Abstract: The present specification relates to a method of manufacturing a packaging substrate and a packaging substrate manufactured thereby. The packaging substrate according to the present specification includes a core layer comprising a glass core and a cavity portion, wherein the glass core is a glass substrate having a first surface and a second surface facing each other, the cavity portion has an accommodation space for accommodating an electronic element as a part of the glass core is recessed or penetrated, and the element package is placed in the accommodation space of the cavity portion, wherein the element package comprises i) a plurality of arranged electronic elements; and ii) a molding portion containing a molding material and the molding portion arranges for the molding material to surround the electronic elements, and a concave portion having arranged dimples is disposed in some of the molding portion at the element package.

Abstract: Embodiments relate to packaging substrates and methods of manufacturing the same. A substrate with embedded elements according to the embodiments comprises a glass substrate comprising a first surface and a second surface facing each other; and an upper layer stacked on the first surface, or a lower layer stacked on the second surface; wherein the glass substrate may have an edge region that protrudes from the upper layer or the lower layer. A manufacturing method of a packaging substrate, comprises a forming operation of an upper layer on a first surface of a glass substrate comprising the first surface and a second surface facing each other; a removing operation of the upper layer by a predetermined width along a predetermined cutting line; a forming operation of a filamentation along the cutting line on the glass substrate from which the upper layer has been removed; and a cutting operation of the glass substrate using the filamentation.

Abstract: An embodiment relates to a packaging substrate and a manufacturing method of the same. The packaging substrate according to an embodiment includes a glass core including a first surface and a second surface facing each other; and an upper layer stacked on the first surface or a lower layer stacked on the second surface, and the corners of the packaging substrate may be treated as curved surfaces or chamfered. Through this, it is possible to protect the glass core from external impact and minimize damage and damage to the glass core.

Abstract: The present disclosure relates to a manufacturing method for a packaging substrate and a packaging substrate utilizing the method. The packaging substrate according to the present disclosure includes; a core layer including a glass substrate having first and second surfaces facing each other and a cavity portion; an insulating layer formed on the first surface; and a light transmitting portion formed on an upper surface of the insulating layer, wherein a light receiving portion is disposed in the cavity portion, the insulating layer includes a via penetrating in a thickness direction, and a portion of a lower surface of the light transmitting portion may abut on the via. Though it, the packaging substrate may be compactly manufactured by reducing the space for the configuration of electrically connecting the conventional photoelectric elements, and the effect of improving the sensing efficiency and performance of the photoelectric sensor relative to the space may occur.

Abstract: A packaging substrate includes a glass substrate comprising a first surface and a second surface facing each other, a plurality of core vias passing through the glass substrate in a thickness direction, and a core layer having a core seed layer as a seed for forming an electrically conductive layer on a surface of the core vias. The packaging substrate further includes an upper layer disposed on one surface of the core layer. The core layer includes a core distribution layer disposed on a surface of the glass substrate or a surface of the core via. The core distribution layer includes an electrically conductive layer at least a part of which electrically connects an electrically conductive layer of the first surface and an electrically conductive layer of the second surface through the core via.

Abstract: A substrate according to a present disclosure comprises a glass core having a top surface. The glass core top surface has Rs/z, a ratio value of skewness to maximum height roughness of Equation 1 below, between ?5 nm?2 and 50 nm?2. R s / z = R ? s ? k Rz 2 × 1 ? 0 ? 0 ? 0 [ Equation ? l ] In Equation 1 above, the Rsk value is skewness, and the Rz value is maximum height roughness (in nm). For such a substrate, an electrically conductive layer with substantially uniformly improved adhesion to the glass core can be implemented. The electrically conductive layer can efficiently transmit signals even when high frequency power is applied.

Abstract: A substrate according to an embodiment includes a glass core having a top surface. The top surface of the glass core has a value of Rq*k, bond roughness index of Equation 1 below, from 3.5 nm to 150 nm. R q * k = R ? q × R ? k ? u 2 [ Equation ? l ] In Equation 1 above, the value of Rq is root mean square deviation (in nm) and the value of Rku is kurtosis. For these substrates, an electrically conductive layer can be implemented that has substantially uniformly improved adhesion to the glass core and can efficiently transmit signals even when high-frequency power is applied.

Abstract: The present specification relates to a method of manufacturing a packaging substrate and a packaging substrate manufactured thereby. The packaging substrate according to the present specification includes a core layer including a glass substrate having a first surface and a second surface facing each other and a cavity portion passing through the glass substrate, wherein a cavity module is disposed in the cavity portion, the cavity module comprise a cavity element and a first insulating layer is formed on some surfaces other than one surface or on all the surface of the cavity element, and a second insulating layer is incorporated into the remaining portion of the cavity portion other than the cavity module, and the first insulating layer and the second insulating layer have different dielectric constants. Accordingly, an undulation phenomenon due to a gap between elements, a gap between the cavity portion and an element, and/or the like may be prevented, and a leakage current may be prevented from occurring.

Abstract: The present disclosure relates to a method of manufacturing a packaging substrate and a packaging substrate manufactured thereby. The method of manufacturing a packaging substrate according to the present disclosure includes: generating a glass structure that is a core via, a cavity portion, or both on a glass core including a first surface and a second surface facing each other; forming an insulating layer on the first surface or second surface using an insulating film; and forming an upper layer including an upper distribution layer and an upper surface connection layer on the insulating layer. The forming of the insulating layer May include a primary curing operation of laminating a first insulating film on the first surface and primarily curing the first insulating film, and a secondary curing operation of laminating a second insulating film on the primarily cured first insulating film and secondarily curing the second insulating film.

Abstract: An embodiment relates to a packaging substrate and a method of manufacturing the same. The packaging substrate according to the embodiment includes a core layer, wherein the core layer may include a glass substrate including a first surface and a second surface facing each other, and at least two or more cavity portions each having an opening open in a direction toward the first surface or a direction toward the second surface and having different depths. Accordingly, various types of cavity elements may be mounted without undulation.

Abstract: An embodiment relates to a packaging substrate and a semiconductor device, the semiconductor device comprising: an element unit including a semiconductor element; and a packaging substrate electrically connected to the element unit, wherein a glass substrate is used as the core of the packaging substrate so as to achieve a closer connection between the semiconductor element and a motherboard, thereby allowing an electrical signal to be transmitted over as short a distance as possible. Accordingly, provided is a packaging substrate which can significantly improve electrical characteristics such as signal transmission speed, can substantially prevent the occurrence of a parasitic element and thus more simplify the insulation layer treatment process, and can be applied to a high-speed circuit.

Abstract: A semiconductor apparatus includes a semiconductor element unit comprising one or more semiconductor elements, a packaging substrate, and a motherboard. The packaging substrate, connected to the semiconductor elements, includes a core layer and an upper layer disposed on the core layer. The core layer includes a glass substrate, a core via, and a core distribution layer. The glass substrate having a first surface and a second surface facing each other. A part of the core distribution layer connects electrically conductive layers of the first surface and an electrically conductive layer of the second surface through the core via penetrating through the glass substrate. A thickness of a thinner one among electrically conductive layers of the core distribution layer is the same as or greater than a width of a thinner one among the electrically conductive layers of the upper layer.

Abstract: Disclosed herein are a substrate gripper and a method of transferring a substrate using the same, which include a frame, a plurality of pad holes connected to the frame, and a plurality of suction pads disposed on the frame and connected to the pad holes, wherein the suction pad has a contact surface which comes into contact with one surface of a target substrate when the target substrate is mounted, the suction pad includes a first suction pad having a contact surface at a first height, without supporting the target substrate, and a second suction pad having a contact surface at a second height in a state of not supporting the target substrate, and the first height is greater than the second height based on the frame. In this way, the substrate gripper can stably suction and support the target substrate even when warpage occurs.

Abstract: A substrate with an embedded element includes a core substrate having one surface and a cavity recessed from the one surface in a thickness direction; an element package disposed in the cavity, the element package comprising one or more elements; and a substrate insulating material surrounding at least part of the element package. When observed from a side surface of the substrate with the embedded element, the substrate with the embedded element includes a cavity area in which the cavity is disposed and a substrate area outside of the cavity area. An absolute value of difference between an average thickness of the substrate area and an average thickness of the cavity area is 50 ?m or less.

Abstract: A substrate comprising a glass substrate is provided. The glass substrate includes a first surface, a second surface, and an edge area connecting the first surface and the second surface; a groove part formed toward the inside direction of a glass substrate from a portion of the edge area; and a protecting device formed on the groove part, wherein the groove part penetrates the first surface and the second surface.

Abstract: A packaging substrate includes a core layer including a glass substrate with a first surface and a second surface facing each other, and a plurality of core vias. The plurality of core vias penetrating through the glass substrate in a thickness direction, each comprising a circular core via having a circular opening part and a non-circular core via having an aspect ratio of 2 to 25 in the x-y direction of an opening part. One or more electric power transmitting elements are disposed on the non-circular core via.

Abstract: Embodiments relate to a semiconductor packaging substrate, a semiconductor packages, and a method for manufacturing the semiconductor packaging substrate, wherein a substrate comprising a one surface, other surface facing the one surface, a recessed surface that the one surface recessed, and a side wall connecting the one surface and the recessed surface; and plurality of first vias that penetrating the recessed surface and the other surface; wherein the plurality of first vias include a thermally conductive material. Embodiments have an excellent heat dissipation effect and can prevent warpage on the surface of the substrate due to thermal expansion.

Abstract: A packaging substrate according to an embodiment has an upper surface and a lower surface. The packaging substrate includes a mounting region in which an element is accommodated and a core substrate in which the mounting region is disposed. The mounting region includes a cavity portion formed by recessing a portion of the core substrate, a cavity portion side surface formed inside the core substrate in a thickness direction of the core substrate to form an outer periphery of the cavity portion, and a first heat dissipation portion disposed adjacent to the outer periphery of the cavity portion. The first heat dissipation portion is a thermal path through which heat of the packaging substrate is transmitted to the outside. The first heat dissipation portion includes one or more heat dissipation vias each having an area of 5,000 ?m2 to 75 mm2 when viewed from the upper surface of the packaging substrate.

Abstract: A packaging substrate according to an embodiment includes a cavity region in which an element is accommodated, and a core substrate in which the cavity region is disposed. The cavity region includes an accommodation portion that is a space formed by recessing a portion of the core substrate, a side surface that is formed on an inner side in a thickness direction of the core substrate and forms an outer periphery of the accommodation portion, and an elastic layer disposed adjacent to the side surface. An elastic modulus of the elastic layer is 2 GPa to 15 GPa. The packaging substrate may have excellent thermomechanical reliability and long-term durability.

Abstract: An embodiment relates to a substrate and a semiconductor module. A substrate capable of manufacturing a substrate for packaging, which is an individual product, with excellent yield despite cracks that may occur at edges or side surfaces of a core is provided.