Abstract: The embodiment relates to a laser drilling system and a method for selectively removing an insulating layer, and comprises: a workpiece including a metal layer and an insulating layer disposed on the metal layer; a stage on which the workpiece is placed; an optical delivery system disposed on the stage and configured to deliver laser light to the insulating layer; a laser beam generator connected to the optical delivery system and configured to output laser light; a blowing-suction device disposed between the workpiece and the optical delivery system; a monitoring-inspection device configured to inspect the surface shape of the workpiece; and a control unit configured to control the laser light generated by the laser beam generator and/or the optical delivery system based on the surface shape information, wherein the optical delivery system controls the laser light by means of a diffractive optical system.

Abstract: A tray apparatus for transferring a substrate is provided, comprising: a fixed tray comprising a plate-shaped fixed frame having a shape corresponding to the substrate, and configured to seat the substrate while supporting a bottom surface of the substrate in a state of being spaced apart by a predetermined height from the fixed frame; and an inner tray comprising a plate-shaped inner frame corresponding to the substrate, the inner tray being coupled in a state of being stacked on the fixed frame so as to be in a state of being spaced apart from the substrate, the inner frame being brought into close contact with the bottom surface of the substrate while being lifted by a substrate carrier so as to separate the substrate from the fixed tray, and the inner tray being transferred together with the substrate by the substrate carrier.

Abstract: An embodiment provides a method for partitioning a target reticle into a plurality of unit reticles based on a unit-bare reticle and a structure for interconnecting the partitioned unit reticles to ensure pattern continuity. In the partitioning method, boundary lines are extracted based on wiring patterns and an outermost outline, and are then connected to generate candidate sets of single closed curves that collectively cover the entire target reticle. From these candidates, only the sets that can be arranged within the unit-bare reticle are retained, and a unit reticle set is determined by selecting the candidates in ascending order of the number of single closed curves. Adjacent first and second unit reticles have respective connection surfaces that are in contact with each other, and wire alignment and continuity between the unit reticles are reliably achieved by linear patterns passing through the connection surfaces and stitching linear patterns in stitching regions.

Abstract: According to embodiments, a method for forming a seed layer comprises: an operation of forming an ion-passage hole by removing a portion of an insulating layer in a workpiece arranged such that a metal-pattern layer is disposed below and the insulating layer is disposed over it; a masking operation of forming a metal mask layer on the insulating layer; and a sputtering operation of forming a seed layer on the insulating layer by plasma sputtering; wherein the metal mask layer is connected to the metal-pattern layer through a sidewall surface of the ion-passage hole.

Abstract: The embodiment relates to a laser drilling system and a method for selectively removing an insulating layer on a metal layer. The system comprises a processing target, a stage, a laser beam generator, and an optical delivery system that delivers laser light to the insulating layer through a mask. A monitoring and inspection device acquires surface-profile information of the processing target, and a control device uses the information to control the laser light and/or the optical delivery system. A blowing-suction device may be disposed between the processing target and the optical delivery system to remove particulate contaminants or smear generated during etching. The mask includes, in a top view, a light transmission region and one or more phase shift regions that transmit the laser light and output depth-etching lasers having different intensities, and a light-shielding region that blocks the laser light.

Abstract: A device package according to the present disclosure comprises at least one device and an encapsulation layer surrounding the device. The encapsulation layer comprises a first encapsulation layer surrounding an upper surface of the device and a second encapsulation layer disposed below the first encapsulation layer. The device package further comprises an adhesive layer disposed between the first encapsulation layer and the second encapsulation layer. In this case, a device package having excellent reliability and long-term durability may be provided, and formation of electrical connection may be facilitated when the device package is mounted in a packaging substrate.

Abstract: An embodiment provides a method of manufacturing via holes, comprising: a first processing operation of applying a long-wavelength laser to a predetermined position of a workpiece to form a first hole; and a second processing operation of applying a short-wavelength laser to the position where the first hole has been formed to form a second hole and thereby form a via hole. The workpiece comprises an insulating layer disposed over a core substrate, and the via hole is formed in the insulating layer.

Abstract: According to the embodiments, a method for forming blind vias and a method for manufacturing a packaging substrate comprise: a protective-layer arranging operation of preparing a substrate in which a machining protective layer is disposed over an insulating layer; a laser operation of forming a blind via at a predetermined position on the machining protective layer; and a cleaning operation of removing particulate by-products or smear generated in the blind via and removing the machining protective layer, thereby forming a blind via in the insulator.

Abstract: A method of manufacturing a packaging substrate according to the present disclosure comprises a resist pattern layer forming step of forming a resist pattern layer on a base substrate comprising a core layer and a metal base layer formed on the core layer. The resist pattern layer forming step comprises a lamination process of laminating a resist layer on the base substrate and an exposure process of selectively exposing the resist layer. The resist pattern layer comprises pattern holes having a diameter of 20 ?m or less. The resist layer comprises a negative resist. An exposure dose of the exposure process is from 170 mJ/cm2 to 215 mJ/cm2. In this case, hole patterns having a fine pitch may be more accurately and densely formed in an insulating layer.

Abstract: The embodiments relate to a packaging substrate and a manufacturing method thereof. The packaging substrate comprises: a glass core comprising plate-shaped glass and a cavity disposed in the plate-shaped glass; a first element module disposed in the cavity; an upper layer disposed over the glass core and comprising redistribution lines; and a lower layer disposed under the glass core and comprising redistribution lines. The upper layer comprises an electrically conductive layer disposed over a top surface of the glass core, and the lower layer further comprises a module bottom metal layer, which is a metal layer disposed on a bottom surface of the first element module. The module bottom metal layer covers at least 60% of an area of one surface of a first element disposed in the first element module, and the module bottom metal layer is exposed at a bottom surface of the lower layer.

Abstract: A method of manufacturing a packaging substrate according to the present disclosure comprises: a preparation step of preparing a preliminary substrate which comprises a core layer in which a cavity portion comprises a device mounting space and an inner side surface of the cavity surrounding the device mounting space; a surface treatment step of increasing surface energy of at least a portion of the inner side surface of the cavity; and an encapsulation layer forming step of forming an encapsulation layer which comprises surrounding at least a portion of the surface of the device portion with an encapsulation layer-forming composition, thereby manufacturing the packaging substrate. In this case, defects that may occur in a process of forming the encapsulation layer and an insulating layer in the packaging substrate may be effectively suppressed.

Abstract: In one aspect, a method of controlling a substrate transfer apparatus includes generating sequences that include values of a substrate sequence number, a process to be performed on each surface of a glass substrate, and whether inspection is to be performed, processing the sequences, determining, according to a processing order sequence, whether a current surface of a loaded glass substrate corresponds to a processing surface, operating a flipper to invert the loaded glass substrate when it is determined not to correspond to the processing surface, delivering the glass substrate to equipment connected to the substrate transfer apparatus and performing a process according to the processing order sequence, determining whether a value of inspection in the processing order sequence corresponds to inspection, and when it is determined to correspond to inspection, inspecting the processing surface of the glass substrate and outputting an inspection result.

Abstract: The present invention relates to a substrate transfer robot and a substrate transfer method using the same, and the substrate transfer robot according to one aspect of the present invention includes a body, a robot arm formed with a plurality of joints and rotatably installed on the body to transfer a substrate, a first sensor installed on the robot arm to sense a front edge of the substrate to be supported by the robot arm, a second sensor installed on the robot arm to sense a side edge of the substrate supported by the robot arm, and a controller provided on the body and configured to control the operation of the robot arm based on a value sensed by the first sensor and a value sensed by the second sensor.

Abstract: The present invention relates to a substrate transfer apparatus and method, and the substrate transfer apparatus according to one aspect of the present invention includes a lower stage that supports a lower surface of a substrate and moves the substrate upward, and an upper stage that suctions an upper surface of the substrate moved upward by the lower stage and inverts the substrate.

Abstract: According to the embodiment, a panel comprises a glass core having a width or length of 10 cm or more, and an upper layer disposed on the glass core and having redistribution lines therein. A unit refers to a portion in which a semiconductor element is disposed within a die layout and is separated into an individual packaging substrate. A plurality of the units are disposed on the panel. A reinforcement structure is disposed on the upper layer, configured to surround at least a portion of the die layout. A first unit comprises a first die layout and a first reinforcement structure disposed on the first die layout. A second unit comprises a second die layout and a second reinforcement structure disposed on the second die layout. The second unit is disposed adjacent to one side of the first unit, and the first reinforcement structure and the second reinforcement structure are disposed separately from each other.

Abstract: A method of manufacturing a packaging substrate according to the present disclosure includes a preparing step of preparing a panel-level packaging substrate comprising a core substrate, a first redistribution layer disposed on the core substrate, and a second redistribution layer disposed under the core substrate, and an electroless surface treatment step of forming terminals by simultaneously performing electroless surface treatment on an upper surface and a lower surface of the panel-level packaging substrate. The packaging substrate comprises a core layer, the first redistribution layer disposed on the core layer, the second redistribution layer disposed under the core layer, and the terminals disposed on an upper surface of the first redistribution layer and a lower surface of the second redistribution layer. A difference between a maximum thickness value and a minimum thickness value of the terminals formed on the packaging substrate is 5 ?m or less.

Abstract: The embodiments disclose a laser processing method for a glass substrate and a stage. The method comprises: a placement operation of disposing the glass substrate with a space above a stage on which a venting film is disposed; and a processing operation of irradiating a laser onto the glass substrate to form defects, thereby manufacturing the glass substrate in which the defects are formed. The stage, which is applied to laser processing, comprises: a stage main body; a support rim protruding from the stage main body; a stage cavity surrounded by the support rim and open at a top; and a pin permitted to move vertically; wherein the pin is disposed in the stage cavity in a number of one or two or more, and the stage main body has a metal surface.

Abstract: A method for manufacturing a core substrate included in a packaging substrate, comprises: operation A, preparing a glass core in which through-holes and a cavity are disposed; operation B, preparing an adhesive laminate in which an adhesive layer is disposed on a lower surface of the glass core; operation C, disposing a cavity element in the cavity of the adhesive laminate; operation D, preparing a fill-in laminate by disposing a dispensing material in a space between the cavity element and a wall surface of the cavity; operation E, preparing an adhesion-strengthening treatment layer by performing an adhesion-strengthening treatment on a surface of the fill-in laminate; operation F, preparing an insulating laminate by forming a first surface insulating layer on an upper surface of the glass core of the fill-in laminate; and operation G, preparing the core substrate by removing the adhesive layer and forming a second surface insulating layer.

Abstract: Embodiments relate to a glass core for packaging, a packaging substrate, and a method of manufacturing the glass core. A glass core for packaging comprises: plate glass having first and second surfaces facing each other; through-vias penetrating the plate glass in a thickness direction; and a cavity penetrating the first and second surfaces and allowing placement of a semiconductor element therein. The cavity provides a cavity space surrounded by a cavity inner wall, which is an inner wall surface connecting the first and second surfaces of the plate glass. A die block is disposed in the cavity space; the die block has a cavity die and a glass spacer vertically stacked. A distribution material is disposed between the cavity inner wall and the die block. The embodiments alleviate thickness mismatch when embedding a die in the cavity, improve workability and reliability.