Patents Assigned to ACATEL LUCENT CANADA, INC.
  • COOLING ASSEMBLY USING HEATSPREADER
    Publication number: 20150084182
    Abstract: Various embodiments relate to a microchip die cooling assembly comprising a circuit board; a microchip having an exposed die attached to the circuit board; a heatspreader having a top side and a bottom side; a heat sink having a bottom side and a top side comprising a cooling structure; a first thermal interface material in contact with the exposed die and the bottom side of the heatspreader; and a second thermal interface material in contact with the top side of the heat spreader and the bottom side of the heat sink.
    Type: Application
    Filed: September 26, 2013
    Publication date: March 26, 2015
    Applicant: ACATEL LUCENT CANADA, INC.
    Inventors: STEFANO F. DE CECCO, GREGORY W. CHESHIRE