Abstract: In some embodiments, a field effect transistor structure includes a substrate, a fin structure and a gate structure. The fin structure is formed over the substrate. The fin structure includes a first channel region, a first source or drain region and a second source or drain region. The first source or drain region and the second source or drain region are formed on opposite ends of the first channel region, respectively. The well region is formed of the same conductivity type as the second source or drain region, connected to the second source or drain region, and extended to the substrate. The first gate structure wraps around the first channel region in the fin structure.

Abstract: A dosing and mixing arrangement including an exhaust conduit defining a central axis; a mixing conduit positioned within the exhaust conduit; a dispersing arrangement (e.g., a mesh) disposed at the upstream end of the mixing conduit; an injector coupled to the exhaust conduit and configured to direct reactants into the exhaust conduit towards the mesh; and an annular bypass defined between the mixing conduit and the exhaust conduit for allowing exhaust to bypass the upstream end of the mixing conduit and to enter the mixing conduit downstream of the mesh.

Abstract: Methods and systems are provided for a gradient coil assembly. In one embodiment, a gradient coil assembly comprises a hollow, first gradient coil and a solid, second gradient coil co-wound with the first gradient coil. In this way, the turn density of the gradient coil assembly may be increased.

Abstract: A bale forming apparatus and a bale forming method are provided. A bale is formed in a bale forming chamber. A bale pushing device pushes the bale away from an outlet onto a bale supporting construction. A guiding element is pivoted into a guiding position. The guiding element in the guiding position contributes to guide a bale forming mechanism such that a bale forming device a chamber is also provided when the bale is on the bale supporting construction. A new bale is formed in the provided bale forming chamber. The bale pushing device is pivoted around the pivoting axis in a pushing direction and backwards and performs a reciprocating movement. Pivoting the bale pushing device in the pushing direction causes the guiding element to be pushed and pivoted into the guiding position.

Abstract: An electrical submersible pump assembly has modules including a pump, upper and lower tandem motors, and a pressure equalizer coupled to the motors. A thrust bearing support member is provided in the lower tandem motor and has a central counterbore with a thrust bearing located in the counterbore. Motor wire holes extend axially through the thrust bearing support member and are spaced radially outward from the counterbore. Motor wires of the lower tandem motor extend through the motor wire holes. A plurality of slots extend radially from the motor wire holes to the counterbore. Each of the slots have an axial length at least equal to an axial length of each of the motor wire holes, and a width greater than a diameter of each of the motor wires of the lower tandem motor.

Abstract: A multi-layered semiconductor device and method of manufacture are provided. In an embodiment a first semiconductor layer, a first insulator layer, a second semiconductor layer, a second insulator layer, and a third semiconductor layer are formed over a substrate. A first transistor comprises the first semiconductor layer, the first insulator layer, and the second semiconductor layer, and a second transistor comprises the second semiconductor layer, the second insulator layer, and the third semiconductor layer.

Abstract: A method and apparatus for forming a stiffened thermoplastic panel is presented. The method may comprise placing a number of forming tools within a number of concave areas of a thermoplastic preform. The method may also place the thermoplastic preform with the number of forming tools within the number of concave areas on a thermoplastic lay-up to form a workpiece. The method may also position the workpiece within a tool. The tool may have a number of die liners configured to generate heat in response to a magnetic field. The method may also consolidate the workpiece to form the stiffened thermoplastic panel. Consolidating may comprise applying a magnetic field to the number of die liners to heat the workpiece to a consolidation temperature.

Abstract: A flow control panel in an aircraft engine two-dimensional, convergent/divergent nozzle adjusts a throat area of the nozzle and is configured to be self-sealing, thereby requiring fewer parts and providing a more simplified construction of the throat area of the nozzle.

Abstract: One of a first voltage and a second voltage may be selected based on input from a basic input/output system (BIOS). One of the selected voltage and no voltage may be output to a carrier detect (CD) pin and a ring Indicator (RI) pin of a serial communication port, based on the input from the BIOS.

Abstract: A power stabilizing device in a system includes as a portion of a power converter section, a second PWM converter provided between a second primary AC bus and a second DC bus in an electric system and configured to perform mutual conversion between DC power and AC power. A power stabilizing control section in the power stabilizing device controls charging and discharging of a secondary battery based on a voltage and a frequency in the second primary AC bus, thereby stabilizing the electric system.

Abstract: A series of independently operated chokes, using a shift tool in registry with a profile discrete to each choke, have a tubular valve member that aligns or misaligns openings for the fully open or closed positions for the choke and for intermediate positions as the valve opens or closes. The valve member is actuated axially using a reversing screw and a j-slot. A shifting tool latches a unique profile to operate the j-slot to cause a sleeve to rotate in place. The sleeve has a pin in registry with a profile on a profile shaft. The profile shaft can move axially in opposite direction but is restrained against rotation. The profile is shaped so that continuous j-slot operation causes the registered pin to move in the profile to then axially drive the profile shaft which is connected to the valve member.

Abstract: One or more embodiments of techniques or systems for forming a semiconductor structure are provided herein. A first metal region is formed within a first dielectric region. A cap region is formed on the first metal region. A second dielectric region is formed above the cap region and the first dielectric region. A trench opening is formed within the second dielectric region. A via opening is formed through the second dielectric region, the cap region, and within some of the first metal region by over etching. A barrier region is formed within the trench opening and the via opening. A via plug is formed within the via opening and a second metal region is formed within the trench opening. The via plug electrically connects the first metal region to the second metal region and has a tapered profile.

Abstract: Techniques for fast and accurate measuring test strip intensities are disclosed herein. A cassette attachment device for detecting intensity of a test strip cassette includes a strip chamber configured to accommodate at least a portion of a test strip, a light source configured to provide illumination to the test strip cassette via indirect lighting, an attaching mechanism configured to attach the device to a mobile device, and a camera window configured to transmit light signal reflected from the test strip cassette such that the mobile device can capture an image of the test strip cassette illuminated by the light source.

Abstract: A luminaire that includes a plurality of light emitting diodes (LEDs), a light diffuser having a planar surface facing the LEDs, and a reflector that surrounds a cavity formed between the light diffuser and the LEDs. Also disclosed is a light distribution system having a first plurality of lenses configured to convert incident light into a light distribution pattern and a second plurality of lenses configured to convert incident light into a different light distribution pattern. Further disclosed is a method of distributing light that involves emitting light towards a light diffuser, scattering a first portion of the light with the light diffuser, reflecting a second portion of the light with the light diffuser, reflecting the second portion of the light with a first reflective surface back towards the light diffuser, and scattering the second portion of the light with the light diffuser.

Abstract: The system for reprogramming a plurality of control units includes a first control unit and a second control unit connected by one CAN bus, and a diagnosing unit. The diagnosing unit includes a first controller configured to reprogram the first control unit and a second controller configured to reprogram the second control unit. The diagnosing unit is configured to perform bidirectional reprogramming for the first control unit and the second control unit while sharing information between the first controller and the second controller.

Abstract: A method, computer program product, and computing system for monitoring the availability of multiple redundant data sources within a high-availability data environment. The inaccessibility of at least one of the multiple redundant data sources is detected, thus defining at least one inaccessible data source. Which software applications are impacted by the at least one inaccessible data source is determined, thus defining at least one impacted software application. A notification is provided to one or more parties associated with the at least one impacted software application concerning the inaccessibility of the at least one inaccessible data source.

Abstract: A method includes forming a first semiconductor stack using an epitaxial growth process, the first semiconductor stack comprising a first plurality of semiconductor layers alternating with a second plurality of semiconductor layers, the first plurality of semiconductor layers comprising a first semiconductor material and the second plurality of semiconductor layers comprising a second semiconductor material that is different than the first semiconductor material. The method further includes patterning the first semiconductor stack to form a set of semiconductor stack features, forming isolation features between the semiconductor stack features, removing at least one of the semiconductor stack features, thereby forming at least one trench, and forming, within the trench, a second semiconductor stack using an epitaxial growth process, the second semiconductor stack having different characteristics than the first semiconductor stack.

Abstract: Package structures and methods of forming package structures are described. A method includes depositing and patterning a first dielectric material. The first dielectric material is deposited in first and second package component regions and in a scribe line region. The scribe line region is disposed between the first and second package component regions. The patterning the first dielectric material forms a first dielectric layer in each of the first and second package component regions and a dummy block in the scribe line region. The dummy block is separated from the first dielectric layer in each of the first and second package component regions. The method further includes forming a metallization pattern on the first dielectric layer; depositing a second dielectric material on the first dielectric layer and the metallization pattern; and patterning the second dielectric material to form a second dielectric layer.

Abstract: Disclosed herein is an electrically conductive adhesive composition and its use in solar cell modules, wherein the electrically conductive adhesive comprises a polymer matrix and dispersed in the polymer matrix about 40-90 wt % of conductive particles, with the wt % of all components comprised in the compositions totaling to 100 wt %, and wherein the polymer matrix comprises or is formed of a blend of at least one ethylene/alkyl (meth)acrylate copolymer elastomer and at least one ethylene vinyl acetate copolymer at a weight ratio ranging from about 10:90 to about 70:30.