Abstract: The embodiments disclose a laser processing method for a glass substrate and a stage. The method comprises: a placement operation of disposing the glass substrate with a space above a stage on which a venting film is disposed; and a processing operation of irradiating a laser onto the glass substrate to form defects, thereby manufacturing the glass substrate in which the defects are formed. The stage, which is applied to laser processing, comprises: a stage main body; a support rim protruding from the stage main body; a stage cavity surrounded by the support rim and open at a top; and a pin permitted to move vertically; wherein the pin is disposed in the stage cavity in a number of one or two or more, and the stage main body has a metal surface.

Abstract: A method for manufacturing a core substrate included in a packaging substrate, comprises: operation A, preparing a glass core in which through-holes and a cavity are disposed; operation B, preparing an adhesive laminate in which an adhesive layer is disposed on a lower surface of the glass core; operation C, disposing a cavity element in the cavity of the adhesive laminate; operation D, preparing a fill-in laminate by disposing a dispensing material in a space between the cavity element and a wall surface of the cavity; operation E, preparing an adhesion-strengthening treatment layer by performing an adhesion-strengthening treatment on a surface of the fill-in laminate; operation F, preparing an insulating laminate by forming a first surface insulating layer on an upper surface of the glass core of the fill-in laminate; and operation G, preparing the core substrate by removing the adhesive layer and forming a second surface insulating layer.

Abstract: Embodiments relate to a glass core for packaging, a packaging substrate, and a method of manufacturing the glass core. A glass core for packaging comprises: plate glass having first and second surfaces facing each other; through-vias penetrating the plate glass in a thickness direction; and a cavity penetrating the first and second surfaces and allowing placement of a semiconductor element therein. The cavity provides a cavity space surrounded by a cavity inner wall, which is an inner wall surface connecting the first and second surfaces of the plate glass. A die block is disposed in the cavity space; the die block has a cavity die and a glass spacer vertically stacked. A distribution material is disposed between the cavity inner wall and the die block. The embodiments alleviate thickness mismatch when embedding a die in the cavity, improve workability and reliability.

Abstract: A method of manufacturing a packaging substrate according to the present disclosure manufactures a packaging substrate by including a preparation step of providing a base substrate including a core layer and an insulating layer disposed on the core layer and a plasma step of plasma-treating an upper surface of the insulating layer. In the plasma step, an inert gas is applied as a process gas, and a plasma process condition index (Ipp value) defined by the following Equation 1 is 80 seconds or greater. A developed interfacial area ratio (Sdr value) of the upper surface of the insulating layer after completion of the plasma step is 50% or less. [Equation 1] Ipp=Rsb*H In Equation 1, Rsb is a ratio of bias power to source power applied during the plasma step, and His a processing time of the plasma step. In such a case, a redistribution layer having a fine pitch on the core layer may be more precisely implemented.

Abstract: An embodiment relates to an automatic carrier slot scanning apparatus for glass substrate semiconductor packages for automation of a glass substrate semiconductor package factory, and more particularly, to an automatic carrier slot scanning apparatus for glass substrate semiconductor packages configured to automatically scan positions and the number of glass substrates for slots of a carrier, compare the scanned information with related information of a manufacturing execution system, and thereby achieve synchronization.

Abstract: A packaging substrate according to the present disclosure comprises a core layer and an insulating layer disposed on the core layer. The insulating layer comprises an insulating resin. The insulating layer comprises a first insulating layer and a second insulating layer disposed on the first insulating layer. A hydroxyl peak intensity of the second insulating layer measured by FT-IR is smaller than a hydroxyl peak intensity of the first insulating layer measured by FT-IR. A moisture absorption amount of the packaging substrate measured after being left to stand for 7 days under an atmosphere of 23° C. and 50% RH is 500 ppm to 1200 ppm. In such a case, a packaging substrate and the like capable of stably maintaining long-term durability and electrical reliability may be provided.

Abstract: A substrate according to the present disclosure comprises a glass core having an upper surface. A maximum height roughness (Rmax) value of the upper surface of the glass core is 3 nm to 7 nm. A surface energy of the upper surface of the glass core is 50 mN/m to 63 mN/m. In such a case, an insulating layer having improved peel resistance may be implemented on the glass core, and electrical reliability of the substrate may be further improved.

Abstract: A packaging substrate comprising a glass core, an upper redistribution layer, and a lower redistribution layer is provided. The glass core is a plate-shaped glass in which vias are arranged, the upper redistribution layer is disposed above the glass core, and the lower redistribution layer is disposed below the glass core. The redistribution layer comprises a wiring layer being a patterned copper layer having grains. C is an area ratio of grains having a major axis to minor axis ratio of 3:1 or greater in the wiring layer disposed in the upper redistribution layer, and D is an area ratio of grains having a major axis to minor axis ratio of 3:1 or greater in the wiring layer disposed in the lower redistribution layer. A value obtained by dividing C by D in the packaging substrate is 0.85 or more and 0.99 or less.

Abstract: An embodiment relates to a packaging substrate comprises: a glass core; a wiring layer; and an insulating layer, wherein the glass core is a plate-shaped glass in which vias are disposed, the wiring layer is an electrically conductive layer disposed on a surface of the glass core, the insulating layer is a layer disposed in a space between the electrically conductive layers and comprising a mixture of a polymer resin and an insulating filler, the packaging substrate has an upper surface on which a semiconductor element is mounted and a lower surface facing the upper surface, the insulating layer disposed on an upper portion of the glass core is an upper insulating layer, a cover layer is further disposed on the upper insulating layer, the insulating layer disposed on a lower portion of the glass core is a lower insulating layer, and a solder resist layer is further disposed on the lower insulating layer.

Abstract: According to the present disclosure, a substrate comprises a glass core. The glass core comprises a through via penetrating the glass core in a thickness direction. A diameter of the through via is 50 ?m to 100 ?m. A sum of a sulfur content (atomic %) and a nitrogen content (atomic %) of the glass core is 0.2 atomic % to 8 atomic %. In this case, it may be possible to provide a substrate that achieves more stable electrical connection through the glass core and exhibits stable durability and electrical reliability even under a high-humidity environment.

Abstract: A packaging substrate according to the embodiment comprises: a glass core; a wiring layer; and an insulating layer. A measurement point is a point on the surface of the packaging substrate, and ten different measurement points are disposed on the surface. The measurement points are spaced apart by at least 0.05 times the surface length. Er is a value of extreme surface reduced modulus (unit: GPa) measured at the measurement point using a nanoindentation method, Er_av is the average of the extreme surface reduced modulus values measured at the measurement points, and Er_stdev is the standard deviation thereof. The ratio of Er_stdev to Er_av may be 7% or less. The packaging substrate according to the embodiment can reduce overall stress by adjusting variations in the extreme surface modulus according to in-plane location within a certain range.

Abstract: The embodiment relates to a packaging substrate comprising: a glass wafer 20; a plurality of vias 25 disposed in the glass wafer 20; copper electrodes 40 disposed on the vias 25 or on the surface of the glass wafer 20; and an insulating layer 30 surrounding the vias 25 or the copper electrodes 40. The packaging substrate 100 comprises P and Zn as eluted impurities, and the content of the eluted impurities is based on an analysis value obtained by preparing an analytical solution through pretreatment at 200°C for 16 hours in a graphite block after adding 70 mol% nitric acid to the packaging substrate 100, and analyzing the solution using an ICP-MS device (Nexlon2000 model manufactured by PerkinElmer) in accordance with KS M 0025:2008 test method. The content of P (by weight) is 1,500 ppb or less, and the content of Zn (by weight) is 500 ppb or less.

Abstract: The present invention relates to a method of pre-adjusting a glass substrate for a glass substrate semiconductor package to significantly shorten manufacturing time and improve manufacturing efficiency includes selecting one material group from among a plurality of material groups, each of which has a plurality of glass substrates, collecting processing process information by a processing equipment for performing a processing process on the plurality of glass substrates belonging to the one material group according to identification codes, checking according to the processing process information, whether a transfer equipment associated with the processing equipment for performing a current processing process and a transfer equipment associated with the processing equipment for performing a next processing process are each provided with a flipper, and pre-adjusting each of the plurality of glass substrates by rotating the each of the plurality of plurality of glass substrates using the processing equipment for

Abstract: A method of manufacturing a packaging substrate according to the present disclosure comprises a preparation step of preparing a preliminary substrate including a glass core on which a device portion including a device is mounted; and an encapsulation layer forming step of manufacturing the packaging substrate by forming an encapsulation layer surrounding at least a portion of the device portion with an encapsulation layer-forming composition. The glass core comprises a cavity portion that is a space formed by being recessed on an upper surface side of the glass core. The device portion is disposed in the cavity portion. A viscosity of the encapsulation layer-forming composition at 25° C. is 12,000 cps to 38,000 cps. In this case, it is possible to suppress occurrence of voids in the encapsulation layer, and it is possible to suppress occurrence of defects such as the glass core and the encapsulation layer which may occur in the manufacturing process.

Abstract: According to an embodiment, a method for manufacturing a packaging substrate comprises: a preparation step to comprise a base substrate including a core layer, a first conductive layer disposed on the core layer, and an insulating layer disposed on the first conductive layer; and a desmear step to comprise desmearing the base substrate, thereby providing a packaging substrate. The insulating layer comprises a contact hole penetrating the insulating layer in a thickness direction. An upper surface of the first conductive layer comprises an exposed region exposed by the contact hole. In the desmear step, the base substrate is plasma-desmeared using a reactive gas comprising oxygen gas and a fluorine-based gas. In the desmear step, a ratio of a flow rate of the fluorine-based gas to a flow rate of the oxygen gas introduced into an atmosphere in which the base substrate is placed is 4.5 or more.

Abstract: An embodiment relates to a packaging substrate having an embedded bridge, and comprises: a glass core having a cavity and through-electrodes; a bridge disposed in the cavity; an integrated electrode disposed on one surface of the bridge and on one surface of the glass core; and an insulating material disposed between the glass core and the bridge and between the integrated electrode. The bridge comprises: a bridge core, which is a support; and a bridge electrode disposed inside the bridge core, electrically interconnecting at least two points on one face of the bridge, with both ends exposed to a surface of the bridge core. The integrated electrode is an electrically conductive layer electrically connected to at least one of the through-electrodes and the bridge electrode.

Abstract: A packaging substrate according to the present disclosure comprises a core layer; a first conductive layer, which is a conductive layer disposed in contact with an upper surface of the core layer; and an adhesion reinforcement layer disposed on the core layer and surrounding at least a portion of the first conductive layer. The adhesion reinforcement layer comprises any one selected from the group consisting of a silicon-based compound, an acrylic-based compound, and a combination thereof. An arithmetic average roughness (Ra) value of the upper surface of the first conductive layer is 150 nm or less. In this case, it is possible to effectively improve the adhesion strength of the insulating layer to the first conductive layer without excessively roughening the first conductive layer.

Abstract: According to the present disclosure, a packaging substrate includes a glass core and an adhesion reinforcement layer disposed on the glass core. The adhesion reinforcement layer includes a first adhesion reinforcement layer and a second adhesion reinforcement layer disposed on the first adhesion reinforcement layer. The first adhesion reinforcement layer includes a transition metal and silicon. The second adhesion reinforcement layer includes a transition metal. In such a case, it is possible to improve the bonding strength of the conductive layer with respect to the glass core, while effectively suppressing damage to the packaging substrate caused by the difference in thermal expansion properties between the glass core and the conductive layer.

Abstract: A method for manufacturing a packaging substrate includes a preparation step of preparing a base substrate comprising a core substrate and an insulating layer disposed on the core substrate, an etching step of selectively etching the insulating layer using an etching mask, and a manufacturing step of manufacturing the packaging substrate from the base substrate after the etching step. The etching mask is disposed on the insulating layer and includes a metal pattern film and a resist pattern film disposed on the metal pattern film.

Abstract: Disclosed is a substrate loading cassette including an upper frame, a lower frame disposed to face the upper frame, a support frame configured to connect the upper frame and the lower frame to each other at an edge side of the substrate loading cassette, a transfer device coupling unit disposed on the upper frame, the transfer device coupling unit being coupled to a transfer device configured to transfer the substrate loading cassette, wherein the transfer device coupling unit includes a transfer device coupling frame and a vibration damping portion disposed under the transfer device coupling frame, the support frame includes a first support frame disposed on each of left and right sides of the substrate loading cassette and a second support frame disposed on a rear side of the substrate loading cassette, and the substrate loading cassette includes a support bar connected to the second support frame.