Abstract: In one embodiment, a switching frequency adjusting circuit includes an inverter circuit, a phase difference determining circuit, an average determination circuit, and a loop compensator. The inverter circuit includes an inverter switch configured to switch on and off at a switching frequency. The phase difference determination circuit is configured to obtain a first signal related to an output voltage of the inverter circuit and a second signal related to an output current of the inverter circuit. The average determination circuit is configured to determine a first average value of a first output signal and a second average value of a second output signal, and the loop compensator is configured to compare the first average value or the second average value with a reference value and adjust the switching frequency of the inverter switch based on the comparison result.

Abstract: In one aspect, a bidirectional bridgeless power factor correction (PFC) circuit includes a main circuit, a current detection circuit, and a controller. The main circuit includes an input inductor and is configured to receive an alternating current (AC) voltage from an AC power supply at a first terminal of the input inductor and convert the AC voltage to a direct current (DC) voltage, where a direction of a current flowing through the input inductor during a positive half of the AC voltage is different from a direction of the current flowing through the input inductor during a negative half of the AC voltage. The current detection circuit is configured to generate a detection signal indicating an amount of the current flowing through the input inductor only during a discharge phase of the input inductor. The controller is configured to generate a zero-crossing signal based on the detection signal.

Abstract: A fault-managed power delivery system for delivery power across a distance is provided. The system includes a transmitter-side subsystem and a receiver-side subsystem. The system further includes a fault management circuitry that includes a reference resistor having a known resistance and a controller. The controller is configured to electrically connect the reference resistor between a line conductor of a line and a neutral conductor and disconnect the output power to the load during a fault-detection portion of a duty cycle of power delivered to the receiver-side subsystem. The controller is further configured to determine an impedance of the power delivery system during the fault-detection portion, determine a fault condition based on the impedance, and disconnect the line if the fault condition is detected. The fault management circuitry is positioned in the transmitter-side subsystem and/or the receiver-side subsystem.

Abstract: A fault-managed power delivery system for delivering power across a distance with fault management is provided. The system includes a fault management circuitry including a reference resistor having a known resistance, a reference resistor switch, line switches configured to electrically connect or disconnect line conductors, and a controller. The reference resistor switch is configured to electrically connect or disconnect the reference resistor, wherein a duty cycle of switching of the reference resistor switch includes a fault detection portion. The controller is configured to control switching of the reference resistor switch and the line switches. The controller is further configured to determine an impedance of the power delivery system during the fault detection portion, determine a fault condition based on the impedance, and disconnect a line if the fault condition is detected. The fault management circuitry is positioned in the transmitter-side subsystem and/or the receiver-side subsystem.

Abstract: Embodiments of the present disclosure relate to a circuit for limiting duty cycle for a DC switching power supply. The circuit includes: a timing module and a switch control module. The timing module is configured to cause the variable output voltage to increase to a voltage threshold within a time shorter than a duration time of the first level of the period. The switch control module is configured to: in a period having the duty cycle greater than the maximum limit duty cycle, output a signal enabling the switch to be turned on before the variable output voltage increases to the voltage threshold, and output a signal enabling the switch to be turned off independently of the pulse signal after the variable output voltage increases to the voltage threshold. The circuit enables the duty cycle of the switch not to be excessively large during the transition phase.

Abstract: In one aspect, a method operable by a controller of a power converter module is provided. The method comprises identifying thermal test data for the power converter module, where the thermal test data maps one or more operating conditions of the power converter module to temperature triggers associated with a monitored device of the power converter module. The method further comprises measuring, utilizing a temperature sensor disposed external to and away from the monitored device, a temperature, and identifying the one or more operating conditions of the power converter module. The method further comprises identifying, from the thermal test data utilizing the one or more operating conditions, a temperature trigger for the monitored device, determining whether the temperature is greater than or equal to the temperature trigger, and performing a responsive action in response to determining that the temperature is greater than or equal to the temperature trigger.

Abstract: Systems and methods for thermal management using matrix coldplates are disclosed. One illustrative method may comprise directing a flow of coolant through a coldplate comprising a plurality of parallel passages by selectively connecting portions of the parallel passages to one another to create one or more regions of parallel flow, serial flow, or blocked flow in the coldplate. Selectively connecting portions of the parallel passages may comprise machining a plurality of transverse passages into the cold plate such that each of the transverse passages intersects at least some of the parallel passages. Valves may be installed to interact between the parallel and transverse passages to create and modify the different flow regions.

Abstract: A multi-phase modular power delivery system, comprising a master module integrated with a main circuit board. A controller installed on the master module, the controller configured to receive an input voltage from the main circuit board and provide a variety of voltage levels to the master module for internal power and internal operation based on the received input voltage, provide power to a first load connected to the main circuit board using a first smart power stage installed on the master module, and provide power to a second load connected to the main circuit board using a second smart power stage, wherein the second smart power stage is installed on a satellite module.

Abstract: A modular edge power system is provided. The modular edge power system includes a housing and multiple edge modules. Each edge module is adapted to be removably inserted into the housing and provide, through a corresponding bus and with one or more power equipment submodules, power to one or more compute devices in a rack. Each bus is adapted to provide sufficient power to enable operation of every compute device in the rack.

Abstract: Illustrative embodiments of hybrid transformers, power supplies, and methods relating to the same are disclosed. In at least one embodiment, a hybrid transformer includes first and second wire coils arranged on opposing surfaces of a printed circuit board (PCB), a core extending through the PCB, wherein the first and second coils are each wound around the core, and at least one header electrically coupling one of the first and second wire coils to the PCB.

Abstract: According to an aspect of this disclosure, a circuit includes a voltage source and an output load, first and second resonant modules disposed between the voltage source and the output load, and first and second transformers. The circuit is further arranged such that the first transformer is disposed between the first resonant module and the output load, and the second transformer is disposed between the second resonant module and the output load. The circuit also includes a plurality of half-bridges coupled between the first and second resonant modules and the voltage source. The circuit further includes a voltage divider disposed between the voltage source and the plurality of half-bridges.

Abstract: A system including a point of load converter module (POL). The POL module includes a point of load printed circuit board. At least one inductor is mounted to the point of load printed circuit board. The POL module includes a power network. The point of load converter module is configured to be surface mounted. The system includes a heat sink including a first leg configured to be surface mounted adjacent the point of load printed circuit board, a second leg configured to be surface mounted adjacent the point of load printed circuit board opposite the first leg, and a cap portion connecting the first leg to the second leg. The heat sink is sized and shaped to encompass the POL and configured to connect to the power network. The power network may be a PGND network.

Abstract: A device for load line regulation of a sigma convert is provided. The device comprises a sigma converter comprising an inductor inductor capacitor (LLC) circuit and a buck converter. The device also comprises control circuitry for the sigma converter. The control circuitry is configured to receive a plurality of electrical measurements associated with the sigma converter; determine, based on the plurality of electrical measurements, an adjusted electrical characteristic for load line regulation of the sigma converter; and provide, based on the adjusted electrical characteristic, gating signals to the buck converter to perform the load line regulation of the sigma converter.

Abstract: Devices and methods for DC-to-DC conversion. The device includes a first transformer having a first winding at a primary side and a second winding at a secondary side. The device also includes a second transformer having a third winding at a primary side and a fourth winding at a secondary side. The device includes a controller configured to control a first current in the first winding of the first transformer and a second current in the third winding of the second transformer to flow in a first pattern, and to control the first current and the second current to flow in a second pattern.

Abstract: An apparatus for encapsulating at least one electronic component disposed on a printed circuit board may include a liquid-tight enclosure that surrounds the electronic component and that is fixed with respect to the electronic component and the circuit board, and an encapsulating material disposed inside the enclosure and encapsulating the electronic component. The enclosure may include at least one sidewall and a top. The at least one sidewall may include a rigid material, a lower edge that is proximal to the printed circuit board, an upper edge that is distal from the circuit board, and a height above the circuit board that is no more than 0.003 inches greater than a height of the electronic component above the circuit board. The top may include a solid surface disposed on the upper edge of the at least one sidewall, where the at least one sidewall and the top form the enclosure.

Abstract: In one aspect, a PCB is provided. The PCB includes at least one insulating layer, a blind slot, and at least one via. The at least on insulating layer includes a first surface and a second surface opposite the first surface. The blind slot is plated and formed in the at least one insulating layer, where the blind slot partially extends from the first surface to the second surface, and where the blind slot includes a conductive plating bonded along a major surface of the blind slot. The at least one via is electrically conductive and filled, where the at least one via is coupled with and extends between the conductive plating of the blind slot and the second surface of the at least one insulating layer.