Patents Assigned to "A" Company
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Publication number: 20240174857Abstract: The present application discloses novel polyesteramides comprising cycloalkyl diols and/or cycloalkyl dialkanols with tunable properties based on the monomers and monomerratios used to prepare the polyesteramides and varying the reaction conditions. The present application also discloses compositions and articles.Type: ApplicationFiled: January 23, 2024Publication date: May 30, 2024Applicant: Eastman Chemical CompanyInventors: Emmett Dudley Crawford, Scott Ellery George, Kaan Gunes, Paul Hastings, Aristotelis Karagiannis, Aireal Denise Pressley, Pinguan Zheng
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Publication number: 20240177014Abstract: An apparatus for predicting a collision of a vehicle with a surrounding object around the vehicle includes: a surrounding object information detection unit configured to obtain current state information on the object; a lane detection unit configured to obtain information on a lane on which the vehicle travels; a risk level determination unit configured to calculate a collision risk level between the object and the vehicle using state information on the object; a surrounding environment prediction unit configured to predict future state information on the object using an estimation algorithm or a deep learning algorithm; an information integration unit configured to integrate the current state information, the lane information, the collision risk level, and the future state information to generate a simplified bird's eye view; and a collision mode determination unit configured to predict collision modes by using the simplified bird's eye view.Type: ApplicationFiled: May 30, 2023Publication date: May 30, 2024Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, AJOU UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATIONInventors: Jang-Ho Shin, Bong-Sob Song, Sung-Woo Lee
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Publication number: 20240176554Abstract: An image processing apparatus includes a memory that stores a minimum size of output that the image processing apparatus can output and circuitry. The circuitry is to determine a size of a document, output an image of the document in a case that the size of the document is determined to be smaller than the minimum size of the output, and output a notification prompting for confirmation in a case that the size of the document is determined not to be smaller than the minimum size of the output.Type: ApplicationFiled: October 30, 2023Publication date: May 30, 2024Applicant: Ricoh Company, Ltd.Inventor: Tsuyoshi Ishikawa
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Publication number: 20240174893Abstract: An adhesive composition including a polymerizable monomer having a (meth)acryloyl group; a radical polymerization initiator; and a polymer particle having a property of being swollen by an organic solvent, in which in a particle size distribution of secondary particles which are aggregates of the polymer particles, the secondary particles being in the adhesive composition and the particle size distribution being determined by a laser diffraction/scattering method, a proportion of secondary particles having a diameter of 1 ?m or more and 200 ?m or less is 30% by volume or more.Type: ApplicationFiled: March 23, 2022Publication date: May 30, 2024Applicant: DENKA COMPANY LIMITEDInventors: Yusuke TAKAHASHI, Chiaki TAKANO, Hiroyuki KURIMURA
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Publication number: 20240176042Abstract: A method may include imaging a portion of a subterranean formation to obtain a formation image. The formation image may be analyzed to identify one or more nodular evaporite deposits in the portion of the subterranean formation. One or more deposit characteristics may be determined for each of the one or more nodular evaporite deposits, the one or more deposit characteristics comprising a cross-sectional area, a volume, a roundness index, a vertical depth relative to the subterranean formation, a degree of occlusion, an overlap of deposits, or any combination thereof. The portion of the subterranean formation may be classified into a diagenetic rock facies based on the one or more deposit characteristics of each of the one or more nodular evaporite deposits per unit volume and a number of the one or more nodular evaporite deposits per the unit volume.Type: ApplicationFiled: November 30, 2022Publication date: May 30, 2024Applicant: SAUDI ARABIAN OIL COMPANYInventors: Aqeel M. KHALIFA, Mandefro B. WOLDEAMANUEL
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Publication number: 20240173707Abstract: Methods for synthesizing a mesoporous nano-sized zeolite beta are described. The method includes preparing an aqueous hexadecyltrimethylammonium bromide (CTAB) solution and adding nano-sized zeolite particles having a BEA framework type, a particle size of less than or equal to 100 nm, and a microporous framework with a plurality of micropore s having diameters of less than or equal to 2 nm to form a second solution. The second solution does not include a base. The method further includes transferring the second solution to an autoclave operated at 25° C. to 200° C. for 3 to 24 hours to form a colloid; washing the colloid with water to form a washed colloid; drying the washed colloid at 100° C. to 200° C. for 4 to 24 hours to form a zeolite precursor; and calcining the zeolite precursor at 250° C. to 600° C. for 1 to 8 hours to form the mesoporous nano-sized zeolite beta.Type: ApplicationFiled: November 29, 2022Publication date: May 30, 2024Applicant: Saudi Arabian Oil CompanyInventors: Lianhui Ding, Khalid Otaibi, Faisal Alotaibi
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Publication number: 20240178228Abstract: A semiconductor device and a logic device formed of the semiconductor device are provided. The semiconductor device includes a first field effect transistor (FET), disposed on a semiconductor substrate, and including vertically separated first channel structures formed as thin sheets each having opposite major planar surfaces facing toward and away from the semiconductor substrate; and a second FET, disposed on the semiconductor substrate and overlapped with the first FET. A conductive type of the second FET is complementary to a conductive type of the first FET. Second channel structures of the second FET are separately arranged along a lateral direction, and formed as thin walls.Type: ApplicationFiled: February 7, 2023Publication date: May 30, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hung-Li Chiang, Jer-Fu Wang, Iuliana Radu
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Publication number: 20240173706Abstract: Methods for synthesizing a mesoporous nano-sized zeolite beta are described. The method may include mixing an aqueous base solution with hexadecyltrimethylammonium bromide (CTAB) to form a first solution; adding nano-sized zeolite particles having a particle size of less than or equal to 100 nm to the first solution to form a second solution. The nano-sized zeolite particles include a microporous framework with a plurality of micropores having diameters of less than or equal to 2 nm and a BEA framework type. The method may further include transferring the second solution to an autoclave operated at 25° C. to 200° ° C. for 3 to 24 hours to form a colloid; drying the colloid at 100° C. to 200° C. for 8 to 36 hours without washing the colloid to form a zeolite precursor; and calcining the zeolite precursor at 250° ° C. to 600° ° C. for 1 to 8 hours to form the mesoporous nano-sized zeolite beta.Type: ApplicationFiled: November 29, 2022Publication date: May 30, 2024Applicant: Saudi Arabian Oil CompanyInventors: Lianhui Ding, Khalid Otaibi, Faisal Alotaibi
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Publication number: 20240178086Abstract: Disclosed are a package, a package structure and a method of manufacturing a package structure. In one embodiment, the package includes a die, a plurality of through vias, at least one dummy structure, an encapsulant and a redistribution structure. The plurality of through vias surround the die. The at least one dummy structure is disposed between the die and the plurality of through vias and adjacent to at least one corner of the die. The encapsulant encapsulates the die, the plurality of through vias and the at least one dummy structure. The redistribution structure is disposed on the die, the plurality of through vias, the at least one dummy structure and the encapsulant and electrically connected to the die and the plurality of through vias.Type: ApplicationFiled: February 14, 2023Publication date: May 30, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Che-Yu Yeh, Chien-Chia Chiu, Hua-Wei Tseng, Wan-Yu Lee
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Publication number: 20240174070Abstract: In a vibration damping device in which a separate stopper member is accommodated in an accommodation recess opening in an axial direction, a retaining part protruding toward an inner circumference is provided at an opening of the accommodation recess. The stopper member having a substantially quadrilateral outer shape is provided with lip-shaped parts protruding from the corner portions toward the outer circumference, and the lip-shaped part is located in the accommodation recess further inward than the retaining part and overlaps the retaining part in the axial projection. A rod insertion hole is formed through the stopper member in the axial direction, and a pair of facing side portions on an outer circumferential surface of the stopper member are spaced apart from an inner circumferential surface of the accommodation recess to an inner circumference in a region extending to both outer sides of the rod insertion hole between the lip-shaped parts.Type: ApplicationFiled: October 18, 2023Publication date: May 30, 2024Applicant: Sumitomo Riko Company LimitedInventor: Taiki Kouketsu
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Publication number: 20240173630Abstract: An object is to provide a user with motivation to enjoy waking up in the morning and guide the user to sufficient awakening by generating a breeding event in a breeding game of a virtual life form when the user wakes up in the morning. A game server that manages progress of a breeding game of a virtual life form can provide a user with motivation to enjoy waking up in the morning and guide the user to sufficient awakening by generating a breeding event in a breeding game of a virtual life form when the user wakes up in the morning. The game server includes circuitry configured to acquire a wake-up time of a user; and a update the breeding game in accordance with the acquired wake-up time.Type: ApplicationFiled: February 7, 2024Publication date: May 30, 2024Applicant: The Pokémon CompanyInventors: Takayuki SHINDO, Satoshi OGAWA, Kaname KOSUGI, Marie SHUTO, Koya NAKAHATA
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Publication number: 20240175095Abstract: The present invention provides a method for amplifying, in a reaction solution, at least one target gene having a GC content of at least 60%, wherein the method contains a step of amplifying a specific base sequence in a target gene by using a primer set consisting of a first primer and a second primer for target gene amplification, and wherein one primer in the primer set is added to the reaction solution at a molar ratio higher than the other primer and neither primer is a hot start primer that contains an inactivating chemical modification that is restored by an action of an activating enzyme.Type: ApplicationFiled: March 24, 2022Publication date: May 30, 2024Applicants: Denka Company Limited, Toho UniversityInventors: Kazuhiro TATEDA, Yuya MIYATAKE
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Publication number: 20240176132Abstract: A movable device includes a movable portion; a driver connected to the movable portion, the driver to drive the movable portion; a reflector having a reflecting surface to reflect light; a connector connecting the movable portion and the reflector in a connection direction intersecting the reflecting surface; and a reinforcement. The reinforcement has at least one of: an extension portion from the reflector toward the movable portion, or another extension portion from the movable portion toward the reflector.Type: ApplicationFiled: November 24, 2023Publication date: May 30, 2024Applicant: Ricoh Company, Ltd.Inventors: Mizuki Shinkawa, Daiki Minegishi
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Publication number: 20240175310Abstract: A door opening and closing device for a vehicle includes a door for opening and closing a door opening formed in a vehicle body, a spindle mounted in a longitudinal direction of the vehicle body and configured to rotate, and a door arm of which a first end portion thereof is rotatably connected to a first end portion of the door, and a second end portion may be configured to move and rotate according to a rotation of the spindle.Type: ApplicationFiled: October 13, 2023Publication date: May 30, 2024Applicants: Hyundai Motor Company, Kia CorporationInventors: Jaeseung LEE, Gookhyun JEON
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Publication number: 20240174466Abstract: A sheet conveying device includes a sheet stacker, an air blower, and a guide. The sheet stacker stacks a plurality of sheets. The air blower blows air onto the plurality of sheets. The guide faces an uppermost sheet of the plurality of sheets on the sheet stacker and contacts the uppermost sheet at a plurality of positions of the guide spaced apart from each other in a sheet conveyance direction.Type: ApplicationFiled: November 7, 2023Publication date: May 30, 2024Applicant: Ricoh Company, Ltd.Inventor: Satoshi KOHARA
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Publication number: 20240176365Abstract: A control method, executed by a control device, controlling a robot comprising a wheel leg portion and a base portion, the wheel leg portion and the base portion comprising a plurality of joints, the method including obtaining motion information of the robot and motion information of a sphere placed on the base portion of the robot, determining, based on the motion information of the robot and the motion information of the sphere when passivity based control is performed on the sphere and the base portion, base control information for controlling the base portion and balancing the sphere on the base portion, determining, based on the base control information, a control torque for controlling each joint of the plurality of joints, and controlling each joint based on the corresponding control torque.Type: ApplicationFiled: February 2, 2024Publication date: May 30, 2024Applicant: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITEDInventor: Jingfan ZHANG
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INFORMATION PROCESSING APPARATUS, INFORMATION PROCESSING METHOD, AND NON-TRANSITORY RECORDING MEDIUM
Publication number: 20240177063Abstract: An information processing apparatus, an information processing method, and a non-transitory recording medium. The information processing apparatus receives at least one of information indicating a local model or output data, from each of a plurality of nodes, the information indicating the local model being obtained by learning a local data processed by the node based on a global model, the output data being obtained by inputting shared data to the local model, updates the global model based on at least one of a plurality of the information indicating the local model or a plurality of the output data received from the plurality of nodes, and calculates contribution degree of at least one of each of the plurality of local models or each of the plurality of output data to the updated global model.Type: ApplicationFiled: November 20, 2023Publication date: May 30, 2024Applicant: Ricoh Company, Ltd.Inventor: Tomoyasu Aizaki -
Publication number: 20240179814Abstract: An illumination device, system, and method are provided herein for emulating sunlight along a daytime or nighttime locus. Color temperature is determined using a first color temperature curve that includes data representative of a first color temperature as a function of a time of day. In response to a request to a change in brightness of one or more LED chains, a target color temperature output as a function of the current time of day is determined using a second color temperature curve based on the requested change in brightness. The second color temperature curve includes the target color temperature corresponding to the determined current time of day. The target color temperature output includes a lesser change in color temperature at solar noon than the change in color temperature at sunrise and sunset.Type: ApplicationFiled: February 6, 2024Publication date: May 30, 2024Applicant: Lutron Technology Company LLCInventors: Nav Sooch, Horace C. Ho, Rebecca Frank, Jason E. Lewis, Ryan Matthew Bocock
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Publication number: 20240178150Abstract: A semiconductor device package structure is provided, including a redistribution structure, a first semiconductor device, a second semiconductor device, a bridge die, a first conductive bump, and a second conductive bump bumps, a third conductive bumps, and a first solder material. The first semiconductor device is disposed on a first side of the redistribution structure, the second semiconductor device and the bridge die are disposed on a second side opposite to the first side. The first conductive bump is disposed on the first semiconductor device, the second conductive bump is disposed on the second side of the redistribution structure and the third conductive bump is disposed on the second semiconductor device. The first solder material is electrically connected between the second conductive bump and the third conductive bump, and the redistribution structure is electrically connected between the first conductive bump and the second conductive bump.Type: ApplicationFiled: January 19, 2023Publication date: May 30, 2024Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Tzuan-Horng LIU, Hao-Yi TSAI, Tsung-Yuan YU
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Publication number: 20240178095Abstract: A semiconductor device includes a substrate, a first device, a second device, a ring structure, a lid structure, and a first adhesive layer. The first device is disposed on the substrate. The second device is adjacent to the first device and is disposed on the substrate. The ring structure is disposed over the substrate and the second device. The ring structure includes a cover and a leg extending out from the cover. The cover has a through opening. The lid structure is disposed over the ring structure and the first device. The lid structure includes a body and a protrusion protruding from the body. The protrusion of the lid structure is inserted into the through opening of the cover of the ring structure. The first adhesive layer is disposed between the body of the lid structure and the cover of the ring structure and includes phase change thermal interface material.Type: ApplicationFiled: February 10, 2023Publication date: May 30, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wensen Hung, Tsung-Yu Chen, Meng-Tsan Lee