Patents Assigned to AAC Microtec AB
  • LOW RESISTANCE THROUGH-WAFER VIA
    Publication number: 20130164935
    Abstract: The present invention provides a wafer (3) comprising a through-wafer via (7) through the wafer (3) formed by a through-wafer via hole (9) and at least a first conductive coating (25). A substantially vertical sidewall (11) of the through-wafer via hole (9) except for a constriction (23) provides a reliable through-wafer via (7) occupying a small area on the wafer. The wafer (3) is preferably made of a semiconductor material, such as silicon, or a glass ceramic. A method for manufacturing such a wafer (3) is described.
    Type: Application
    Filed: December 3, 2012
    Publication date: June 27, 2013
    Applicant: AAC Microtec AB
    Inventor: AAC Microtec AB