Patents Assigned to Acaia Communications
  • Co-packaging photonic integrated circuits and application specific integrated circuits
    Patent number: 10578799
    Abstract: Disclosed herein are designs, structures and techniques for advanced packaging of multi-function photonic integrated circuits that allow such high-performance multi-function photonic integrated circuits to be co-packaged with a high-performance multi-function ASIC thereby significantly reducing strenuous interconnect challenges and lowering costs, power and size of the overall devices.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: March 3, 2020
    Assignee: Acaia Communications
    Inventors: Christopher Doerr, Eric Swanson, Diedrik Vermeulen, Saeid Azemati, Jon Stahl