Abstract: A short circuit within the dynamic voltage restorer (1) is immediately detected by a short circuit detection units (9) which permanently monitors currents and voltages in the voltage source converter (3) and energy storage capacitor bank (2). Upon detection a fast discharge of the capacitor bank (2) including firing of all available semiconductors of the voltage source converter (3) and distributing the resulting current stress as evenly as possible within the voltage source converter (3) is initiated. Instead of letting costly fuses interrupt the high short circuit currents, these currents are detected and evenly distributed within the converter.

Abstract: A converter system has a number of individual converter modules, which are in the form of load converter modules or power supply system converter modules and are connected to one another via a DC voltage intermediate circuit which has two DC voltage busbars and a DC voltage intermediate circuit capacitance arranged between the DC voltage busbars. A defective converter module is isolated from a common intermediate circuit, in which interruption-free further operation of the other modules on the intermediate circuit is possible and in which the isolating means are not destroyed. The DC voltage intermediate circuit capacitance is subdivided into a number of parts corresponding to the number of converter modules. Each of the converter modules is associated with a portion of the DC voltage intermediate circuit capacitance and forms a local intermediate circuit. The converter modules are coupled together with their local intermediate circuits to the DC voltage busbars by at least one protective switch.

Abstract: A semiconductor clamped-stack assembly (32) has at least two clamped stacks, each of these clamped stacks having a plurality of power semiconductor components (8) and a plurality of heat sinks (6), which are arranged in series along a horizontally extending axial direction (A). According to the invention, power semiconductor components (8) from different clamped stacks are assigned to one another and are located in a common mounting plane, which is perpendicular to the axial directions (A) of the clamped stacks (31). Mutually associated power semiconductor components (8) can be removed from the clamped-stack assembly or, respectively, inserted into the clamped-stack assembly in a common mounting direction, which lies in the mounting plane. Mutually associated power semiconductor components (8) are preferably mounted on a common plate (14). As a result, they can be dismantled when the clamped-stack assembly (32) is loosened, without further power semiconductor components or heat sinks having to be dismantled.