Patents Assigned to "A" Company
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Publication number: 20240043817Abstract: The present invention provides, among other things, improved methods for purifying I2S protein produced recombinantly for enzyme replacement therapy. The present invention is, in part, based on the surprising discovery that recombinant I2S protein can be purified from unprocessed biological materials, such as, I2S-containing cell culture medium, using a process involving as few as four chromatography columns.Type: ApplicationFiled: November 3, 2022Publication date: February 8, 2024Applicant: Takeda Pharmaceutical Company LimitedInventor: Dave Nichols
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Publication number: 20240047401Abstract: A package structure is provided. The package structure includes an interposer substrate including an insulating structure, a conductive pad, a first conductive line, and a first conductive via structure. The package structure includes an electronic device bonded to the conductive pad. The package structure includes a chip structure bonded to the first end portion of the first conductive via structure. The package structure includes a first conductive bump connected between the chip structure and the first end portion of the first conductive via structure. The first end portion protrudes into the first conductive bump and is in direct contact with the first conductive bump.Type: ApplicationFiled: October 17, 2023Publication date: February 8, 2024Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Meng-Liang LIN, Po-Yao CHUANG, Shin-Puu JENG
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Publication number: 20240042338Abstract: A top toy is used in a game table including a guide member having a guide surface on which first teeth are formed at an equal interval. The top toy includes a shaft part, a body being configured on the shaft, and a trunk part being configured on the shaft. The shaft includes second teeth that are engageable with the first teeth on an outer periphery thereof.Type: ApplicationFiled: October 28, 2021Publication date: February 8, 2024Applicant: TOMY COMPANY, LTD.Inventor: Yohei BANDO
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Publication number: 20240046518Abstract: A device for calibrating a camera of a vehicle includes: a first camera for acquiring a first image, a second camera for acquiring a second image, and a processor that extracts a first class of interest from the first image, and extracts a second class of interest from the second image. The processor projects pixel coordinates of the first class of interest onto the second image to convert the pixel coordinates, and corrects parameters of the second camera such that a difference between the converted pixel coordinates of the first class of interest and pixel coordinates of the second class of interest is minimized.Type: ApplicationFiled: December 19, 2022Publication date: February 8, 2024Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATIONInventor: Jong Min Park
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Publication number: 20240047510Abstract: A fabrication method includes: forming, over a first dielectric layer between a first metal portion and a second metal portion, a thin film resistor (TFR); forming openings in the first dielectric layer over the first metal portion and the second metal portion; and forming a first bond pad in an opening over the first metal portion and a second bond pad in an opening over the second metal portion; wherein the first dielectric layer is disposed between the first bond pad and the second bond pad, the TFR is formed over the first dielectric layer between the first bond pad and the second bond pad, the TFR has an electrical connection at a first end to the first bond pad and an electrical connection at a second end to the second bond pad, and the TFR provides a resistive path between the first bond pad and the second bond path.Type: ApplicationFiled: August 4, 2022Publication date: February 8, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chun-Tsung Kuo, Ming Chyi Liu
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Publication number: 20240047088Abstract: Provided herein is a nuclear fuel assembly for a pressurized water reactor. The nuclear fuel assembly comprises: a plurality of nuclear fuel rods configured to contain a fissile material, wherein the nuclear fuel assembly is configured such that a hydrogen to uranium ratio for the fuel assembly, when coolant and the fissile material are present under operating conditions, is at least 4.0. Also provided herein is a method for refueling a pressurized water nuclear reactor comprising a nuclear fuel assembly of the present disclosure.Type: ApplicationFiled: December 7, 2021Publication date: February 8, 2024Applicant: Westinghouse Electric Company LLCInventors: David L. STUCKER, Ho Q. LAM
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Publication number: 20240047308Abstract: A semiconductor package includes a substrate, a composite seed-barrier layer, a routing via, and a semiconductor die. The substrate has a through hole formed therethrough. The composite seed-barrier layer extends on sidewalls of the through hole and includes a first barrier layer, a seed layer, and a second barrier layer sequentially stacked on the sidewalls of the through hole. The routing via fills the through hole and is separated from the substrate by the composite seed-barrier layer. The semiconductor die is electrically connected to the routing via. Along the sidewalls of the through holes, at a level height corresponding to half of a total thickness of the substrate, the seed layer is present as inclusions of seed material surrounded by barrier material of the first barrier layer and the second barrier layer.Type: ApplicationFiled: October 5, 2023Publication date: February 8, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wei-Chung Chang, Ming-Che Ho, Hung-Jui Kuo
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Publication number: 20240049220Abstract: The application provides a method and device in a node for wireless communications. A node receives a first information block and receives a first DCI format, the first information block is used to determine the first DCI format; the node transmits a first PUSCH, a waveform adopted by the first PUSCH is a target waveform, the target waveform is one of X1 candidate waveforms; the first DCI format at least comprises a first field and a second field, and a value of the first field is used to determine the target waveform; a target power value is equal to a transmission power value of the first PUSCH, and the target power value is equal to a smaller value between a first upper limit value or a first power value. The present application improves the transmission performance of uplink.Type: ApplicationFiled: August 1, 2023Publication date: February 8, 2024Applicant: SHANGHAI LANGBO COMMUNICATION TECHNOLOGY COMPANY LIMITEDInventors: Zheng LIU, Xiaobo ZHANG
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Publication number: 20240042735Abstract: Provided is a liquid (e.g., ink) storage member for coating tools to reduce the consumption of plastic and the environmental impact by substituting paper base material for plastics such as polypropylene. The liquid storage member has at least three layers as follows: an inner layer made of paper base material and an intermediate layer of a paper base laminate comprising a metal layer or a silica vapor deposition layer formed on the outer surface side of the paper-based inner layer; and an outer layer made of paper base material formed on the outer surface side of the intermediate layer. The paper base laminate is wound into a spiral shape and on the outer surface side of the intermediate layer, the outer layer is also wound into a spiral shape. A polyolefin resin-containing adhesive layer lies in between the inner and intermediate layers and/or between the intermediate and outer layers.Type: ApplicationFiled: December 17, 2021Publication date: February 8, 2024Applicant: MITSUBISHI PENCIL COMPANY, LIMITEDInventors: Saki TANAKA, Takayuki YAMAGUCHI, Yuichi INAGAWA
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Publication number: 20240044489Abstract: A flare tip assembly includes a barrel having a barrel wall with an inner surface and an outer surface, an interior cavity defined within the inner surface and extending axially through the barrel, and internal channels formed through the barrel wall. The internal channels have a first opening at a lower axial end of the barrel wall and a second opening at an opposite, upper axial end of the barrel wall, and the internal channels are enclosed between the inner surface and the outer surface of the barrel wall. The flare tip assembly further includes a pilot positioned proximate to the upper axial end of the barrel.Type: ApplicationFiled: August 5, 2022Publication date: February 8, 2024Applicant: SAUDI ARABIAN OIL COMPANYInventors: Qasem Jawad Alhassan, Min Hyun Cho, Sayee Prasad Raghunathan, Abdulaziz Hassan Al Tijani, Mohammad Hanif Khankhara
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Publication number: 20240047458Abstract: A FinFET device includes a first fin and a second fin on a substrate, a dielectric fin, a metal gate line, a gate dielectric layer, a gate isolation structure. The dielectric fin is located between the first fin and the second fin. The metal gate line is across the first fin, the dielectric fin and the second fin. The gate dielectric layer is located between the metal gate line and the dielectric fin, between the metal gate line and the first fin, and between the metal gate line and the second fin. The gate isolation structure extends through the first metal gate line and the gate dielectric layer, and landing on the dielectric fin. A top surface of the gate dielectric layer is lower than a top surface of the gate isolation structure.Type: ApplicationFiled: August 5, 2022Publication date: February 8, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Shu-Uei Jang, Shih-Yao Lin
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Publication number: 20240047171Abstract: The present invention is directed to an electrode component with at least two electrodes or a multipole component as generally known in the art. Each of the electrodes can be provided with a beam neighboring section or end section forming the free electrodes. This section is the section exposed to high voltages, i.e. more than 10 KV, and is intended to nevertheless work very reliable and precise with respect to the guidance and/or controlling of a beam of a charged particle beam in a microscope or lithographic apparatus. This neighboring section are positioned in the vicinity or close to a charged particle beam or even facing it. This bears the preferred advantage that high voltages can be generated by the electrodes or to the electrode component and they can withstand those high voltages. This assists in a better guidance and/or controlling of the charged beam, such as for compensating aberration etc. The beam neighboring section can have a surface configured to face the beam.Type: ApplicationFiled: August 8, 2022Publication date: February 8, 2024Applicant: FEI CompanyInventors: Ali MOHAMMADI-GHEIDARI, Alexander HENSTRA, Luigi MELE
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Publication number: 20240042852Abstract: Disclosed is a convenience equipment pull-out device for a vehicle. The convenience equipment pull-out device includes: a housing mounted on a headliner of the vehicle, a body which is mounted on the housing and coupled to a movable driving portion and to a plurality of movement guides. In particular, the body slides along the movement guides when the driving portion is driven. The device further includes a pull-out portion rotatably coupled to the body and selectively pulled out towards the interior of the vehicle while a hinge region connected to the body slides along a guide rail member of the housing.Type: ApplicationFiled: December 9, 2022Publication date: February 8, 2024Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, EXAOPTONIX Inc., Yong San Co., Ltd.Inventors: Jin Ho Hwang, Min Ho Cho, Ji Ah Kim, Ho Jun Jo, Eun Sung Kim, Sang Hoon Lee, Hyung Jin Kim
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Publication number: 20240047547Abstract: A semiconductor device includes a source via having a body portion and a barrier layer surrounding the body portion, and the body portion is in physical contact with the source contact. Furthermore, the barrier layer includes at least one sidewall section separating the source via from an adjacent via structure. As such, the via to via leakage may be prevented. Overall, by providing a semiconductor device having the above structures, the contact resistance is reduced, and the device performance is further improved.Type: ApplicationFiled: August 2, 2022Publication date: February 8, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Kuo-Chiang Tsai, Tien-Hung Cheng, Jeng-Ya Yeh, Mu-Chi Chiang
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Publication number: 20240043730Abstract: A heat dissipation sheet obtained by molding a heat conductive resin composition, the heat dissipation sheet having a partial discharge start voltage of 2800 to 5000 kV/mm. The method for producing the heat dissipation sheet includes a step of blending a resin and a boron nitride powder containing at least an aggregated boron nitride particle formed by an aggregation of hexagonal boron nitride primary particles to prepare a heat conductive resin composition, a step of molding the heat conductive resin composition into a sheet shape to prepare a heat conductive resin composition sheet, and a step of heating and pressurizing the heat conductive resin composition sheet under a vacuum. Thus, a heat dissipation sheet excellent in heat conductivity and insulation property and a method can produce the heat dissipation sheet.Type: ApplicationFiled: December 17, 2021Publication date: February 8, 2024Applicant: DENKA COMPANY LIMITEDInventors: Kosuke WADA, Kiyotaka FUJI
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Publication number: 20240044955Abstract: In some aspects of the present disclosure, a power detection system is disclosed. In some aspects, the power detection system includes a constant-transconductance (gm) reference generator circuit receiving a power supply voltage. In some embodiments, the constant-gm reference generator circuit includes a first current mirror to provide a first reference voltage and a second current mirror to provide a second reference voltage. In some embodiments, the constant-gm reference generator circuit includes a power detection circuit coupled to the first current mirror to receive the first reference voltage. In some embodiments, the power detection circuit is coupled to the second current mirror to receive the second reference voltage. In some embodiments, the power detection is operated to receive the power supply voltage. In some embodiments, the power detection circuit is operated to provide an output voltage having one of two logic states at least based on the second reference voltage and the power supply voltage.Type: ApplicationFiled: August 2, 2022Publication date: February 8, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yen-An Chang, Yi-Chun Shih
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Publication number: 20240048082Abstract: A power module may include: a positive terminal connected to a positive pole of a battery; a negative terminal connected to a negative pole of the battery; an output terminal connected to a winding among multiple windings included in a motor; a changeover terminal connected to a neutral point regarding the multiple windings; a top switch connected between the positive terminal and the output terminal; a bottom switch connected between the negative terminal and the output terminal; and a changeover switch connected to the changeover terminal and configured to form a common node with at least one of the top switch or the bottom switch.Type: ApplicationFiled: January 20, 2023Publication date: February 8, 2024Applicants: Hyundai Motor Company, Kia CorporationInventors: Hyun Koo LEE, Myung Ill YOU
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Publication number: 20240049277Abstract: A method and device for transmitting and receiving data in a communication system supporting multiple links include the steps of performing a first backoff operation for a first frame to be transmitted to first STA MLD in a first link from among multiple links; performing a second backoff operation for a second frame to be transmitted to second STA MLD in the first link; deferring transmission to the first frame if the first backoff operation is complete and communication between the AP MLD and the first STA MLD is established in a second link from among the multiple links; and transmitting the second frame to the second STA MLD in the first link if the second backoff operation is complete.Type: ApplicationFiled: October 23, 2023Publication date: February 8, 2024Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, Korea National University of Transportation Industry-Academic Cooperation FoundationInventor: Yong Ho Kim
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Publication number: 20240049329Abstract: The present disclosure provides a method and device used in a communication node for wireless communications. a first receiver, generates first information, and the first information indicates a buffer state of a first serving cell group; and a first transmitter, when the first serving cell group is in an active state, transmits the first information through the first serving cell group; and when the first serving cell group is in an inactive state, transmits the first information through the second serving cell group; wherein the first serving cell group and the second serving cell group are respectively an SCG and an MCG. The present application activates a first cell group by timely transmitting buffer status by an MCG in active state, thereby reducing the delay for data transmission on a first cell group.Type: ApplicationFiled: October 12, 2023Publication date: February 8, 2024Applicant: SHANGHAI LANGBO COMMUNICATION TECHNOLOGY COMPANY LIMITEDInventor: Xiaobo ZHANG
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Publication number: 20240047850Abstract: A laminated glass antenna structure includes: a lower glass sheet including a first surface facing inside and a second surface at the upper end thereof; an upper glass sheet including a third surface adjacent to the lower glass sheet; an adhesive film positioned between the upper glass sheet and the lower glass sheet; and an antenna unit including a plurality of microstrip patch unit cells provided on the second surface and the third surface with respect to a ground plane provided on the first surface.Type: ApplicationFiled: December 22, 2022Publication date: February 8, 2024Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, Hongik University Industry-Academia Cooperation FoundationInventors: Nak Kyoung Kong, Dae Hee Lee, Jong Min Park, Ki Hong Lee, Jong Seon Lee, Oh Heon Kwon, Keum Cheol Hwang, Ho Sung Choo