Abstract: What is shown is a housing of a small coolant compressor comprising an evaporator shell, wherein the evaporator shell is formed at least by a metal wall (2) fastened directly to the housing (1) in sealing fashion, the wall following a perimeter line of the housing (1) and by at least one partial surface (1a) of the housing disposed inside the wall (2). At least one damping element (5) for damping the oscillations transferred from the housing (1) to the wall (2) is fastened to the wall (2) at a distance from the housing (1). In order to reduce noise emissions, one or more damping elements (5-10) encompass the free upper edge of the wall (2).

Abstract: Device for fastening the housing (2) of a refrigerant compressor on a container enclosing a cooling volume, wherein the housing (2) can be fastened by means of an arbitrary number of connection elements (3) on a carrier element (1) arranged on the container, wherein at least one connection element (3) is provided that can be fastened in a clamped or latched manner in at least one corresponding receptacle (4), wherein the at least one connection element (3) or the at least one receptacle (4) can be arranged selectively on the housing (2) or on the carrier element (1).

Abstract: Hermetically encapsulated refrigerant compressor (1), comprising a cylinder housing (3), which is used as the basis for manufacturing various refrigerant compressor construction series each having different working volumes and a piston (6) guided in a piston bore (8) of the cylinder housing (3) along a defined piston run surface (9).

Abstract: A device for fastening the housing (2) of a refrigerant compressor at a container enclosing a cooling volume, wherein the housing (2) can be fastened to a support element (1) located at the container by way of an arbitrary number of connecting elements (3), wherein at least one connecting element (3) is provided that can be fixed in clamped or latched fashion in at least one corresponding receptacle (4), wherein the at least one connection element (3) and the at least one receptacle (4) can be located either at the housing (2) or at the support element (1). In order to facilitate a simple, fast and nevertheless reliable fastening of the refrigerant compressor at the support element (1), it is provided according to the invention that the housing (2) can be moved from a first mounting position in which the at least one connection element (3) is laid into the at least one receptacle (4) to an operating position in which the connection element (3) is fixed in the receptacle (4) in clamped or latched fashion.

Abstract: A coolant compressor (1), comprising a piston-cylinder unit (2) that compresses a coolant, said piston-cylinder unit comprising a cylinder housing (4) and a piston (3) held in a piston bore (5) of the cylinder housing (4), wherein the cylinder housing (4) is sealed in an axial direction by a valve plate (6) and a cylinder cover (7). In order to facilitate the simple and flexible mounting of the valve plate (6) at the cylinder housing (4), it is provided according to the invention that the valve plate (6) is countersunk in its operating position in the piston bore (5) of the cylinder housing (4) and is fastened at the cylinder housing (4) or in the piston bore (5) by way of a material bond connection.

Abstract: Refrigerant compressor for a hermetically encapsulated small refrigerator, which has a piston (20) guided in a piston bore (3) of a cylinder housing (1), the cylinder housing being frontally terminated using a valve plate (7) having a pressure opening (17) and a suction opening (16) and also being frontally provided with holes (5), which each have a thread.

Abstract: A refrigerant compressor has a hermetically tight compressor housing inside of which a piston-cylinder unit operates. A suction muffler through which refrigerant flows to the intake valve of the piston-cylinder unit is provided on the cylinder head. The inlet of the suction muffler has a cross section via which refrigerant flows into the suction muffler. A compensating volume is provided inside of which refrigerant oscillates and which is connected to the suction muffler and the interior of the compressor housing. The cross section of the inlet also acts as the connecting port between the compensating volume and the filling volume. The compensating volume is formed by an outer tube directed into the compressor housing, which tightly surrounds the intake port of the inlet while surrounding the section of the refrigerant suction pipe that is connected to the evaporator of the compressor and extends into the interior of the compressor housing.

Abstract: The invention pertains to a method of inertising free soluble impurities of phosphates and/or fluoride ions, in phosphogypsum, for use in commercial and industrial applications. The Phosphogypsum is pre-conditioned over an extended period of time separately or treated along with standard constituents by spraying, interblending or intergrinding during the process of manufacture, with alkyl, alkenyl and/or alkanol derivatives of ammonia, either individually or in combination with one another, to form stable intermediary phosphates and/or fluoride salts of the derivatives of ammonia.

Abstract: A hermetically encapsulated refrigerant compressor having a hermetically sealed compressor housing, in whose interior a piston-cylinder unit operates, whose cylinder housing (1) is closed using a valve plate (2) having a pressure hole (10) and a suction hole (16), and a suction channel and a pressure channel are provided. Preferably V-shaped sealing beads (23) or sealing projections (22) are provided in the valve plate (2) and the front face of the component (9) forming the suction channel is equipped along its suction contact edge (17) with sealing projections (22) or sealing beads (23) essentially corresponding to the V-shaped sealing beads (23) or sealing projections (22), the sealing projections (22) being implemented differently from the sealing beads (23) in their geometrical design and/or having a different volume.

Abstract: A hermetically encapsulated refrigerant compressor which has a hermetically sealed compressor housing (1), in the interior of which operates a refrigerant-compressing piston-cylinder unit, and is provided with a suction duct (2), via which refrigerant is conveyed into the compressor housing (1), and is provided with a pressure duct (3), via which refrigerant is conveyed out of the compressor housing (1) by the piston-cylinder unit. In order to prevent contact of oil (4) flowing down the compressor housing wall with the suction duct (2) or the pressure duct (3), it is provided in accordance with the invention that in the operating position of the compressor housing (1) deflection means (5, 6) are provided on the same above the passage of the suction duct (2) or pressure duct (3) through the compressor housing wall. The heating of the refrigerant is thus prevented and the efficiency of the refrigerant compressor is increased.

Abstract: The aim of the invention is to create a receptacle (4) which is used for evaporating condensed liquid on a small coolant compressor, allows the heat generated by the small coolant compressor to be utilized in an optimal way, and is easy and inexpensive to produce and mount on the compressor housing. The aim is achieved by embodying the receptacle (4) as a plastic part that is deep-drawn in a receiving device (6) directly on the compressor housing. The plastic part perfectly matches the shape of the receiving device (6) such that the air gap that is usually formed between the compressor housing and the receptacle (4) can be eliminated altogether or reduced to a minimum. A holding element (2) that is arranged on the outer circumference of the cover part (1) ensures optimum support for the receptacle (4), thus dispensing with the need for expensive anti-corrosive measures while the evaporator power and the coefficient of performance (COP) of the small coolant compressor are optimized.

Abstract: The invention relates to a compressor for hermetically sealed small refrigeration machines, comprising a cylinder with a cylinder housing and a piston that is guided in the piston bore of the cylinder and that compresses a working medium. The cylinder is sealed by a disc-type valve plate in the axial direction, a cylinder cover lying against or being surrounded by the plate. According to the invention, the cylinder housing comprises axial extensions facing towards the cylinder cover and located in the peripheral area of the cover. A first axial section of the axial extensions lies against the cylinder cover in the contact region between the cylinder cover and the valve plate and a second axial section surrounds the cylinder cover with a small degree of play.

Abstract: A method is provided for inducing the adaptive immune response of a patient to an antigen comprising administering to the patient an effective amount of a flagellin protein or peptide fragment thereof to induce an adaptive immune response to said antigen.

Abstract: A chip package includes a circuit board having a first surface with an inner die-attach region, an outer signal trace region and an intermediate utility region. Within the utility region are a number of traces for providing fixed electrical potentials to an integrated circuit die mounted within the die-attach region. In the preferred embodiment, the utility region includes a ring-like ground trace, a V.sub.DD trace and a segmented outer trace, with the segments of the segmented trace being connected to at least two fixed voltages for operating the integrated circuit die. Bond wires or leads of a leadframe include inner wire/lead ends connected to input/output pads of the die and include outer wire/lead ends connected to either a trace or trace segment in the utility region or a signal trace located in the outer signal trace region. The resulting chip package may be of the ball grid array type.

Abstract: An automatic glove stripping machine is disclosed comprising a drive unit that distributes power to one or more stripping assemblies, each comprising a conveyor unit, a plurality of dipping molds, a pressurized air distribution system, a brush set, a plurality of grip assemblies, and a cam assembly. Each grip assembly is moved into engagement with a set of dipping molds retaining dip molded articles such as latex gloves. As each grip assembly and corresponding set of dipping molds travel over the stripping assembly, the molded articles on the dipping molds are partially removed by action of the grip assembly and a stream of pressurized air directed at each mold. As the set of dipping molds reaches the end of the stripping assembly, the molded articles are completely removed from their dipping molds by the brush set.

Abstract: A tufting machine comprising a drive shaft, an eccentric rotatable by the drive shaft, a connecting member (6) mounted at its proximal end for rotation about the eccentric (4) and coupled at its distal end to pushing means (26) for pivotal movement in relation thereto, a needle mounting means associated, for reciprocating movement, with the said pushing means (26) which impart the reciprocation to the needle mounting means under the impulse of the connecting member (6). The connecting member comprises at least two parts, a distal part (22) for engaging the pushing means and an adjustable proximal part (24) for engaging the said eccentric, the adjustment being possible by varying the position of the proximal part with respect to at least a part of the said eccentric (4). The variation may be provided by a split eccentric with inward facing grooves (10, 12) on the two parts to vary the relative position and thus the focus of the eccentric may be varied without providing a replacement eccentric.

Abstract: The present invention relates to a substrate for ball-grid arrays. Bond sites are arranged around a die-attach region of the substrate. Signal traces connect the bond sites to vias disposed on the substrate, thus providing an electrical path between both sides of the substrate. Solder balls (solder bumps) are disposed on the other side of the substrate and arranged in a grid-like pattern. The generally linearly-arranged bond sites are sequentially numbered, as is the grid-like arrangement of solder balls. In a preferred embodiment, the bond sites are used only for carrying signals to and from the semiconductor die. In addition, only the solder bumps used for carrying signals are sequentially numbered. In another embodiment of the invention, some of the bond sites may be used for utilities such as ground and power. Such utility bond sites are not numbered. Likewise, utility solder balls are not numbered. The signal bond sites are coupled to vias by signal traces.

Abstract: A semiconductor die attach arrangement which provides an increase in signal availability to and from the die without compromising the physical integrity of signal traces and integrity of the conducted signal. In a preferred embodiment, a circuit board includes a die-attach region surrounded by a boundary line that is spaced apart from the die-attach region, thereby defining an intermediate region which surrounds the die-attach region. Bond sites are arranged along the boundary line. In one embodiment, the bond sites are first trace ends of a plurality of signal traces, some of the signal traces extending in an outward direction away from the die-attach region into a signal trace region, and some of the signal traces being directed within the intermediate region. Signal vias are formed in both the signal trace region and the intermediate region, and are electrically coupled to the signal traces at second trace ends of the signal traces.

Abstract: A multi-voltage circuit on a semiconductor chip including core circuitry driven by a power supply voltage equal to the voltage of a selected external device operating in connection with the semiconductor chip, and having input/output circuitry in selected regions for operating in connection with external devices having the same operating voltage and other external devices having a selected substantially lower operating voltage. Peripheral input/output circuit regions of at least first and second kinds are established for interfacing with the respective high and low voltage external devices. According to one version of the invention, the input/output circuitry directed toward interfacing with external devices operating at a particular voltage level is concentrated at a particular peripheral region in the periphery of the semiconductor chip. According to another version of the invention, multiple regions of input/output circuitry are established for external devices at the same voltage level.