Abstract: An oven for bonding adhesives to the back surface of a textile article includes a housing with a transport frame for passing the textile article through a curing chamber within the housing. The oven also has an air source and a duct system that delivers an airflow into a cool zone on the opposite, pile surface side of the textile article. The airflow has a lower temperature than the elevated temperature of the curing chamber and is supplied to the cool zone in sufficient amounts such that the pressure in the cool zone exceeds the ambient pressure in the curing chamber.