Abstract: A surface inspection system and method is provided which detects defects such as particles or pits on the surface of a workpiece, such as a silicon wafer, and also distinguishes between pit defects and particle defects. The surface inspection system comprises an inspection station for receiving a workpiece and a scanner positioned and arranged to scan a surface of the workpiece at the inspection station. The scanner includes a light source arranged to project a beam of P-polarized light and a scanner positioned to scan the P-polarized light beam across the surface of the workpiece. The system further provides or detecting differences in the angular distribution of the light scattered from the workpiece and for distinguishing particle defects from pit defects based upon these differences.

Abstract: A surface inspection system and method is provided which detects defects such as particles or pits on the surface of a workpiece, such as a silicon wafer, and also distinguishes between pit defects and particle defects. The surface inspection system comprises an inspection station for receiving a workpiece and a scanner positioned and arranged to scan a surface of the workpiece at the inspection station. The scanner includes a light source arranged to project a beam of P-polarized light and a scanner positioned to scan the P-polarized light beam across the surface of the workpiece. The system further provides for detecting differences in the angular distribution of the light scattered from the workpiece and for distinguishing particle defects from pit defects based upon these differences.

Abstract: The present invention provides apparatus and methods for scanning a workpiece for defects with increased resolution and sensitivity relative to conventional workpiece inspection systems. Specifically, the apparatus and methods of the present invention repeatedly scan different portions of the workpiece with an optical beam that forms a scan region on the surface of the workpiece having in-scan and cross-scan dimensions. The in-scan dimension of the scan region is parallel to the direction with which the optical beam is scanned, and the cross-scan dimension is in a direction that is generally perpendicular to the direction in which the optical beam is scanned. The apparatus and methods of the present invention filter the signal reflected from the surface of the workpiece in the cross-scan direction using a cross-scan filter. As such, the method and apparatus of the present invention effectively remove a significant portion of the noise in the reflected signals used for detecting for defects in the workpiece.

Abstract: A surface inspection system and method is provided which detects defects such as particles or pits on the surface of a workpiece, such as a silicon wafer, and also distinguishes between pit defects and particle defects. The surface inspection system comprises an inspection station for receiving a workpiece and a scanner positioned and arranged to scan a surface of the workpiece at the inspection station. The scanner includes a light source arranged to project a beam of P-polarized light and a scanner positioned to scan the P-polarized light beam across the surface of the workpiece. The system further provides for detecting differences in the angular distribution of the light scattered from the workpiece and for distinguishing particle defects from pit defects based upon these differences.

Abstract: A surface inspection system and method is provided which detects defects such as particles or pits on the surface of a workpiece, such as a silicon wafer, and also distinguishes between pit defects and particle defects. The surface inspection system comprises an inspection station for receiving a workpiece and a scanner positioned and arranged to scan a surface of the workpiece at the inspection station. The scanner includes a light source arranged to project a beam of P-polarized light and a scanner positioned to scan the P-polarized light beam across the surface of the workpiece. The system further provides for detecting differences in the angular distribution of the light scattered from the workpiece and for distinguishing particle defects from pit defects based upon these differences.

Abstract: A surface inspection system and method is provided which detects defects such as particles or pits on the surface of a workpiece, such as a silicon wafer, and also distinguishes between pit defects and particle defects. The surface inspection system comprises an inspection station for receiving a workpiece and a scanner positioned and arranged to scan a surface of the workpiece at the inspection station. The scanner includes a light source arranged to project a beam of P-polarized light and a scanner positioned to scan the P-polarized light beam across the surface of the workpiece. The system further provides for detecting differences in the angular distribution of the light scattered from the workpiece and for distinguishing particle defects from pit defects based upon these differences.

Abstract: The composition of a particle occurring on the surface of a smooth substrate is identified by impinging the surface with a light beam having a strong P-polarized component at an oblique angle of incidence to the surface, and collecting light scattered from the surface at forward, center, and back locations relative to the portion of the surface impinged by the incident beam. The intensities of the light collected at these locations are measured by detectors and converted into signals, and the magnitudes of the signals are compared to correlations of particle material as a function of the relative magnitudes of the forward-, center-, and back-scatter signals so as to identify the material whose correlation most nearly matches the measured detector signals. Preferably, a ratio of the back detector signal magnitude to forward detector signal magnitude is correlated with particle material and back detector signal magnitude.

Abstract: A surface inspection system and method is provided which detects defects such as particles or pits on the surface of a workpiece, such as a silicon wafer, and also distinguishes between pit defects and particle defects. The surface inspection system comprises an inspection station for receiving a workpiece and a scanner positioned and arranged to scan a surface of the workpiece at the inspection station. The scanner includes a light source arranged to project a beam of P-polarized light and a scanner positioned to scan the P-polarized light beam across the surface of the workpiece. The system further provides for detecting differences in the angular distribution of the light scattered from the workpiece and for distinguishing particle defects from pit defects based upon these differences.

Abstract: In one aspect, the present invention provides an apparatus for transferring wafers to or from a wafer cassette having a plurality of wafer-receiving slots, wherein the apparatus comprises a wafer paddle which is adapted to be inserted into a wafer cassette alongside a wafer. Edge grippers carried by the wafer paddle releasible grip the wafer by its edges. A first capacitive sensor carried by the wafer paddle is oriented in a first direction for sensing information about a wafer in a wafer receiving slot of the wafer cassette. A second capacitive sensor carried by the wafer paddle is oriented in a direction perpendicular to the first direction for sensing additional proximity information about a wafer in a wafer receiving slot of the cassette. A transport mechanism produces movement of the wafer paddle along at least three axes of movement to permit transferring wafers to or from respective wafer receiving slots of the wafer cassette.

Abstract: A surface inspection system and methods of inspecting a surface of a workpiece are provided for detecting particles, defects, or other surface characteristics in or on a surface of the workpiece. The surface inspection system preferably has a transporter arranged for transporting a workpiece along a material path and a rotator associated with the transporter and arranged for rotating a workpiece during translational travel along the material path. A scanner is positioned and arranged for scanning a surface of a workpiece during rotational and translational travel along the material path. The scanner preferably includes a light source arranged to generate a light beam therefrom and a deflector positioned to receive the light beam and arranged for deflecting the light beam along a predetermined scan path across a surface of the workpiece as the workpiece rotationally and translationally travels along the material path.

Abstract: The calibration standard has artificial defects of a predetermined uniform size disposed on selected areas of a substrate. The artificial defects are randomly spaced within the selected area and of a sufficient density as to be visually discernable through a CRT display or other output device. The selected areas in which the artificial defects are disposed are formed by positioning a mask above the substrate. The open areas of the mask correspond to the selected areas on which the artificial defects are disposed. The form of these open areas may correspond to a character representing the predetermined size of the artificial defect. If this is the case, the operator can determine the size of the artificial defects on a substrate without reference to any external source.