Abstract: This invention relates to wall siding assemblies, particularly to horizontal siding panels and to improved clip means for connecting same to the sides of a building structure. Each siding panel has two elongated recesses or grooves on its backface near the bottom edge of the panel, one recess being nearer the bottom end than the other, with a resilient clip having opposite end portions located in the respective recesses such that the clip is retained in engagement with the panel. The clip has a support leg extending therefrom. Each successive panel is assembled on top of a lower panel already secured to the wall, by positioning the support leg of the clip in engagement with the upper edge of the lower panel, with the lower portion of the upper panel overlapping the upper edge of the lower panel. The upper edge of the newly installed panel is then secured to the wall, for example, by nailing. The clips are easily assembled with the panels, and installation is a very simple matter.

Abstract: This relates to a method of decorating a panel having a multi-level pattern of ridges and recesses on a major surface thereof. This patterned major surface is coated with a liquid pigmented material and is thereafter rollingly contacted under pressure with a roll having a resilient surface. The resilient roll picks up liquid pigmented material from the higher portions of the pattern while at the same time the pigmented material which has been picked up from the panel surface is continually removed or cleaned from the roll surface. Thereafter, the pigmented material which remains on the panel surface is at least partially dried or cured. In the preferred form of the invention the panel surface has a layer of paper integrally combined therewith, the paper having a printed surface thereon which complements the multi-level surface pattern of the panel.