Abstract: Systems and methods for thermal management using matrix coldplates are disclosed. One illustrative method may comprise directing a flow of coolant through a coldplate comprising a plurality of parallel passages by selectively connecting portions of the parallel passages to one another to create one or more regions of parallel flow, serial flow, or blocked flow in the coldplate. Selectively connecting portions of the parallel passages may comprise machining a plurality of transverse passages into the cold plate such that each of the transverse passages intersects at least some of the parallel passages. Valves may be installed to interact between the parallel and transverse passages to create and modify the different flow regions.

Abstract: A multi-phase modular power delivery system, comprising a master module integrated with a main circuit board. A controller installed on the master module, the controller configured to receive an input voltage from the main circuit board and provide a variety of voltage levels to the master module for internal power and internal operation based on the received input voltage, provide power to a first load connected to the main circuit board using a first smart power stage installed on the master module, and provide power to a second load connected to the main circuit board using a second smart power stage, wherein the second smart power stage is installed on a satellite module.

Abstract: A modular edge power system is provided. The modular edge power system includes a housing and multiple edge modules. Each edge module is adapted to be removably inserted into the housing and provide, through a corresponding bus and with one or more power equipment submodules, power to one or more compute devices in a rack. Each bus is adapted to provide sufficient power to enable operation of every compute device in the rack.

Abstract: Illustrative embodiments of hybrid transformers, power supplies, and methods relating to the same are disclosed. In at least one embodiment, a hybrid transformer includes first and second wire coils arranged on opposing surfaces of a printed circuit board (PCB), a core extending through the PCB, wherein the first and second coils are each wound around the core, and at least one header electrically coupling one of the first and second wire coils to the PCB.

Abstract: According to an aspect of this disclosure, a circuit includes a voltage source and an output load, first and second resonant modules disposed between the voltage source and the output load, and first and second transformers. The circuit is further arranged such that the first transformer is disposed between the first resonant module and the output load, and the second transformer is disposed between the second resonant module and the output load. The circuit also includes a plurality of half-bridges coupled between the first and second resonant modules and the voltage source. The circuit further includes a voltage divider disposed between the voltage source and the plurality of half-bridges.

Abstract: A system including a point of load converter module (POL). The POL module includes a point of load printed circuit board. At least one inductor is mounted to the point of load printed circuit board. The POL module includes a power network. The point of load converter module is configured to be surface mounted. The system includes a heat sink including a first leg configured to be surface mounted adjacent the point of load printed circuit board, a second leg configured to be surface mounted adjacent the point of load printed circuit board opposite the first leg, and a cap portion connecting the first leg to the second leg. The heat sink is sized and shaped to encompass the POL and configured to connect to the power network. The power network may be a PGND network.

Abstract: A device for load line regulation of a sigma convert is provided. The device comprises a sigma converter comprising an inductor inductor capacitor (LLC) circuit and a buck converter. The device also comprises control circuitry for the sigma converter. The control circuitry is configured to receive a plurality of electrical measurements associated with the sigma converter; determine, based on the plurality of electrical measurements, an adjusted electrical characteristic for load line regulation of the sigma converter; and provide, based on the adjusted electrical characteristic, gating signals to the buck converter to perform the load line regulation of the sigma converter.

Abstract: Devices and methods for DC-to-DC conversion. The device includes a first transformer having a first winding at a primary side and a second winding at a secondary side. The device also includes a second transformer having a third winding at a primary side and a fourth winding at a secondary side. The device includes a controller configured to control a first current in the first winding of the first transformer and a second current in the third winding of the second transformer to flow in a first pattern, and to control the first current and the second current to flow in a second pattern.

Abstract: An apparatus for encapsulating at least one electronic component disposed on a printed circuit board may include a liquid-tight enclosure that surrounds the electronic component and that is fixed with respect to the electronic component and the circuit board, and an encapsulating material disposed inside the enclosure and encapsulating the electronic component. The enclosure may include at least one sidewall and a top. The at least one sidewall may include a rigid material, a lower edge that is proximal to the printed circuit board, an upper edge that is distal from the circuit board, and a height above the circuit board that is no more than 0.003 inches greater than a height of the electronic component above the circuit board. The top may include a solid surface disposed on the upper edge of the at least one sidewall, where the at least one sidewall and the top form the enclosure.

Abstract: In one aspect, a PCB is provided. The PCB includes at least one insulating layer, a blind slot, and at least one via. The at least on insulating layer includes a first surface and a second surface opposite the first surface. The blind slot is plated and formed in the at least one insulating layer, where the blind slot partially extends from the first surface to the second surface, and where the blind slot includes a conductive plating bonded along a major surface of the blind slot. The at least one via is electrically conductive and filled, where the at least one via is coupled with and extends between the conductive plating of the blind slot and the second surface of the at least one insulating layer.