Abstract: A cleaning apparatus (10) is disclosed for cleaning electronic components within JEDEC or Auer containers (59). The containers with electronic components and assemblies therein are conveyed through the apparatus by a conveyor assembly (18). A manifold assembly (16) defining precision planar surfaces (60) establishes a predetermined separation, preferably 0.020 inches, between the manifolds and the tops (57) of the containers (59) to prevent the electronic components and assemblies from being lifted out of the containers under the influence of the washing and rinsing operation The manifolds have apertures formed therethrough for spraying the washing and rinsing fluids and drying gases onto the electronic components and assemblies.