Abstract: A method and apparatus for scanning and acquiring 3D profile line data of an object, illustratively for use in an optical inspection system. A 3D scanning subsystem is provided in relative movement to the object being scanned. The subsystem is capable of simultaneously scanning different regions of the object with different exposure lengths.
Abstract: The present invention relates to optical inspection of manufactured products, such as integrated circuits wafer bumps. There are provided methods and apparatus for acquisition of optical inspection data of said object, as well as for optical inspection and manufacturing of said object. The invention comprises a 2D optical scanning system and a 3D optical scanning system that can have common image trigger control and/or operate simultaneously without interference to have the same field of view.
Abstract: The invention relates to optical inspection of integrated circuit devices, such as QFP and TSOP devices. There are provided methods of inspecting objects, such as integrated circuit devices, using a single laser triangulation system oriented in a fixed direction, where the given inspection system rotates the inspection tray for scanning the objects placed therein in different directions.
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