Patents Assigned to Ace Inc.
  • Gasket
    Patent number: 6769697
    Abstract: There is provided a gasket comprising a sealing portion and a deformation stopper portion. When the gasket is placed between adjacent surfaces to be sealed of two objects, the sealing portion is engaged by the adjacent surfaces. The deformation stopper portion is engaged by the adjacent surfaces of the objects when the sealing portion has been deformed by a predetermined amount by the adjacent surfaces, thereby preventing excessive deformation of the sealing portion.
    Type: Grant
    Filed: September 8, 2000
    Date of Patent: August 3, 2004
    Assignees: Ace Inc., Motoyama Eng. Works, Ltd., TFC Corporation, Isono Mfg. Inc.
    Inventors: Koichi Ishikawa, Osamu Uchisawa, Toshikatsu Meguro, Hideo Tsukazaki, Tatsuhito Tanaka
  • Polishing pad
    Patent number: 6561890
    Abstract: A polishing pad for use in chemical mechanical polishing is formed of silicone rubber. An abrasive fine inorganic powder and a reinforcing fine silica powder are dispersed in the silicone rubber, and the inorganic powder has a particle size of 0.01-100 &mgr;m and is contained in the amount of 10-85 wt.% of the silicone rubber.
    Type: Grant
    Filed: July 2, 2001
    Date of Patent: May 13, 2003
    Assignees: Ace Inc., Roki Techno Co., Ltd.
    Inventor: Shigeru Tominaga