Abstract: A process and assembly of a silicon-on-insulator substrate or handle incorporates a low initial viscosity epoxy adhesive having a high cross-linking density. The assembly is formed by distributing the epoxy adhesive at the interstice between a silicon wafer and the handle and heating the assembly so that the epoxy adhesive wicks by capillary action between the silicon wafer and the handle. The heating causes the epoxy adhesive to cross-link so that a strong adhesion is effectuated between the silicon and handle. The simply controllable process affords a high yield at relatively low cost.