Abstract: A method for data transfer of an electric device configuration, the electric device configuration comprising a plurality of converter devices including a first converter device and a second converter device, each of the converter devices comprising a first converter unit having a first power connection and a second power connection, the first power connection arranged to supply direct current power to the first converter unit and the second power connection arranged to supply electric power from the first converter unit, and the first power connections of the first converter units being electrically connected to one another.

Abstract: To provide status information on devices in a device network, the devices are configured to broadcast status information, both own and received, and store in addition to own status information also received status information of other devices.

Abstract: A converter system comprising a capacitance (C), an inverter (20) comprising at least two controllable semiconductor switches (S1, S2, S3, S4, S5, S6), and at least two DC conductors (100, 200) connected between the capacitance (C) and the at least two controllable semiconductor switches (S1, S2, S3, S4, S5, S6), wherein at least one of the at least two DC conductors (100, 200) comprises carbon fiber.

Abstract: To provide as data rate independent user experience as possible for remote service, function descriptions are associated with identifiers, and a function plan transmitted between a service center and a user apparatus comprises the identifiers but the function plan outputted in the user apparatus comprises the function descriptions.

Abstract: A power electronics module and a method of manufacturing a power electronics module and a base plate. The power electronics module comprising at least one power electronics component, wherein the power electronics module comprises a base plate for transferring heat generated by the at least one power electronics component to a cooling device, the base plate comprising a layered structure having a first copper layer, a second copper layer and a carbon based layer between the first and second copper layers.

Abstract: A method of producing a power electronic assembly and a power electronic assembly including a power electronic module incorporating multiple of semiconductor power electronic switch components, the power electronic module including a base plate with a bottom surface, the power electronic assembly includes further a cooling arrangement for cooling the power electronic module, the cooling arrangement including a cooling surface adapted to be attached against the bottom surface of the base plate of the power electronic module, wherein the power electronic assembly includes further a thermal interface material arranged between the bottom surface of the base plate of the power electronic module and the cooling surface of the cooling arrangement to transfer heat from the power electronic module to the cooling arrangement, the thermal interface material includes a metal foil and a solid lubricant coating.

Abstract: The invention relates to a cooling element (11) comprising: a fluid channel (1) providing a pulsating heat pipe, a first evaporator (14) for receiving heat from electric components (15) and for passing the heat into fluid in the fluid channel (1), and a first condenser (18) for receiving fluid from the first evaporator (14) via the fluid channel (1) and for cooling fluid in the fluid channel. In order to obtain an even temperature distribution at the first evaporator (14) an adiabatic zone where the temperature of the fluid in the fluid channel (1) remains unchanged or a cooling zone, with a second condenser (20) cooling fluid in the fluid channel (1), separates the first evaporator (14) from the loops (6) in the second end (12) of the fluid channel.