Patents Assigned to ABC Taiwan Electronics Corp.
  • Patent number: 9767953
    Abstract: A common mode filter, comprising a winding core, and said winding core further includes a U-type heave portion, said U-type heave portion divides said winding core into a first winding portion, a second winding portion and a cross winding portion; the first winding wires, are wound on said first winding portion, said cross winding portion and said second winding portion in sequence; and the second winding wires, are wound on said first winding portion, said cross winding portion and said second winding portion in sequence. As a result, the common mode filter not only can reduce the effects of the existence capacitors of in high-frequency layers and the inherent functionality of parasitic capacitors in common mode filters with higher frequency characteristics, but also the overall structure is simple, fast assembly and easy operation.
    Type: Grant
    Filed: December 16, 2014
    Date of Patent: September 19, 2017
    Assignee: ABC TAIWAN ELECTRONICS CORP.
    Inventors: Liang-Fang Fan, Ming-Chien Hsiao, Tang-Kang Chen
  • Publication number: 20120263323
    Abstract: An audio driver for a flat sound generator is coupled to the sound generator. The audio driver includes a power amplifier and an audio-amplifying transformer, the power amplifier receiving an input audio signal and the audio-amplifying transformer transforms the input audio signal into an output audio signal to drive a flat sound generator. The flat sound generator includes a perforated electrode plate and a diaphragm. Wherein, the audio-amplifying transformer and the flat sound generator form a low-pass filter effectively.
    Type: Application
    Filed: April 12, 2011
    Publication date: October 18, 2012
    Applicant: ABC TAIWAN ELECTRONICS CORP.
    Inventors: Liang-Fang Fan, Ming-Chien Hsiao, Tang-Kang Chen
  • Patent number: 8087940
    Abstract: A coaxial electric connector includes primarily a dielectric shell and a housing unit which is in an arc shape. The dielectric shell is formed by extrusion formation based on the housing unit and defines an annular space, with a predetermined wall being formed with two fixing sections to define the arc according to the housing unit. Besides, a bottom of the dielectric shell is a dielectric base and an interior of the dielectric shell contains additionally a conductor, a position of which is fixed by the dielectric base. A conductor pin on the conductor, whereas, is extended outward from the dielectric base. Through wrapping of the dielectric shell, the housing unit increases roundness of the entire housing and decreases scratching on a surface of metal part, which occurs when manufacturing the products, thereby improving a yield rate and a service life of the products.
    Type: Grant
    Filed: November 3, 2010
    Date of Patent: January 3, 2012
    Assignee: ABC Taiwan Electronics Corp.
    Inventors: Yeh-Shing Lee, Chun-Hao Hung
  • Publication number: 20110074059
    Abstract: A porous ceramic member preparation method includes the step of mixing powdered silicon carbide and a resin at a predetermined ratio with a solvent to form a paste for enabling the resin to be covered on the surface of the powdered silicon carbide and the solvent to be fully vaporized, the step of processing the paste into a predetermined shape, the step of heating the shaped material at a low heating temperature to cure the resin, and the step of sintering the shaped material into a ceramic member having pores therein.
    Type: Application
    Filed: September 29, 2009
    Publication date: March 31, 2011
    Applicant: ABC TAIWAN ELECTRONICS CORP.
    Inventor: Chou-Mo Wang
  • Patent number: 7872560
    Abstract: A high-efficiency independent planar transformer comprises a pair of up-and-down symmetrical soft ferrite magnetic cores; a primary winding comprising at least one printed circuit board each having a multi-layer structure having at least two layers to form the inductor winding with at least four turns; and two secondary windings comprising at least two planar copper plates or two printed circuit boards. The primary winding and the secondary windings are electrically connected to the main circuit board via terminals. By means of the unique output structure, in the primary winding, two kinds of different output connection structures of the inductor winding can be formed by upward disposing the component side or the solder side of the printed circuit board. In the secondary winding, the inductor winding outputs in series and parallel connections can be accomplished by means of the output terminals or the short-circuit connection with the main circuit board.
    Type: Grant
    Filed: March 19, 2007
    Date of Patent: January 18, 2011
    Assignee: ABC Taiwan Electronics Corp.
    Inventor: Ming-En Hsu
  • Patent number: 7422921
    Abstract: This invention is related to a micromesh material and a mono-crystal high frequency capacitor manufactured with said micromesh material as well as the producing method for the mono-crystal high frequency capacitor, i.e., disperse a colloidal material unevenly to form a sub-micrometer ceramic cell structure to get a micromesh mono-crystal material on the basis of the theory of liquid-liquid phase transformation, and produce capacitors with the obtained material to enhance the high frequency characteristics of those capacitors with the micromesh mono-crystal structure (air medium) of dielectric ceramics.
    Type: Grant
    Filed: November 27, 2002
    Date of Patent: September 9, 2008
    Assignee: ABC Taiwan Electronics Corp.
    Inventor: Chavy Hsu
  • Patent number: 6967844
    Abstract: A ceramic heat sink having a micro-pores structure includes a thermal conductive layer mounted on a surface of a heat source to absorb heat from the heat source, a heat dissipation layer combined with the thermal conductive layer and having a micro-pores structure with hollow crystals to provide a relatively greater surface area, and a cooling fan mounted on the heat dissipation layer to provide a forced convection effect. Thus, the micro-pores structure can increase the contact surface area between the heat sink and the air, thereby enhancing the heat dissipation effect of the ceramic heat sink.
    Type: Grant
    Filed: August 29, 2003
    Date of Patent: November 22, 2005
    Assignee: ABC Taiwan Electronics Corp.
    Inventor: Chaby Hsu
  • Patent number: 6705393
    Abstract: A ceramic heat sink having a micro-pores structure includes a heat dissipation layer, and a thermal conductive layer. The heat dissipation layer forms a ceramic micro-cell structure, which is combined with a sub-micrometer powder, thereby forming the heat dissipation layer. The thermal conductive layer is mounted on the heat dissipation layer to contact with a heat source. Thus, the thermal conductive layer absorbs the heat energy from the heat source; the heat dissipation layer has a micro-pores structure with hollow crystals, and the air functions as the media of heat dissipation, so that the heat dissipation capacity of the ceramic heat sink is greatly enhanced.
    Type: Grant
    Filed: February 25, 2003
    Date of Patent: March 16, 2004
    Assignee: ABC Taiwan Electronics Corp.
    Inventor: Chaby Hsu