Abstract: A microphone chip and a microphone. The microphone chip includes: a base including an inner cavity; a diaphragm including a diaphragm inner part and a diaphragm outer part that are connected to the diaphragm inner part, the diaphragm being supported on the base by means of the diaphragm outer part, and the diaphragm inner part being arranged to be opposite to the inner cavity; and a limiting member supported on the base and located at two opposite sides of the diaphragm along a vibration direction of the diaphragm, the limiting member being spaced apart from the diaphragm, and the limiting member being configured to limit an amplitude of the diaphragm inner part. When the diaphragm inner part moves to a certain displacement, the limiting member can limit further movement of the diaphragm inner part, thereby reducing a damage risk caused by excessive displacement of the diaphragm under high sound pressure.

Abstract: Disclosed is a loudspeaker and a terminal device. The loudspeaker includes: a loudspeaker body having a containing cavity; a transducer accommodated in the containing cavity separated by the transducer into a front and a rear cavity along the first direction, wherein a sound hole is provided on the loudspeaker body, and the sound hole is in communication with the front cavity; and a throat having a throat cavity, and a first and a second mouth arranged sequentially along the second direction. The first mouth corresponds to the sound hole, the throat cavity is in communication with the front cavity via the first mouth and the sound hole, and the throat cavity is in communication with the outside via the throat and the second mouth. The present disclosure can compress the space occupied by loudspeaker, which is suitable for a terminal device with certain internal space and a limited height.

Abstract: A microphone signal beamforming processing method and related products are provided. The method includes: obtaining a frequency domain signal of each of at least three microphones by performing time-frequency transforming on first output signals, and performing a plurality of different groups of beamforming preprocessing on the frequency domain signals; performing a plurality of different groups of cross-pattern analysis on the plurality of beam signals to obtain a plurality of positive weighting coefficients, multiplying the plurality of positive weighting coefficients to obtain a combined coefficient, and multiplying the combined coefficient with the frequency domain signal of any one of the at least three microphones to obtain a weighted spectral component; and performing inverse time-frequency transforming on the weighted spectral component.

Abstract: An inertial sensor and a method therefor. The inertial sensor includes: a first substrate; a medium layer stacked on the first substrate; a first electric-conductive layer stacked on the medium layer, first openings being formed in the first electric-conductive layer and spaced from one another; second electric-conductive layers being bonded to the first electric-conductive layer through bonding structures, a gap being formed between adjacent second electric-conductive layers, which are connected to each other by a connection part, and second openings being formed in each of the second electric-conductive layers and spaced from one another; and a second substrate covering the first substrate, a closed space being formed between the second substrate and the first substrate. Compared with a traditional single-layer structure, the die size is reduced, the manufacturing cost is reduced, and the integration of device into portable consumer applications is improved, and XY axis sensitivity is improved.

Abstract: Provided is a hand emulator and an acoustic testing system. The hand emulator includes: a main support configured to support a device under test, the main support includes a palm, a thumb, an index finger, a middle finger, a ring finger and a little finger that are movably arranged at an end of the palm; a stopper including a plurality of limit pillars, at least some of the plurality of limit pillars are arranged on the palm, several limit pillars of the plurality of limit pillars enclose to form an accommodating space, and the device under test is limited within the accommodating space. The hand emulator can measure the frequency response of the speaker and/or the microphone of the device under test, emulate acoustic characteristics similar to the user's hand, and accurately and repetitively position the device under test, which improves existing measurement standards and creates new testing methods.

Abstract: Provided is a MEMS microphone including: a substrate having a cavity penetrating thereon; a diaphragm supported by the substrate and covering the cavity; a back plate provided above the diaphragm, wherein a first preset gap is formed between the back plate and the diaphragm; and a first support member received in the cavity includes a support portion, a connection portion, and a convex portion. The connection portion extends from the support portion towards the substrate until being fixed to the substrate. The convex portion extends from an end of the support portion approaching the diaphragm towards the diaphragm until supporting the diaphragm. The diaphragm and the connection portion form a second preset gap along a vibration direction of the diaphragm. The diaphragm of the MEMS microphone has higher robustness and higher anti-dropping capability.

Abstract: An MEMS diaphragm and an MEMS sensor. The MEMS diaphragm includes: a main diaphragm including a main body sensing portion and beam portions, and the beam portions are connected to an outer edge of the main body sensing portion; an additional material layer provided on the beam portions or provided on both an edge of the main body sensing portion and on the beam portions. The intrinsic tensile stress of the additional material layer is greater than an intrinsic tensile stress of the main body sensing portion. An additional material layer is provided, which mechanically reinforces the diaphragm region experiencing high stress during a pressure pulse, and the intrinsic tensile stress of the additional material layer is greater than the main body sensing portion, thereby ensuring the compliance of the main diaphragm.

Abstract: A MEMS device and a method for manufacturing the MEMS device are provided. The MEMS device includes a cap sheet and a device sheet. The device sheet includes a silicon substrate, at least two device structure layers, and at least one conductive structure layer, and each two adjacent device structure layers are coupled via a corresponding conductive structure layer. The device sheet defines a functional cavity having a first region, a second region, and a third region. The at least two device structure layers and the at least one conductive structure layer each are across the first region, the second region, and the third region, and the at least two device structure layers and the at least one conductive structure layer cooperatively form a first movable structure in the first region, define an anchor point in the second region, and form a second movable structure in the third region.

Abstract: Acoustic sensor and manufacturing method. The acoustic sensor includes: a base including a first silicon layer, a first oxide layer and a second silicon layer stacked, and a back cavity; a second oxide layer formed on the base; a piezoelectric unit formed on the second oxide layer and including a first electrode layer, a piezoelectric layer and a second electrode layer stacked; a first slit formed at a middle portion of the second electrode layer and passing the second electrode layer, the piezoelectric layer and the first electrode layer; a second slit formed at a middle portion of the second silicon layer and passing the second silicon layer and the second oxide layer; an additional membrane filled in the first slit and not filled in the second slit. The SPL and structural reliability are effectively improved, and the material type is not limited by dry film type materials.

Abstract: A MEMS microphone, includes a substrate with a back cavity, and a capacitive system arranged on the substrate, the capacitive includes a back plate and a diaphragm, a reinforcing portion is located between the diaphragm and the substrate, a projection of an inner surface of the reinforcing portion along a vibration direction of the diaphragm is flush with an inner surface of the back cavity or located in the back cavity, the reinforcing portion includes an etched barrier wall and a sacrificial layer located within the etched barrier wall. Compared with the related art, the MEMS microphone disclosed by the present disclosure could improve the reliability.

Abstract: A loudspeaker assembly and a hand-held device are provided. The loudspeaker assembly includes at least one loudspeaker driver and at least two output ports. The at least one loudspeaker driver and the at least two output ports are configured so that the loudspeaker assembly has a directive polar pattern over a desired frequency range.

Abstract: A microelectromechanical system membrane includes spacers, counter electrodes, a first diaphragm and a second diaphragm. The spacers and the counter electrodes are at the same level and arranged alternatively on cross sections of the microelectromechanical system membrane. The first diaphragm and the second diaphragm are respectively located on opposite sides of the spacers and hermetically connected. The first diaphragm is provided with first projections spaced arranged in the first direction, and the second diaphragm is provided with second projections spaced arranged alternately in the first direction. The first projections include first front walls and first back walls disposed opposite in the first direction, and the second projections include second front walls and second back walls disposed opposite in the first direction. At least some of the first front and back walls, the second front and back walls are configured to be sub-corrugation structures.

Abstract: A MEMS optical microphone includes: a housing including an inner cavity and a sound port communicating the inner cavity with outside, a light source configured to emitting a light beam, a MEMS module including a membrane suspended above the sound port, and a first reflective coating coated on a surface of the membrane facing the light source and configured to reflect the light beam; a light detection unit configured to detecting light reflecting from the first reflective coating, including a photo detector configured to convert light intensity into photo current, and an optical filter with a variable transmittance hoisted above the photo detector. The MEMS optical microphone has wider dynamic range and higher sensitivity.

Abstract: A sound reproducing apparatus is disclosed. The sound reproducing apparatus includes a signal processing unit, a first transducer, and a second transducer. The signal processing unit is configured to receive a sound signal and divide the sound signal into a first frequency component and a second frequency component. The first frequency component is at least partially different from the second frequency component, and the signal processing unit includes a delay unit configured to delay the second frequency band component. The first transducer is configured to convert the first frequency component from the signal processing unit into airborne sound. The second transducer is configured to convert the second frequency component from the delay unit into bone conduction sound.

Abstract: An acoustic transducer includes: substrate including first silicon layer, first oxide layer and second silicon layer, back chamber is formed therethrough; second oxide layer on the substrate; piezoelectric unit on the second oxide layer and including first electrode layer, piezoelectric layer and second electrode layer; slit and opening formed in the second electrode layer; metal pad stacked on the first electrode layer at the opening; and additional film layer including first, second and third parts, the first part is in the slit, side wall and bottom wall of the first part form groove, and through slot is formed in the third part to expose metal pad.

Abstract: An acoustic transducer includes: substrate including first silicon layer, first oxide layer and second silicon layer, back chamber is formed therethrough; second oxide layer on the substrate; piezoelectric unit on the second oxide layer and including first electrode layer, piezoelectric layer and second electrode layer; slit and opening formed in the second electrode layer; metal pad stacked on the first electrode layer at the opening; and additional film layer including first and second parts, the first part is lay on the second electrode layer and covers the slit, and the second part is lay on the metal pad, through slot is formed penetrating the second part to expose the metal pad. Compared with the related art, additional film layer is formed by vapor deposition, and the piezoelectric unit can vibrate with maximum displacement and lowest restriction, thereby effectively improving SPL and structural reliability, which is suitable for larger acoustic transducers.

Abstract: The invention provides a speaker module for a mobile terminal provided with a sound output port. The speaker module includes a speaker box, and the speaker box includes a sound output opening. The speaker module also includes a horn barrel connected with the sound output opening. The sound output opening includes a first sound output opening and a second sound output opening. Compared with the related art, the present invention can realize multi-level resonance, small size, convenient to widen the frequency band range and easy to adapt to the mobile terminal.

Abstract: The present invention provides a speaker box including a housing, a sound unit and a magnetic circuit coupling valve. The sound unit includes a bracket, a vibration system and a magnetic circuit system including a secondary magnet. The housing includes a bottom cover having leakage holes. The magnetic circuit coupling valve is accommodated in a rear cavity and includes a support, a negative stiffness diaphragm and a coil. The negative stiffness diaphragm faces to the leakage holes. The coil receives an external control signal and generates an electromagnetic field with the secondary magnet to drive the negative stiffness diaphragm to seal the leakage holes, or make the leakage holes open, or make the leakage holes partially open or closed. Compared with a related technology, the speaker box has fine acoustic performance and is able to accurately control communication of a rear cavity with the outside.

Abstract: The invention provides a speaker module for a mobile terminal with a sound output port. The speaker module includes a speaker box. The speaker box includes a sound output opening for side surface sound. The speaker module also includes a horn barre. The horn barrel has openings arranged at both ends. A sectional area along the sound output direction of the horn barrel changes gradually. By designing a variable sectional surface with different areas or lengths and widths on the horn barrel for stakeout, the size of the variable sectional surface is directly related to the sound quality of each part of the horn barrel. The horn barrel widens the frequency band range. Compared with the related art, the present invention can realize multi-level resonance, has a small volume, is convenient to widen the frequency band range and has flexible avoidance space.

Abstract: Provided is a capacitive sensing circuit and capacitive sensing method. The circuit includes a charge pump, a micro-electro-mechanical system (MEMS) chip, an analog signal modulator configured to perform analog signal modulation to an output signal of the MEMS chip and an output signal of the analog signal modulator, and a digital signal modulator configured to perform digital signal modulation to the output signal of the analog signal modulator, and output a modulated signal by a digital interface. By directly using the input signal of the MEMS chip and the output signal of the analog signal modulator as the input signal for analog modulation, the harmonic distortion is reduced.