Patents Assigned to ABLESTIK (SHANGHAI) LTD.
  • Patent number: 9085651
    Abstract: A silicon-based curable composition providing improved transparency, mechanical strength and resistance against heat and photo-degradation comprises at least one organopolysiloxane represented by the composition formula (1): (R13SiO1/2)a(R12SiO2/2)b(R1R2SiO2/2)c(R1SiO3/2)d(R2SiO3/2)e(R12R2SiO1/2)f??(1), wherein each R2 independently represents a methacryloxyalkyl group having 5 to 20 carbon atoms and a?0, b?0, c?0, d?0, e?0, f?0, c+e>0, and a+b+c+d+e+f=1; and at least one curing catalyst. The product is ideal for encapsulation of LED (light emitting device) elements.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: July 21, 2015
    Assignees: ABLESTIK (SHANGHAI) LTD., Henkel AG & CO. KGAA
    Inventors: Jing Zhou, Stijn Gillissen, Karen Leyssens, Thomas Plantenberg, Ralf Dunekake, Leticia Borque
  • Publication number: 20130200426
    Abstract: A silicon-based curable composition providing improved transparency, mechanical strength and resistance against heat and photo-degradation comprises at least one organopolysiloxane represented by the composition formula (1): (R13SiO1/2)a(R12SiO2/2)b(R1R2SiO2/2)c(R1SiO3/2)d(R2SiO3/2)e(R12R2SiO1/2)f??(1), wherein each R2 independently represents a methacryloxyalkyl group having 5 to 20 carbon atoms and a?0, b?0, c?0, d?0, e?0, f?0, c+e>0, and a+b+c+d+e+f=1; and at least one curing catalyst. The product is ideal for encapsulation of LED (light emitting device) elements.
    Type: Application
    Filed: March 15, 2013
    Publication date: August 8, 2013
    Applicants: ABLESTIK (SHANGHI) LTD., HENKEL AG CO. KGAA
    Inventors: HENKEL AG & CO. KGAA, ABLESTIK (SHANGHAI) LTD.
  • Publication number: 20100044088
    Abstract: Conductive adhesives, which do not have the problem of migration in conductive metals upon application of a voltage and which exhibit low resistance values, are provided. One embodiment of the present invention relates to a conductive adhesive comprising a conductive filler and a resin, characterized in that the conductive filler comprises an alloy powder of silver and tin and further contains an additive comprising at least one member selected from among a chelator, an antioxidant, and a metal surfactant. Additives that can be used are chelators such as hydroxyquinolines, salicylidene aminothiophenols or phenanthrolines, antioxidants such as hydroquinones or benzotriazoles, and metal surfactants such as organic acids, acid anhydrides or organic acid salts.
    Type: Application
    Filed: July 5, 2006
    Publication date: February 25, 2010
    Applicants: ABLESTIK (JAPAN) CO. LTD., NAMICS CORPORATION
    Inventors: Bunya Watanabe, Go Toida