Patents Assigned to Actronics Kabushiki Kaisha
  • Patent number: 6026890
    Abstract: A heat exchanger utilizes a multi-hole flexible band of light metal which is formed, by extrusion, with a plurality of longitudinal small holes extending in parallel to one another from one band end to the other end. The longitudinal holes are connected at each of the end portions of the band, and both ends of the band is closed by welding to form a sealed cavity partly filled with a working fluid in partial vacuum. The sealed cavity may be in the form of a single long continuous passage, or in the form of parallel passages connected together at both ends. The multi-hole band is bent in such a shape that the band meanders between a high temperature region and a low temperature region. The thus-constructed heat exchanger is advantageous in heat exchanging performance, and capable of reducing the manufacturing and material costs, the weight of the heat exchanger, and improving the reliability.
    Type: Grant
    Filed: June 25, 1996
    Date of Patent: February 22, 2000
    Assignees: Actronics Kabushiki Kaisha, Hisateru Akachi
    Inventor: Hisateru Akachi
  • Patent number: 5737840
    Abstract: A tunnel-plate type heat pipe is manufactured out of a tube having capillary parallel tunnels defined by partitions through shaping both ends of the tube, forming recesses in the partitions in the vicinity of each end of the tube, closing both ends of the tube to form a capillary tunnel container, cleaning the capillary tunnel container, and charging the capillary tunnel container with a predetermined amount of working fluid.
    Type: Grant
    Filed: July 9, 1996
    Date of Patent: April 14, 1998
    Assignees: Actronics Kabushiki Kaisha, Hisateru Akachi
    Inventor: Hisateru Akachi
  • Patent number: 5697428
    Abstract: A heat pipe comprises an unit plate having one side formed with a groove which includes a plurality of straight portions arranged in parallel with each other and a plurality of turnings, and a flat plate disposed on the one side of the unit plate.
    Type: Grant
    Filed: December 2, 1994
    Date of Patent: December 16, 1997
    Assignees: Actronics Kabushiki Kaisha, Hisateru Akachi
    Inventor: Hisateru Akachi
  • Patent number: 5642775
    Abstract: A ribbon-like plate heat pipe comprises a ribbon-like plate having tunnels arranged parallel to each other and defined by partitions. The ribbon-like plate has both ends closed such that the tunnels are filled with melt metal up to a predetermined depth from each end of the ribbon-like plate upon welding or soldering. The partitions are alternately eliminated by a predetermined length in the vicinity of the ends of the ribbon-like plate so as to ensure communication of the tunnels with each other to form a serpentine container having a predetermined turns. The serpentine container is filled with a predetermined amount of working fluid.
    Type: Grant
    Filed: February 16, 1996
    Date of Patent: July 1, 1997
    Assignees: Actronics Kabushiki Kaisha, Hisetaru Akachi
    Inventor: Hisateru Akachi
  • Patent number: 5507092
    Abstract: A heat sink comprising a belt-shaped member arranged on a heat radiating side of a heat receiving plate and having one side having a plurality of script's l-shaped pinlike portions. The belt-shaped member includes a capillary heat pipe.
    Type: Grant
    Filed: June 6, 1995
    Date of Patent: April 16, 1996
    Assignees: Hisateru Akachi, Actronics Kabushiki Kaisha
    Inventor: Hisateru Akachi
  • Patent number: 5490558
    Abstract: A heat sink comprising a belt-shaped member arranged on a heat radiating side of a heat receiving plate and having one side having a plurality of script's l-shaped pinlike portions. The belt-shaped member includes a capillary heat pipe.
    Type: Grant
    Filed: June 4, 1993
    Date of Patent: February 13, 1996
    Assignee: Actronics Kabushiki Kaisha
    Inventor: Hisateru Akachi
  • Patent number: 5219020
    Abstract: A structure of a heat pipe applicable to a heat transportation device is disclosed in which an elongate metallic capillary tube is formed having an inner diaeter sufficiently small to enable movement of a bi-phase compressible working fluid having a predetrmined quantity and sealed into the metallic capillary container in a filled and closed state, a plurality of heat receiving portions and heat radiating portions being on predetermined parts of the elongate metallic tube and alternatingly arranged thereat. Both terminals of the metallic elongate capillary tube are heretically sealed thereat or hermetically connected to form a loop-type flow passage of the bi-phase compressible working fluid. In addition, no flow direction limiting mechanism such as check valves is essentially eliminated.
    Type: Grant
    Filed: August 15, 1991
    Date of Patent: June 15, 1993
    Assignee: Actronics Kabushiki Kaisha
    Inventor: Hisateru Akachi
  • Patent number: 4921041
    Abstract: A structure of a loop-type heat pipe is disclosed in which a heat carrying fluid, preferably a bi-phase non-condensative fluid, circulates in a loop form in itself under its own vapor pressure at a high speed within an elongate pipe so as to repeat vaporization and condensation, thus carrying out a heat transfer. A structure of the loop-type heat pipe includes the elongate pipe, both ends thereof being air-tightly interconnected to form a loop-type container, the heat carrying fluid, at least one heat receiving portion and at least one heat radiating portion, both being placed at given portions of a elongate pipe, and at least one check valve for limiting a stream direction of the heat carrying fluid.
    Type: Grant
    Filed: June 15, 1988
    Date of Patent: May 1, 1990
    Assignee: Actronics Kabushiki Kaisha
    Inventor: Hisateru Akachi