Abstract: Before technical components are further processed, they are checked for the functionality thereof. In this case, an incorrect judgment of the functionality can occur due to measurement errors or incorrect measurements, which in turn results in a very inefficient test. The invention provides a method and a device by which an increased measurement accuracy can be achieved. This is achieved in that at least one first electrical voltage value is measured at a first constant measurement current and at least one second electrical voltage value is measured at a second constant measurement current at terminals of the component. Every measured voltage value is scaled respectively using a profile factor PF to form a measured value M, and only measured values M that are located at least with a tolerance range in a common value range are used for the determination of an electrical parameter.

Abstract: A method for testing printed circuit boards (20) in a test apparatus having a carrying apparatus for the printed circuit board (20) and having test modules for measuring physical variables of components (EB) and contact points (29) on the printed circuit board (20), in which the width of the printed circuit board (20) defines an X direction, its length defines a Y direction and its thickness defines a Z direction inside the test apparatus, reference points, the X, Y and Z positions of which relative to the carrying apparatus are known, are present on the printed circuit board (20) or outside the latter, the X and Y positions of the components (EB) and contact points (29) relative to the reference points are known, the measurement of the physical variables depends on an actual Z position of the printed circuit board at the X and Y positions of the component (EB) or contact point (29) to be measured, and the actual Z position of the printed circuit board at the X and Y positions of the component (EB) or cont

Abstract: For testing the connections (13) of batteries (8) that are connected in a battery module (5) to several bus bars (6, 7) that are electrically in parallel with their battery electrodes (10, 11) by a resistance measurer (16) comprising a pair of contact pins (17, 18), during a measurement a first batten’ electrode (10) is contacted by a first contact pin (17) and a point on the conductor arrangement (13, 6, 13, 10) connected to the first battery electrode (10) is contacted by the second contact pin.

Abstract: For testing the connections (13) of batteries (8) that are connected in a battery module (5) to several bus bars (6, 7) that are electrically in parallel with their battery electrodes (10, 11) by a resistance measurer (16) comprising a pair of contact pins (17, 18), during a measurement a first batten? electrode (10) is contacted by a first contact pin (17) and a point on the conductor arrangement (13, 6, 13, 10) connected to the first battery electrode (10) is contacted by the second contact pin.

Abstract: An apparatus for thermal testing of a printed circuit board being electrically energized and being unpopulated or populated with electrical or electronic components is disclosed. The apparatus includes a device for pyrometrical scanning of surface temperatures, wherein the scanning device comprises a pyrometric sensor being movable for the purpose of scanning and being adjustable with respect to its distance from the printed circuit board. A method for operating such an apparatus is disclosed. The method includes adjusting the distance between the sensor and the printed circuit board during scanning.

Abstract: An apparatus for thermal testing of a printed circuit board being electrically energized and being unpopulated or populated with electrical or electronic components is disclosed. The apparatus includes a device for pyrometrical scanning of surface temperatures, wherein the scanning device comprises a pyrometric sensor being movable for the purpose of scanning and being adjustable with respect to its distance from the printed circuit board. A method for operating such an apparatus is disclosed. The method includes adjusting the distance between the sensor and the printed circuit board during scanning.