Abstract: Interposer printed circuit boards for power modules and associated methods are disclosed. In at least one illustrative embodiment, a printed circuit board assembly may comprise a printed circuit board, an electrical component mounted on a surface of the printed circuit board, and an interposer printed circuit board mounted on the surface of the printed circuit board. The interposer printed circuit board may comprise a first signal path to transmit a first electrical signal and a second signal path to transmit a second electrical signal that is different from the first electrical signal. The interposer printed circuit board may be configured to provide a standoff to prevent the electrical component from contacting a motherboard when the printed circuit board assembly is mounted to the motherboard.

Abstract: Interposer printed circuit boards for power modules and associated methods are disclosed. In at least one illustrative embodiment, a printed circuit board assembly may comprise a printed circuit board having a surface, an electrical component mounted on the surface, a pin mounted on the surface, and an interposer printed circuit board mounted on the surface. The electrical component may have a first height orthogonal to the surface. The pin may have a second height orthogonal to the surface, where the second height is greater than the first height. The interposer printed circuit board may comprise a pad and an outer solder bump positioned on the pad. The outer solder bump may be positioned at a third height orthogonal to the surface, where the third height is greater than the first height.

Abstract: A power distribution busway joint monitoring sensor assembly is provided. A first sensor is configured to measure a first position temperature and generate a first signal indicative of the first position temperature, wherein the first position is proximate to a busway joint. A second sensor is configured to measure a second position temperature and generate a second signal indicative of the second position temperature. A sensor controller is configured to i) receive the first signal and the second signal, ii) process the first signal and the second signal, and iii) generate a processed first signal and a processed second signal. A system controller is configured to receive the processed first signal and the processed second signal and generate an alert when a temperature differential between the first position temperature and the second position temperature is greater than a predetermined threshold temperature.

Abstract: According to one aspect of the present disclosure, a single-stage converter includes a rectifying circuit and a buck-boost circuit. The buck-boost circuit includes an inductor with a center tap configured to supply an output of the buck-boost circuit to the rectifying circuit. The buck-boost circuit also includes first and second interleaved arms arranged in parallel with a voltage input of the single-stage converter. The first and second interleaved arms are each coupled to the inductor and include a plurality of switches operable to control the output of the buck-boost circuit.

Abstract: In at least one illustrative embodiment, a printed circuit board may comprise at least one insulating layer, first and second conductive layers separated from one another by the at least one insulating layer, and a conductive via extending through the at least one insulating layer and electrically coupling the first and second conductive layers. The conductive via may include an annular via sidewall having an average radial thickness of at least 2.5 mils (0.0025 inches) and a conductive pad having an average thickness of no more than 3.2 mils (0.0032 inches).