Abstract: An electrode bonding structure is disclosed for reducing the thermal expansion of a circuit board during the bonding process of the circuit board and a substrate of a flat display. The electrode bonding structure includes a substrate, a circuit board, and an anisotropic conductive film ACF. A substrate dielectric layer and an indenting pad are formed on the surface of the substrate, and the inner surface of the indenting pad is lower than the surface of the substrate dielectric layer by an indenting depth H3. The circuit board is placed parallel to the substrate, and a circuit dielectric layer and a bump pad are formed on the surface of the circuit board. The bump pad is higher than the surface of the circuit dielectric layer by a height H1. The ACF is placed between the substrate and the circuit board, and the thickness of the ACF is a thickness H2.