent: March 11, 2025
    Assignee: Jackie Crowe Ltd. Co.
    Inventor: Ann Malone
  • Patent number: D1066579
    Type: Grant
    Filed: April 12, 2021
    Date of Patent: March 11, 2025
    Assignee: KOHLER CO.
    Inventor: Viraj Navin Chauhan
  • Patent number: D1066583
    Type: Grant
    Filed: April 29, 2024
    Date of Patent: March 11, 2025
    Assignee: DORNBRACHT AG & CO. KG
    Inventor: Michael Sieger
  • Patent number: D1066587
    Type: Grant
    Filed: April 13, 2023
    Date of Patent: March 11, 2025
    Assignee: WENZHOU YUTONG TECHNOLOGY CO,. LTD.
    Inventor: Hui Chen
  • Patent number: D1066609
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: March 11, 2025
    Assignee: SIEMENS ENERGY GLOBAL GMBH & CO. KG
    Inventors: Simon Svanstroem, Frank Rubensdoerffer, Daniel Loerstad
  • Patent number: D1066625
    Type: Grant
    Filed: June 10, 2022
    Date of Patent: March 11, 2025
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Eunha Choi
  • Patent number: D1066637
    Type: Grant
    Filed: April 7, 2022
    Date of Patent: March 11, 2025
    Assignee: AIR COOL INDUSTRIAL CO., LTD.
    Inventor: Cliff Wang
  • Patent number: D1066638
    Type: Grant
    Filed: April 7, 2022
    Date of Patent: March 11, 2025
    Assignee: AIR COOL INDUSTRIAL CO., LTD.
    Inventor: Cliff Wang
  • Patent number: D1066644
    Type: Grant
    Filed: September 18, 2023
    Date of Patent: March 11, 2025
    Assignee: Shenzhen Desida Technology Co., Ltd
    Inventor: Yuyu Cao
  • Patent number: D1066645
    Type: Grant
    Filed: April 14, 2023
    Date of Patent: March 11, 2025
    Assignee: CERES CHILL CO.
    Inventors: Elizabeth Joy Myers, Christopher Hamlin, Dylan Piper-Kaiser, Robert Carrasca