Abstract: A dual-layer coupling arrangement comprises a first coupling waveguide disposed within a photonic integrated circuit (at a position over an included optical signal waveguide) and a second coupling waveguide disposed above the first coupling waveguide. The first and second coupling waveguides are formed to exhibit splitter configurations that terminate as a pair arms separated by a distance suitable for creating beams that would coincide with a circular mode field of the core region of a coupling optical fiber. The vertical spacing between the first and second coupling waveguides is set so that the pairs of beams exiting from the terminating arms of the coupling waveguides coincide with a circular mode field.

Abstract: Passive alignment and connection between a fiber array and a plurality of optical waveguides terminating along an edge of a photonic IC is provided by a controlled mating between V-grooves formed in a fiber support substrate and alignment ridges formed to surround waveguide terminations along an edge of a photonic IC. The V-grooves of the fiber support substrate are spaced to define the same pitch as the waveguides on the photonic IC, with the height and width of the alignment ridges formed to engage with the V-grooves upon mating of the fiber support substrate with the photonic IC. The individual fibers are positioned within associated V-grooves such that their endfaces are retracted from a proximal end portion of the support structure. It is this proximal end portion that mates with the alignment ridges on the photonic IC.

Abstract: A configuration of both optical and electronic integrated circuits is formed upon a single substrate in a side-by-side arrangement, with minimal interposing elements required to direct the flow of electronic signals from one IC to another. The various sets of optical connections (typically, fiber arrays that are connected to components beyond the interconnect) are disposed around the outer periphery of the interconnect in a manner that allows for efficient access. Oriented with the substrate as top layer in stack, a heatsink may be coupled directly to exposed substrate surface and provide an efficient path for heat transfer away from the interconnection assembly.

Abstract: A laser source assembly is based upon an optical reference substrate that is utilized as a common optical reference plane upon which both a fiber array and a laser diode array are disposed and positioned to provide alignment between the components. Passive optical components used to provide alignment between the laser diode array and the fiber array are also located on the optical reference substrate. A top surface of the reference substrate is patterned to include alignment fiducials and bond locations for the fiber array receiving block, laser diode array submount and passive optical components. The receiving block is configured to present the optical fibers at a height that facilitates alignment with the output beams from the laser diodes positioned on the silicon submount.

Abstract: Passive alignment and connection between a fiber array and a plurality of optical waveguides terminating along an edge of a photonic IC is provided by a controlled mating between V-grooves formed in a fiber support substrate and alignment ridges formed to surround waveguide terminations along an edge of a photonic IC. The V-grooves of the fiber support substrate are spaced to define the same pitch as the waveguides on the photonic IC, with the height and width of the alignment ridges formed to engage with the V-grooves upon mating of the fiber support substrate with the photonic IC. The individual fibers are positioned within associated V-grooves such that their endfaces are retracted from a proximal end portion of the support structure. It is this proximal end portion that mates with the alignment ridges on the photonic IC.

Abstract: A high density opto-electronic interconnection arrangement includes an interposer disposed over the substrate and used to provide a high density electrical connection to a group of electrical ICs flip-chip mounted on the substrate. A set of optical ICs are disposed over and attached to the electrical ICs, where the positioning of the optical IC on the top of the stack eliminates the need to form vias through the thickness of the optical substrate. Thus, a relatively thick optical IC component may be used, providing a stable optical axis and improving alignment and coupling of optical signal paths.

Abstract: A high density interconnect arrangement takes the form of a backplane-pluggable card, with electrical connections formed along a single (pluggable) edge and all remaining connections provided via optical fibers. An exemplary interconnect arrangement also includes on-board optical sources and silicon photonic-based circuitry for providing optical transceiver functionality. Passively aligned fiber arrays are utilized to provide I/O connections to external elements, as well as between laser sources and on-board silicon photonics.

Abstract: A high density interconnect arrangement takes the form of a backplane-pluggable card, with electrical connections formed along a single (pluggable) edge and all remaining connections provided via optical fibers. An exemplary interconnect arrangement also includes on-board optical sources and silicon photonic-based circuitry for providing optical transceiver functionality. Passively aligned fiber arrays are utilized to provide I/O connections to external elements, as well as between laser sources and on-board silicon photonics.