Abstract: Wireless power supply devices, wireless powered devices, wireless power transmission systems, and manufacturing methods thereof. The wireless power supply device can include a first circuit configured to convert a DC voltage to an AC voltage for wireless power transmission between the wireless power supply device and a powered device. The system can also include a pulse signal receiver configured to receive a first pulse signal from the powered device and to generate a second pulse signal based on the first pulse signal, the first pulse signal being generated based on a feedback signal of the powered device indicating information associated with received power of the powered device. The system can also include a first control unit coupled to the first circuit and the pulse signal receiver, and configured to control conversion of the first circuit based on the second pulse signal.

Abstract: An integrated magnetic core is provided. The integrated magnetic core includes a first plate and a second plate. The first plate includes a plurality of legs extending outwardly from a first surface of the first plate. The plurality of legs includes first and second oppositely disposed legs and third and fourth oppositely disposed legs. The second plate is coupled to at least the third and fourth legs of the first plate.

Abstract: An integrated magnetic assembly includes a magnetic core having a first component and a second component. The first component includes a first face and a winding leg extending from the first face. The winding leg includes a top face spaced from and oriented generally parallel to the first face. The second component is coupled to the first component and has a second face facing the first face. The second component further includes a third face recessed from and oriented generally parallel to the second face and a recess sidewall extending between the second face and the third face. The integrated magnetic assembly further includes an input winding and an output winding each inductively coupled to the magnetic core. The third face and the recess sidewall define a recess within the second face. Additionally, a gap is defined between the top face and the third face.

Abstract: Technologies for controlling AC-to-DC converters are disclosed. In one illustrative embodiment, a controller of an AC-to-DC converter measures two voltage levels of a split voltage bus of a power factor correction (PFC) circuit. The controller controls current drawn from the positive and negative terminals of the PFC circuit by a DC-to-DC converter. By controlling the current drawn from the two terminals, the controller can control the voltages on the terminals to be equal (but opposite).

Abstract: A power converter is provided. The power converter includes an input side having a first input winding and a second input winding coupled in electrical series to the first input winding. The power converter also includes an output side having a first output winding and a second output winding coupled in electrical parallel to the first output winding.

Abstract: Interposer printed circuit boards for power modules and associated methods are disclosed. In at least one illustrative embodiment, a printed circuit board assembly may comprise a printed circuit board, an electrical component mounted on a surface of the printed circuit board, and an interposer printed circuit board mounted on the surface of the printed circuit board. The interposer printed circuit board may comprise a first signal path to transmit a first electrical signal and a second signal path to transmit a second electrical signal that is different from the first electrical signal. The interposer printed circuit board may be configured to provide a standoff to prevent the electrical component from contacting a motherboard when the printed circuit board assembly is mounted to the motherboard.

Abstract: Interposer printed circuit boards for power modules and associated methods are disclosed. In at least one illustrative embodiment, a printed circuit board assembly may comprise a printed circuit board having a surface, an electrical component mounted on the surface, a pin mounted on the surface, and an interposer printed circuit board mounted on the surface. The electrical component may have a first height orthogonal to the surface. The pin may have a second height orthogonal to the surface, where the second height is greater than the first height. The interposer printed circuit board may comprise a pad and an outer solder bump positioned on the pad. The outer solder bump may be positioned at a third height orthogonal to the surface, where the third height is greater than the first height.

Abstract: An electronic system includes a rack assembly including a first rail and a second rail defining a first width therebetween and a chassis that supports electronic components and is insertable between the first rail and the second rail. The chassis includes a first side and a second side defining a second width therebetween that is less than the first width. The electronic system further includes a power connector coupled to the chassis and movable between a first position and a second position. The power connector and the second side define a third width when the power connector is in the first position. The power connector and the second side define a fourth width when the power connector is in the second position. The third width is greater than the first width and the fourth width is less than the first width.

Abstract: According to one aspect of the present disclosure, a single-stage converter includes a rectifying circuit and a buck-boost circuit. The buck-boost circuit includes an inductor with a center tap configured to supply an output of the buck-boost circuit to the rectifying circuit. The buck-boost circuit also includes first and second interleaved arms arranged in parallel with a voltage input of the single-stage converter. The first and second interleaved arms are each coupled to the inductor and include a plurality of switches operable to control the output of the buck-boost circuit.

Abstract: A power distribution busway joint monitoring sensor assembly is provided. A first sensor is configured to measure a first position temperature and generate a first signal indicative of the first position temperature, wherein the first position is proximate to a busway joint. A second sensor is configured to measure a second position temperature and generate a second signal indicative of the second position temperature. A sensor controller is configured to i) receive the first signal and the second signal, ii) process the first signal and the second signal, and iii) generate a processed first signal and a processed second signal. A system controller is configured to receive the processed first signal and the processed second signal and generate an alert when a temperature differential between the first position temperature and the second position temperature is greater than a predetermined threshold temperature.

Abstract: At least one embodiment of a power supply includes a printed circuit board formed from a plurality of double-sided laminates and a plurality of thermally conductive, electrically insulating pre-preg sheets interleaved with the plurality of double-sided laminates. Each double-sided laminate illustratively includes an electrically insulating core, a first patterned layer of electrically conductive material arranged on a first side of the electrically insulating core, and a second patterned layer of electrically conductive material arranged on a second side of the electrically insulating core opposite the first side.

Abstract: A power supply circuit includes a printed circuit board (PCB), and a transformer coupled to the PCB. The power supply circuit also includes a first inductor assembly coupled to the PCB and electrically connected to the transformer, and a second inductor assembly coupled to the PCB and electrically connected to the transformer. The first inductor assembly has an inner edge and an opposite outer edge, and the second inductor assembly has an inner edge and an opposite outer edge. The inner edge of the second inductor assembly is spaced apart from the inner edge of the first inductor assembly by a gap. The power supply circuit also includes a first magnetic shunt coupled to the outer edge of the first inductor assembly, and a second magnetic shunt coupled to the outer edge of the second inductor assembly.

Abstract: A power connector includes an outer casing couplable to a chassis such that the outer casing is positioned between sides of the chassis. The power connector also includes a body movably coupled to the outer casing. The body is movable between a first position and a second position. The body extends beyond the outer casing when in the first position. The body positioned entirely within the outer casing when in the second position.

Abstract: Interposer printed circuit boards for power modules and associated methods are disclosed. In at least one illustrative embodiment, a printed circuit board assembly may comprise a printed circuit board having a surface, an electrical component mounted on the surface, a pin mounted on the surface, and an interposer printed circuit board mounted on the surface. The electrical component may have a first height orthogonal to the surface. The pin may have a second height orthogonal to the surface, where the second height is greater than the first height. The interposer printed circuit board may comprise a pad and an outer solder bump positioned on the pad. The outer solder bump may have a third height orthogonal to the surface, where the third height is greater than the first height.

Abstract: A modular edge power system is provided. The modular edge power system includes a housing having a rack adapted to mount compute devices and a direct current power bus within the housing. Multiple power distribution units are adapted to be removably coupled to the direct current power bus at a position within the housing and outside of the rack. Each power distribution unit is configured to distribute electrical power received from the direct current power bus to one or more compute devices mounted in the rack. Each power distribution unit may convert the electrical power from a first power level to a second power level.

Abstract: A power converter is provided. The power converter includes an input side having a first input winding and a second input winding coupled in electrical series to the first input winding. The power converter also includes an output side having a first output winding and a second output winding coupled in electrical parallel to the first output winding.

Abstract: At least one embodiment of a power supply includes a printed circuit board formed from a plurality of double-sided laminates and a plurality of thermally conductive, electrically insulating pre-preg sheets interleaved with the plurality of double-sided laminates. Each double-sided laminate illustratively includes an electrically insulating core, a first patterned layer of electrically conductive material arranged on a first side of the electrically insulating core, and a second patterned layer of electrically conductive material arranged on a second side of the electrically insulating core opposite the first side.

Abstract: According to an aspect of this disclosure, a circuit includes a voltage source and an output load, first and second resonant modules disposed between the voltage source and the output load, and first and second transformers. The circuit is further arranged such that the first transformer is disposed between the first resonant module and the output load, and the second transformer is disposed between the second resonant module and the output load. The circuit also includes a plurality of half-bridges coupled between the first and second resonant modules and the voltage source. The circuit further includes a voltage divider disposed between the voltage source and the plurality of half-bridges.

Abstract: A DC-to-DC power converter includes a reference voltage generator and a tangible, non-transitory, computer-readable memory. The memory stores a temperature coefficient, and the temperature coefficient is based upon a temperature response of said reference voltage generator over a range of temperatures. The DC-to-DC power converter also includes a controller coupled to the reference voltage generator and the memory and operable to retrieve the temperature coefficient from the memory, and adjust an output voltage of the DC-to-DC power converter based upon the temperature coefficient.

Abstract: In at least one illustrative embodiment, a printed circuit board may comprise at least one insulating layer, first and second conductive layers separated from one another by the at least one insulating layer, and a conductive via extending through the at least one insulating layer and electrically coupling the first and second conductive layers. The conductive via may include an annular via sidewall having an average radial thickness of at least 2.5 mils (0.0025 inches) and a conductive pad having an average thickness of no more than 3.2 mils (0.0032 inches).