Abstract: The application relates to a heat exchanger apparatus comprising: a channel for fluid flow extending between an inlet and an outlet; a porous layer dividing a first portion of the channel from a second portion of the channel, wherein the porous layer comprises a plurality of pores configured to enable fluid to be transferred from the first portion of the channel to the second portion of the channel; a plurality of evaporator structures located within the second portion of the channel wherein the evaporator structures comprise a wicking layer configured to enable evaporation of fluid from the surface of the evaporator structures; an ejector section configured to combine fluid from the first portion of the channel with fluid from the second portion of the channel and provide the combined fluid to the outlet.

Abstract: A cooling apparatus includes thermosyphon loops for cooling multiple electronic devices. Each of the thermosyphon loops includes at least one evaporator and at least one condenser. Sensors within the thermosyphon loop measure can measure various parameters such as vapour quality within an inlet and outlet of at least one of the evaporators, total heat load of at least one of the evaporators; and the liquid level in a downcomer of the thermosyphon loop.

Abstract: A device and method are provided for more efficient thermal management of optoelectronic devices. A microfluidic distribution apparatus embedded with the optoelectronic device uses a working fluid in phase change to passively remove heat from an optoelectronic device. The working fluid undergoes phase change through various conversions between a liquid state and a two-phase liquid-vapor state to facilitate evaporation and condensation processes as the working fluid is distributed through micro-structures in the embedded microfluidic distribution apparatus. Passive two-phase cooling provides high thermal performance due to the use of the latent heat of a fluid in phase change, as well as the presence of favorable two-phase flow regimes at micro-scale dimensions.