Patents Assigned to ACUTE, INC.
  • Method and apparatus for planarizing a semiconductor wafer
    Publication number: 20050260855
    Abstract: A method for planarizing a semiconductor wafer includes providing a fluid on a surface of the wafer, the fluid containing particles, and generating a field to apply a force to the particles, the force having a component that is normal to the surface such that the particles contact the surface to remove material therefrom. Alternative methods, semiconductor devices and semiconductor processing apparatuses are also disclosed.
    Type: Application
    Filed: April 26, 2005
    Publication date: November 24, 2005
    Applicant: ACUTE, INC.
    Inventor: David Watts