Abstract: A method for suppressing material warpage by means of a pressure difference comprises the following steps: a. preparing a plurality of carrier boards; b. preparing a plurality of carrier board pressing devices having an upper surface and a lower surface on which at least one air bag is provided; c. adjusting the processing chamber to be a working temperature and a working pressure, so that the carrier boards and the carrier board pressing devices placed therein are surrounded by the working temperature and the working pressure; d. effectively suppressing warpage of the carrier board by using a pressure difference between a first predetermined pressure in the air bag and the working pressure of the processing chamber. Thereby, production quality of carrier board is significantly improved, as well as the cost for production of which is effectively reduced.

Abstract: This invention provides a method and apparatus for manufacturing electronic devices. The method includes: providing a substrate having a first surface; providing an electronic device having bumps; mounting the bumps to the first surface to form an integrated unit; applying a capillary underfill to multiple sides of the electronic device, enabling the underfill to creep along and fill the gap between the electronic device and the substrate; placing the integrated unit into a processing chamber; raising the temperature in the chamber to a first predetermined temperature; reducing the pressure in the chamber to a first predetermined pressure of a vacuum pressure, and maintaining the vacuum pressure for a predetermined time period; raising the pressure in the chamber to a second predetermined pressure higher than 1 atm, and maintaining the second predetermined pressure for a predetermined time period; and adjusting the temperature in the chamber to a second predetermined temperature.

Abstract: This invention provides a method and apparatus for manufacturing electronic devices. The method includes: providing a substrate having a first surface; providing an electronic device having bumps; mounting the bumps to the first surface to form an integrated unit; applying a capillary underfill to multiple sides of the electronic device, enabling the underfill to creep along and fill the gap between the electronic device and the substrate; placing the integrated unit into a processing chamber; raising the temperature in the chamber to a first predetermined temperature; reducing the pressure in the chamber to a first predetermined pressure of a vacuum pressure, and maintaining the vacuum pressure for a predetermined time period; raising the pressure in the chamber to a second predetermined pressure higher than 1 atm, and maintaining the second predetermined pressure for a predetermined time period; and adjusting the temperature in the chamber to a second predetermined temperature.