Abstract: An embodiment relates to a packaging substrate and a method of manufacturing the same. The packaging substrate includes a core layer, wherein the core layer may include a glass substrate including a first surface and a second surface facing each other, and at least two or more cavity portions having different depths. The cavity portion includes a first cavity portion open and recessed in the direction toward the first surface and having a first depth and a third cavity portion having a third depth passing through the first surface and the second surface. A third cavity element is arranged in the third cavity portion, an insulating layer is disposed on the third cavity element and connection electrodes are disposed on the third cavity element in both direction toward the first surface and the second surface.

Abstract: The present specification relates to a method of manufacturing a packaging substrate and a packaging substrate manufactured thereby. The packaging substrate according to the present specification includes a core layer comprising a glass core and a cavity portion, wherein the glass core is a glass substrate having a first surface and a second surface facing each other, the cavity portion has an accommodation space for accommodating an electronic element as a part of the glass core is recessed or penetrated, and the element package is placed in the accommodation space of the cavity portion, wherein the element package comprises i) a plurality of arranged electronic elements; and ii) a molding portion containing a molding material and the molding portion arranges for the molding material to surround the electronic elements, and a concave portion having arranged dimples is disposed in some of the molding portion at the element package.

Abstract: A connection structure of vias is provided. The connection structure includes multiple vias which are disposed within an insulting layer to connect electrical signals in upward and downward directions, the multiple vias comprise a first via and a second via disposed in a vertically stacked relationship with each other, the first via and the second via are configured to meet at a same surface, and the second via and the first via are disposed in respectively different numbers.

Abstract: A method of manufacturing a substrate with embedded elements comprises preparing a core substrate having a surface and a cavity recessed from the surface in a thickness direction, disposing an element package in the cavity and forming a substrate insulating material to surround at least part of the element package.

Abstract: The embodiment relates to a laser drilling system and a method for selectively removing an insulating layer, and comprises: a workpiece including a metal layer and an insulating layer disposed on the metal layer; a stage on which the workpiece is placed; an optical delivery system disposed on the stage and configured to deliver laser light to the insulating layer; a laser beam generator connected to the optical delivery system and configured to output laser light; a blowing-suction device disposed between the workpiece and the optical delivery system; a monitoring-inspection device configured to inspect the surface shape of the workpiece; and a control unit configured to control the laser light generated by the laser beam generator and/or the optical delivery system based on the surface shape information, wherein the optical delivery system controls the laser light by means of a diffractive optical system.

Abstract: A tray apparatus for transferring a substrate is provided, comprising: a fixed tray comprising a plate-shaped fixed frame having a shape corresponding to the substrate, and configured to seat the substrate while supporting a bottom surface of the substrate in a state of being spaced apart by a predetermined height from the fixed frame; and an inner tray comprising a plate-shaped inner frame corresponding to the substrate, the inner tray being coupled in a state of being stacked on the fixed frame so as to be in a state of being spaced apart from the substrate, the inner frame being brought into close contact with the bottom surface of the substrate while being lifted by a substrate carrier so as to separate the substrate from the fixed tray, and the inner tray being transferred together with the substrate by the substrate carrier.

Abstract: An embodiment provides a method for partitioning a target reticle into a plurality of unit reticles based on a unit-bare reticle and a structure for interconnecting the partitioned unit reticles to ensure pattern continuity. In the partitioning method, boundary lines are extracted based on wiring patterns and an outermost outline, and are then connected to generate candidate sets of single closed curves that collectively cover the entire target reticle. From these candidates, only the sets that can be arranged within the unit-bare reticle are retained, and a unit reticle set is determined by selecting the candidates in ascending order of the number of single closed curves. Adjacent first and second unit reticles have respective connection surfaces that are in contact with each other, and wire alignment and continuity between the unit reticles are reliably achieved by linear patterns passing through the connection surfaces and stitching linear patterns in stitching regions.

Abstract: According to embodiments, a method for forming a seed layer comprises: an operation of forming an ion-passage hole by removing a portion of an insulating layer in a workpiece arranged such that a metal-pattern layer is disposed below and the insulating layer is disposed over it; a masking operation of forming a metal mask layer on the insulating layer; and a sputtering operation of forming a seed layer on the insulating layer by plasma sputtering; wherein the metal mask layer is connected to the metal-pattern layer through a sidewall surface of the ion-passage hole.

Abstract: The embodiment relates to a laser drilling system and a method for selectively removing an insulating layer on a metal layer. The system comprises a processing target, a stage, a laser beam generator, and an optical delivery system that delivers laser light to the insulating layer through a mask. A monitoring and inspection device acquires surface-profile information of the processing target, and a control device uses the information to control the laser light and/or the optical delivery system. A blowing-suction device may be disposed between the processing target and the optical delivery system to remove particulate contaminants or smear generated during etching. The mask includes, in a top view, a light transmission region and one or more phase shift regions that transmit the laser light and output depth-etching lasers having different intensities, and a light-shielding region that blocks the laser light.

Abstract: An embodiment provides a method of manufacturing via holes, comprising: a first processing operation of applying a long-wavelength laser to a predetermined position of a workpiece to form a first hole; and a second processing operation of applying a short-wavelength laser to the position where the first hole has been formed to form a second hole and thereby form a via hole. The workpiece comprises an insulating layer disposed over a core substrate, and the via hole is formed in the insulating layer.

Abstract: A device package according to the present disclosure comprises at least one device and an encapsulation layer surrounding the device. The encapsulation layer comprises a first encapsulation layer surrounding an upper surface of the device and a second encapsulation layer disposed below the first encapsulation layer. The device package further comprises an adhesive layer disposed between the first encapsulation layer and the second encapsulation layer. In this case, a device package having excellent reliability and long-term durability may be provided, and formation of electrical connection may be facilitated when the device package is mounted in a packaging substrate.

Abstract: According to the embodiments, a method for forming blind vias and a method for manufacturing a packaging substrate comprise: a protective-layer arranging operation of preparing a substrate in which a machining protective layer is disposed over an insulating layer; a laser operation of forming a blind via at a predetermined position on the machining protective layer; and a cleaning operation of removing particulate by-products or smear generated in the blind via and removing the machining protective layer, thereby forming a blind via in the insulator.

Abstract: A method of manufacturing a packaging substrate according to the present disclosure comprises: a preparation step of preparing a preliminary substrate which comprises a core layer in which a cavity portion comprises a device mounting space and an inner side surface of the cavity surrounding the device mounting space; a surface treatment step of increasing surface energy of at least a portion of the inner side surface of the cavity; and an encapsulation layer forming step of forming an encapsulation layer which comprises surrounding at least a portion of the surface of the device portion with an encapsulation layer-forming composition, thereby manufacturing the packaging substrate. In this case, defects that may occur in a process of forming the encapsulation layer and an insulating layer in the packaging substrate may be effectively suppressed.

Abstract: A method of manufacturing a packaging substrate according to the present disclosure comprises a resist pattern layer forming step of forming a resist pattern layer on a base substrate comprising a core layer and a metal base layer formed on the core layer. The resist pattern layer forming step comprises a lamination process of laminating a resist layer on the base substrate and an exposure process of selectively exposing the resist layer. The resist pattern layer comprises pattern holes having a diameter of 20 ?m or less. The resist layer comprises a negative resist. An exposure dose of the exposure process is from 170 mJ/cm2 to 215 mJ/cm2. In this case, hole patterns having a fine pitch may be more accurately and densely formed in an insulating layer.

Abstract: The embodiments relate to a packaging substrate and a manufacturing method thereof. The packaging substrate comprises: a glass core comprising plate-shaped glass and a cavity disposed in the plate-shaped glass; a first element module disposed in the cavity; an upper layer disposed over the glass core and comprising redistribution lines; and a lower layer disposed under the glass core and comprising redistribution lines. The upper layer comprises an electrically conductive layer disposed over a top surface of the glass core, and the lower layer further comprises a module bottom metal layer, which is a metal layer disposed on a bottom surface of the first element module. The module bottom metal layer covers at least 60% of an area of one surface of a first element disposed in the first element module, and the module bottom metal layer is exposed at a bottom surface of the lower layer.

Abstract: In one aspect, a method of controlling a substrate transfer apparatus includes generating sequences that include values of a substrate sequence number, a process to be performed on each surface of a glass substrate, and whether inspection is to be performed, processing the sequences, determining, according to a processing order sequence, whether a current surface of a loaded glass substrate corresponds to a processing surface, operating a flipper to invert the loaded glass substrate when it is determined not to correspond to the processing surface, delivering the glass substrate to equipment connected to the substrate transfer apparatus and performing a process according to the processing order sequence, determining whether a value of inspection in the processing order sequence corresponds to inspection, and when it is determined to correspond to inspection, inspecting the processing surface of the glass substrate and outputting an inspection result.

Abstract: The present invention relates to a substrate transfer robot and a substrate transfer method using the same, and the substrate transfer robot according to one aspect of the present invention includes a body, a robot arm formed with a plurality of joints and rotatably installed on the body to transfer a substrate, a first sensor installed on the robot arm to sense a front edge of the substrate to be supported by the robot arm, a second sensor installed on the robot arm to sense a side edge of the substrate supported by the robot arm, and a controller provided on the body and configured to control the operation of the robot arm based on a value sensed by the first sensor and a value sensed by the second sensor.

Abstract: The present invention relates to a substrate transfer apparatus and method, and the substrate transfer apparatus according to one aspect of the present invention includes a lower stage that supports a lower surface of a substrate and moves the substrate upward, and an upper stage that suctions an upper surface of the substrate moved upward by the lower stage and inverts the substrate.

Abstract: According to the embodiment, a panel comprises a glass core having a width or length of 10 cm or more, and an upper layer disposed on the glass core and having redistribution lines therein. A unit refers to a portion in which a semiconductor element is disposed within a die layout and is separated into an individual packaging substrate. A plurality of the units are disposed on the panel. A reinforcement structure is disposed on the upper layer, configured to surround at least a portion of the die layout. A first unit comprises a first die layout and a first reinforcement structure disposed on the first die layout. A second unit comprises a second die layout and a second reinforcement structure disposed on the second die layout. The second unit is disposed adjacent to one side of the first unit, and the first reinforcement structure and the second reinforcement structure are disposed separately from each other.