Abstract: A vapor chamber includes an upper casing, a lower casing, a support member, a wick material and a working fluid. The support member is formed of a plurality of ribs connected with each other, and a plurality of surrounded spaces are formed and regularly arranged between the ribs. Each rib has an upper abutting end and a lower abutting end. By the interconnection of the upper abutting ends and the lower abutting ends of the ribs, the ribs are inclined and each has a relatively higher end and a relatively lower end, so that a plurality of subspaces are respectively formed under the body of each rib close to the upper abutting end and above the body of each rib close to the lower abutting end, and the subspaces are in communication with the surrounded spaces between the ribs.

Abstract: A LED lamp having a good heat-dissipating function includes a thermal radiator of solid metal including a top surface downwardly sloping from a peak point thereof to the border, a plurality of granular bumps raised from the top surface and defining a plurality of flow paths thereamong, a recess curved inwardly from a bottom surface thereof, an eave surrounding the recess and an inner slope located at the inner side of the eave and obliquely upwardly extended from the lowest edge of the eave to the recess, a vapor chamber bonded with the top surface thereof to the bottom surface of the recess, a circuit module bonded with the top surface thereof to the bottom surface of the vapor chamber, and a LED unit mounted at the bottom surface of the circuit module.

Abstract: A LED lamp having a good heat-dissipating function includes a thermal radiator of solid metal including a top surface downwardly sloping from a peak point thereof to the border, a plurality of granular bumps raised from the top surface and defining a plurality of flow paths thereamong, a recess curved inwardly from a bottom surface thereof, an eave surrounding the recess and an inner slope located at the inner side of the eave and obliquely upwardly extended from the lowest edge of the eave to the recess, a vapor chamber bonded with the top surface thereof to the bottom surface of the recess, a circuit module bonded with the top surface thereof to the bottom surface of the vapor chamber, and a LED unit mounted at the bottom surface of the circuit module.

Abstract: A method of manufacturing a heat-dissipating device without injection tube and an object manufactured by the method. The method includes the steps of: a) providing an upper casing and a lower casing, wherein a receiving space is defined between the upper casing and the lower casing; b) positioning a capillary and a brace in the receiving space, welding the upper casing and the lower casing in a manner to seal a seam therebetween hermetically, and reserving a crevice; c) sintering; d) injecting a liquid working medium from the crevice into the receiving space; and e) putting the combination of the upper casing and the lower casing into which the liquid working medium has been injected in step d) in a vacuum environment and welding the crevice quickly to seal the crevice hermetically. An exposed heat-dissipating device without injection tube effective in dissipating heat is manufactured by the method.