Abstract: A cooling system for cooling a processor installed within a computer case, the active cooling system comprising: (i) a TEC/heat-sink assembly comprising a thermoelectric cooling module (TEC) having a cold plate and a hot plate, the cold plate being coupleable to a processor, for removing heat from the processor, and the hot plate being coupled to a heat sink; (ii) a control microprocessor controllingly coupled to a power inverter, said power inverter for provision of high efficiency cooling to the processor by application of an appropriate voltage to the TEC; the control microprocessor being further coupled to (iii) a temperature sensor located on the cold plate of the TEC, for providing information to the microprocessor regarding temperature of the TEC; said cooling system being powered by a standard PC power supply having sufficient power to accommodate power demands of both the PC and the cooling system.