Abstract: A reverse cantilever spring clip for providing intimate thermal contact between a heat sink and a heat generating electrical component such as an integrated circuit (IC). The spring clip includes a spring member and a retention member. The retention member has one or more legs with a securing member affixed to an outer end of the legs. The legs are configured for engaging a heat sink and a circuit board to which the IC is mounted so that the heat sink is positioned directly over the circuit board. The securing member maintains contact between the IC and heat sink.

Abstract: A liquid cooled heat sink for cooling heat generating components. The heat sink has a base member with open ended channels formed in at least one surface thereof. The open ends of the channels have a span less than a span across a lower portion of the channels. A fluid conduit is disposed in said channels. The fluid conduit has an outer span greater than the span across the open ends of the channels and a flattened surface which is substantially coplanar with the surface of the heat sink base member having the channels therein.

Abstract: A cooling device for a liquid crystal display monitor has a sealed container within which a light source is immersed in a thermally-conductive liquid coolant. The container is rigid and includes a transparent panel through which light travels from the light source to a display screen of the monitor. The liquid coolant transfers heat from the light source to the walls of the container, where it is transferred to the ambient environment. A flexible bladder is provided within the container, which is compressed by coolant volume increases resulting from heating of the coolant by the light source, thereby to protect the container from internal pressure stress. The bladder, filled with an easily compressible fluid, can be vented to the ambient environment, or can be fully contained within the container.